TFBGA64 PACKAGE Search Results

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT962-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT962-3 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT746-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT962-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT1073-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

TFBGA64

Abstract: MO-195 sot746
Contextual Info: PDF: 2002 Jan 15 Philips Semiconductors Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.7 mm D SOT746-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E D C B A

SOT962-1

Contextual Info: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls B D SOT962-1 A ball A1 index area E A A2 A1 detail X e1 1/2 e e ∅v ∅w b H M M C C A B C y y1 C e G F E e2 D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 X 2.5 5 mm scale

SOT-543

Abstract: sot543
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm D SOT543-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B b e y y1 C ∅w M v M A K J e H G F e1 E D C B A

TFBGA64

Abstract: SOT543 MO-195 SOT-543
Contextual Info: PDF: 2000 Nov 21 Philips Semiconductors Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm D SOT543-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B b e y y1 C ∅w M v M A K J e H G F e1 E D C B A

TFBGA64

Abstract: MO-195 SOT-543
Contextual Info: PDF: 2002 Apr 11 Philips Semiconductors Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm D SOT543-1 A B ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C K J H e G F e2

Contextual Info: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm D SOT543-1 A B ball A1 index area A E A2 A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C K J H e G F e2 E 1/2 e D C B A ball A1 index area 1 2 3

TFBGA64

Abstract: SOT-543
Contextual Info: PDF: 1999 Jun 08 Philips Semiconductors Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm SOT543-1 D ball A1 index area A2 A E A1 detail X A b ∅w M y v A ZD e ZE K J H G e F E D C B A 1 2 3 4 5 6 7 8

Contextual Info: Package outline SOT1336-1 TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls A B D ball A1 index area A A2 E A1 detail X e1 C 1/2 e e Øv Øw b C A B C y1 C y H G e F E e2 D C 1/2 e B A 1 ball A1 index area 2 3 4 5 6 7 8 X 5 mm scale Dimensions mm are the original dimensions

Contextual Info: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.7 mm D SOT746-1 A B ball A1 index area E A A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11

Contextual Info: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls B D SOT962-3 A ball A1 index area E A A2 A1 detail X e1 1/2 e e ∅v ∅w b H M M C C A B C y y1 C e G F E e2 D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 X 2.5 5 mm scale

Contextual Info: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 4 x 4 x 0.8 mm A B D SOT969-1 ball A1 index area E A A2 A1 detail X e1 1/2 e ∅v ∅w b e C C A B C M M y y1 C H G F e E e2 D C 1/2 e B A ball A1 index area 1 2 3 4 5 6 7 8

ISP1763

Abstract: ISP1568 TFBGA128 USB Hub Controllers USB Controllers PXA255 ISP1583 PCIE interface SOT407-1 SOT923
Contextual Info: USB ControllerS Selection guide February 2009 www.stericsson.com USB controllers USB host controllers Features Evaluation kits Packages ISP1160/01 USB host controller for embedded applications • • • • • • •  ull-speed and low-speed data transfer

TFBGA64

Abstract: TDA19989BET SMD MARKING CODE 518 MARKING SMD CEC hdmi 1.4 RxSense ycbcr to dvi converter smd marking code 3D ITU656 TFBGA64 package tray
Contextual Info: Check out the NXP BETA site here! Home About NXP News Careers Select site: Investors Order/buy Tech support Contact English Search Type search here my.NXP Advanced search / Selection guides Products . HDMI HDMI transmitters TDA19989BET TDA19989BET Preview

ISP1763AHNUM

Abstract: ISP1763 isp1763a 1763A ISP1763AETTM TFBGA64 portable dvd player Universal Peripheral controller ISP1582 VFQFPN64
Contextual Info: ISP1763A Hi-Speed USB OTG controller Rev. 02 — 31 March 2010 Data brief 1. General description The ISP1763A is a single-chip Hi-Speed Universal Serial Bus USB On-The-Go (OTG) controller integrated with the advanced ST-Ericsson’s slave host controller and the

NXP PN544

Abstract: NXP PN544 user manual NXP PN544 NFC PN544 PN544 user manual nfc PN544 NXP NFC board pn544 HT80C51MX nxp pn544 antenna design PN544 NFC controller
Contextual Info: NXP NFC controller PN544 for mobile phones and portable equipment Industry-leading, 2nd- generation NFC controller This high-quality, high-performance NFC controller enables a new range of contactless applications for improved on-the-go experiences. It complies with all released NFC and ETSI/SCP SWP and HCI

STM32 F4 pwm

Abstract: STM32F100Cx STM32F100xx Flash programming manual
Contextual Info: STM32F100x4 STM32F100x6 STM32F100x8 STM32F100xB Low & medium-density value line, advanced ARM-based 32-bit MCU with 16 to 128 KB Flash, 12 timers, ADC, DAC & 8 comm interfaces Data brief Features • Core: ARM 32-bit Cortex -M3 CPU – 24 MHz maximum frequency,

STM32F100

Abstract: stm32f102 stm32f105 stm32 pwm STM32F100C4 stm32f100c8 STM32L151 stm32f103 spi dma STM32F100 family STM32 firmware library
Contextual Info: STM32 Value line STM32 STMicroelectronics 32-bit microcontrollers for greater choice in cost-sensitive applications www.st.com/mcu STM32 Value line The STM32 Value line complements our STM32 Cortex -M microcontroller product portfolio by offering a low-cost product line that is pin-to-pin compatible with the STM32 portfolio. It brings new features such as

Contextual Info: ISP1763A Hi-Speed USB OTG controller Rev. 04 — 23 September 2013 Data brief 1. General description The ISP1763A is a single-chip Hi-Speed Universal Serial Bus USB On-The-Go (OTG) controller integrated with the advanced slave host controller and the ISP1582 peripheral

isp1582

Abstract: ISP1582/ISP1583 ISP1583 TFBGA64 VQFN64 SOT969-1 softconnect ericsson "USB" peripheral
Contextual Info: ISP1582, ISP1583 SMALL-SIZE low-power Hi-Speed USB peripheral controllers Designed for portable Hi-Speed USB applications, with support for USB OTG peripheral-only features through OTG SRP ISP1582, ISP1583 conform to existing Device Class specifications and deliver Hi-Speed USB communications