TE85L F Search Results

TE85R

Abstract: TE85L
Contextual Info: 12. Packing M e th o d 12. Packing Method 12.1 List o f Packing Forms Sm all Su p e r M in i Type SSM Packing Form Tapine Spec.Marked Applicable Package Packing Dimensions (U nit:m m ) Packing U nit Appearance TE85L a , /SlQiSS i ( Emboss system TE85R (SSM)

Contextual Info: 3-Pin Thin Extreme Super Mini Package Embossed TE85L Tape for the TESM3 Package Tape Dimensions Unit: mm 2.0 ±0.05 φ1.5 ±0.1 0.18 4.0 ±0.1 Y X 1.5 φ0.5 8.0 3.5 ±0.05 1.75 Y X’ Y’ Y’ 0.51 Feed direction 1.5 X X’ Cross section X-X’ Reel Dimensions

Contextual Info: 8-Pin Progressive & Small Package Embossed TE85L Tape for the PS-8 Package Tape Dimensions 2.0 ±0.1 Y Y 3.5 ±0.05 φ1.1 ±0.1 X 0.2 ±0.05 3.1 +0.1 –0.0 4.0 ±0.1 8.0 ±0.2 φ1.5 1.75 ±0.1 Unit: mm X’ Y’ Y’ 4.0 ±0.1 0.95 ±0.1 Feed direction 3.1

BENT LEAD transistor TO-92 Outline Dimensions

Abstract: 2SC2712 equivalent 4TE12 diode ssc J Fet marking 2 AW 2SC2873 equivalent 90105 toshiba ultrasonic atomizing SMD TRANSISTOR MARKING 5c
Contextual Info: 5. PA C K A G E FO R M S 5.1 PACKAGE FORM SELECTION TABLE 5.1.1 SUPER-MINI DEVICES S-MINI (SC-59 , SMQ (SC-61), SMV, SM6) PACKAGING FORM PACKAGE SPECIFI­ CATION OUTLINE Pack PACKAGE UNIT - e TE85L Taping EXTERIOR Unit: mm » » » 3000 pcs/ Reel TE85R TE85N

1N4007TE85L

Contextual Info: 6-Pin Extreme Super Mini Package Embossed TE85L Tape for the ES6 Package Tape Dimensions Unit: mm 2.0 ±0.05 φ1.5 ±0.1 0.18 4.0 ±0.1 Y X 1.75 φ0.5 8.0 3.5 ±0.05 1.75 Y X’ Y’ Y’ 0.65 Feed direction 1.75 X X’ Cross section X-X’ Reel Dimensions

Contextual Info: Super Mini Quad Package Embossed TE85L Tape for the SMQ Package Tape Dimensions Unit: mm 2.0 ±0.05 φ1.5 ±0.1 0.25 4.0 ±0.1 Y 1.75 Y X 3.23 8.0 3.5 ±0.05 φ1.1 X’ Y’ Y’ 1.3 Feed direction 3.2 X Cross section Y-Y’ X’ Cross section X-X’ Package orientation

te85l

Abstract: TSM Package TOSHIBA Package
Contextual Info: 3-Pin Thin Super Mini Package Embossed TE85L Tape for the TSM Package Tape Dimensions Unit: mm 2.0 ±0.05 φ1.5 ±0.1 0.25 4.0 ±0.1 Y 1.75 Y X 3.1 8.0 3.5 ±0.05 φ1.1 X’ Y’ Y’ 0.9 Feed direction 3.15 X X’ Cross section X-X’ Reel Dimensions Cross section Y-Y’

Contextual Info: 5-Pin Ultra Super Mini Flat Package Embossed TE85L Tape for the UFV Package Tape Dimensions Unit: mm 0.18 2.0 ±0.05 4.0 ±0.05 φ1.5 ±0.1 Y 1.75 Y X 2.3 8.0 3.5 ±0.05 φ1.1 X’ Y’ Y’ 0.85 X X’ Cross section X-X’ Reel Dimensions Cross section Y-Y’

Contextual Info: 5-Pin Ultra Super Mini Package Embossed TE85L Tape for the USV Package Tape Dimensions Unit: mm 2.0 ±0.05 φ1.5 ±0.1 0.25 4.0 ±0.1 Y 1.75 Y X 2.3 8.0 3.5 ±0.05 φ1.1 X’ Y’ Y’ 1.2 Feed direction 2.2 X X’ Cross section X-X’ Reel Dimensions Cross section Y-Y’

Contextual Info: Ultra Super Mini Quad Package Embossed TE85L Tape for the USQ Package Tape Dimensions Unit: mm 2.0 ±0.05 φ1.5 ±0.1 0.25 4.0 ±0.1 Y 1.75 Y X 2.3 8.0 3.5 ±0.05 φ1.1 X’ Y’ Y’ 1.2 Feed direction 2.2 X X’ Cross section X-X’ Reel Dimensions Cross section Y-Y’

transistor SSOP6

Abstract: 2t1 transistor
Contextual Info: 6-Pin Ultra Super Mini Package Embossed TE85L Tape for the US6 Package Tape Dimensions Unit: mm 2.0 ±0.05 φ1.5 ±0.1 0.25 4.0 ±0.1 Y 2.3 φ1.1 8.0 3.5 ±0.05 1.75 Y X X’ Y’ Y’ 1.2 Feed direction Cross section Y-Y’ 2.2 X X’ Cross section X-X’

TE85L

Contextual Info: Ultra Super Mini Flat Package 3pin UFM パッケージ エンボス方式テーピング寸法 TE85L テープ形状および寸法 単位 : mm 2.0 ±0.05 φ1.5 ±0.1 0.2 4.0 ±0.1 Y X 2.3 3.5 ±0.05 φ1.1 8.0 1.75 Y X’ Y’ Y’ 0.85 テープ引き出し方向

toshiba tape and reel

Abstract: TOSHIBA ADDC TE85L addc te85l
Contextual Info: USV Tape Packing Specifications for 5-pin Ultra Super-Mini USV Package Scope This specification provides the packaging requirements for 5-pin Ultra Super Mini type transistors, FETs, diodes, L-MOS logics for use in automatic placement machines. 1. Product Naming System

3sk catalog

Abstract: TE85L Toshiba
Contextual Info: Semiconductor Catalog 2012-1 Radio-Frequency Semiconductors SEMICONDUCTOR & STORAGE PRODUCTS http://www.semicon.toshiba.co.jp/eng C O N T E N T S 1 Recommended Products by Application . 3 to 7 1.1 Cell Phones 1.2 TV Tuners 1.3 Low-Power Radios FRS/GMRS

SSM3K7002

Abstract: ESM 310 SSM3J16FU SSM3K03TE zener diode reference guide SSM5N03FE US6 KEC SSM5G01TU 6798 SSM3J13T
Contextual Info: S-MOS Series Small-Signal MOSFETs for Switching PRODUCT GUIDE S -MOS Family S-MOS Family Toshiba presents a range of small-signal MOSFET S-MOS devices which have been developed for various switching, interface and DC/DC converter applications. These MOSFETs have been classified into families according to application,

toshiba tape and reel

Abstract: 2SC4207Y te85r
Contextual Info: TOSHIBA TC7SET32F/FU TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC7SET32F, TC7SET32FU 2-INPUT OR GATE The TC7SET32 is an advanced high speed CMOS 2-INPUT OR GATE fabricated with silicon gate CMOS technology. It achieves the high speed operation similar to equivalent

TE85L paCKAGE

Abstract: TA76433FC Silicon Systems STORAGE PRODUCTS REFERENCE GUIDE
Contextual Info: TA76433FC TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA76433FC High-Precision Shunt Regulators with Adjustable Output Voltage Due to the increasing requirement for low power dissipation levels, 3-V power supply systems in electronic equipment are now

Contextual Info: TA76433FC TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA76433FC High-Precision Shunt Regulators with Adjustable Output Voltage Due to the increasing requirement for low power dissipation levels, 3-V power supply systems in electronic equipment are now

TE85R

Abstract: 2SC1627-YTPE2
Contextual Info: I. QUICK REFERENCE TABLE FOR TAPING 1. TO-92 DEVICE PACKING TAPING TYPE NO. DIMENSIONAL OUTLINE QTY. DIRECTION OF TAPE FEED TPE1 Li12.7u - 2,000PCS/ REEL ^ REEL DIRECTION OF TAPE FEED 2 TPER1 AMMO PACK 2. DIRECTION OF TAPE -4— DIRECTION OF — *- TAPE TPE2

Contextual Info: TA76433FC TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA76433FC High-Precision Shunt Regulators with Adjustable Output Voltage Due to the increasing requirement for low power dissipation levels, 3-V power supply systems in electronic equipment are now

ESM 740

Abstract: transistor SMD t04 51 D245A LM2804 transistor SMD t04 Solar Garden Light Controller 4 pin 2fu smd transistor transistor t04 smd pnp Octal Darlington Transistor Arrays DIP WB126
Contextual Info: 2004-3 PRODUCT GUIDE General-Purpose Surface-Mount Devices semiconductor 2004 http://www.semicon.toshiba.co.jp/eng Greeting from Toshiba Toshiba Corporation has developed and provided key devices such as information equipment and information appliance, employing the most advanced technology.

TA4029CTC

Abstract: TA4032FT TB7602TU MT4S300T MT4S300U MT4S301T TA4029TU SOT-24 MT4S300 RFM12U7X
Contextual Info: 製品カタログ 2011-1 東芝半導体 製品カタログ 高周波用半導体デバイス SEMICONDUCTOR h t t p : / / w w w . s e m i c o n . t o s h i b a . c o . j p / C O N T E N T S 1 アプリケーション別推奨製品 .3~8

TE85L PACKING TE85

Abstract: Reel Taping Specification JEDEC toshiba tape and reel 2SK851 toshiba packing naming 2SK405 equivalent 2SK1529 LT 5212 2sk1529/2sj200 equivalent 2SJ200 equivalent
Contextual Info: TO SHIBA Quick Reference I. Quick Reference Table for Taping 1. TO-92 Device PACKING TAPING TYPE NO. REEL TPE1 DIMENSIONAL OUTLINE d ir e c t io n of tape feed QTY. 2.000PCS/ REEL 1 2 .7 AMMO PACK 2. TPER1 D IR E C T IO N OF TAPE FEED TPE2 D IR E C T IO N OF

Contextual Info: TO SH IBA TC7WH08FU/FK TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC7WH08FU, TC7WH08FK DUAL 2-INPUT AND GATE The TC7WH08 is an advanced high speed CMOS 2-INPUT AND GATE fabricated with silicon gate CMOS technology. It achieves the high speed operation similar to equivalent