TDK TH SERIES Search Results

HEXALATOR

Abstract: CU311A tdk Isolators CU312A TO200200 CU331A
Contextual Info: M icrowave com ponents Microwave Components Circulators/isolators HEXALATORS Circulators 0.1 to 1GHz CU series CU SERIES HEXALATOR TDK H e xa la tors is th a t th e y can be tuned to any d e sire d frequency within the specified band by connecting a simple

smd 3ft

Abstract: sta 512 smd CCK
Contextual Info: ? CONVERTERS DC to DC TDK o ffers a w ide ra n g e o f low p ro file, com pact, ligh tw eigh t DC/DC con verters th a t p ro vid e sta n d a rd ized regu lated voltages w ith high efficiency. The high g ra d e m agnetic m aterial and design technology enables TDK to m eet m arket requirem ents f o r com puters, p erip h era ls,

CC-3802

Abstract: CC-3851 CC-3801 777t CC-3852 CC-3853 TDK CC-3801
Contextual Info: TDK DC to DC Converters, DC to AC Inverters 250mW T D K CORP . $ 40E m ô ô2154fl oooqcjc^ fl B T1>KA t . s v -h C C S E R IES D C TO DC C O N V E R T E R S M T T F O F 2 M IL L IO N H O U R S Th e C C series developed to provide - 5 , - 1 2 , - 1 5 , +12, +15Vdc voltage conversion from 5Vdc lines.

MEA8020

Abstract: ACB1608 EPC17 BOBBIN ZCYS51R5-M3PA TCXO 9.9 MHZ CST063 QVC10 NLU160805 tdk Isolators ACL2520
Contextual Info: SM Components at a Glance Product name Type or Series Part No. Multilayer Ceramic Chip Capacitors C1005 [EIA CC0402] W T 1 0.5 0.55 max. Class I 0.5 to 330pF Class II 220 to 100000pF 1.6 0.8 0.9 max. Class I 0.5 to 1000pF Class II 220pF to 1jiF 2 1.25 1.45 max.

12.0.12 300mA transformer

Abstract: transformer 220 to 12-0-12 SMPT0706 12-0-12 1A transformer EPC17 BOBBIN power transformer 12012 slf7745 NLL4532 zo 107 tdk mlf3216
Contextual Info: SM Components at a Glance Product name Multilayer Ceramic Chip Capacitor Type or Series Part No. Dimensions (mm) [inches] Shape W T 1 [.039] 0.5 [.020] 0.5 [.020] Class I 0.5 to 330pF Class II 220 to 33000pF 1.6 [.063] 0.8 [.031] 0.8 [.031] Class I 0.5 to 1000pF

ic tdk 2030

Abstract: CB30-0805 CB-30 CB-50 CB30-1206 TR 0431 CB50 TDK
Contextual Info: CHIP FERRITE FERRITE CHIP BEADS EMI Suppression Chip Bead CB SERIES T h e C B s e r i e s i s a b ig b d e n s i t y f e r r i t e c h i p E M I s u p p r e s s i o n d e v i c e U s u a lly t h e s e d e v ic e s a r r u s e d a s a s o lu t io n t o p r e v e n t E M I b e t w e e n e le c tr o n ic c ir c u its .

Contextual Info: D e la y lines I LC M o d u le s A c tiv e ACTIVE DELAY LINES Built-in TTL ADL series FEATURES MAXIMUM RATINGS • W aveform shaping circu its are not necessary fo r the built-in P o w e r s u p p ly v o lta g e V c c 7V In p u t v o lta g e Vi - 0 . 5 to + 5 .5 V

Contextual Info: 13 Motors/Actuators Sensors Plungers PLUNGERS MA series These miniature magnetic plungers are driven by a small current, thus making them widely used in mechanical drive parts for precision equipment such as still cameras and stereo head sets. ON TYPE OFF TYPE

400 Faraday

Abstract: faraday rotation 3A15
Contextual Info: 1/2 001-04 / 20010911 / e7c1_bfg.fm Optical Components BFG Series For Optical Isolator Faraday Rotators OUTLINE TDK Faraday rotators are based on Bi-substituted rare-earth iron garnet thick-film single crystal technology. The crystals are grown using the LPE(Liquid Phase Epitaxy)method. These devices

garnet

Abstract: Isolator TDK sa40d
Contextual Info: 1/2 001-04 / 20010913 / e7c1_bfg.fm Optical Components BFG Series For Optical Isolator Faraday Rotators OUTLINE TDK Faraday rotators are based on Bi-substituted rare-earth iron garnet thick-film single crystal technology. The crystals are grown using the LPE(Liquid Phase Epitaxy)method. These devices

YHP4284A

Abstract: MIL-C-15305E ACL3225S-102 ACL2520
Contextual Info: Ferrite Chip Inductors Magnetic Shielded ACL Series FEATURES • ACL series of wire wound chip inductors allow for high density mounting capability due to the magnetic shield • Available of high inductance values despite the same size. • Small DC resistance gives high Q values.

TDK TH SERIES

Abstract: tdk vco VCO 1.5G MHD1010DDC MHD1510
Contextual Info: Multilayer Hybrid Circuit Devices MHD Series FEATURES • The world-first single chip “function 1C block” which is produced by integrating inductors, transformers, capacitors into a single monolithic structure by sintering. In addition, thick film resistors, transistors and

pumps

Abstract: TDK TH SERIES
Contextual Info: 13 M otors/Actuators j Pumps Pumps PUMPS LP70 series Th ese are sm all liq u id pum ps w h ich e m p lo y an e ffe c tiv e a rra n g e m e n t o f ra re -e a rth m a g n e ts and s p e c ia l m a g n e t movement patent pending . FEATURES • Very efficient micro-pumps using new magnetic circuit (based

SFM0520T

Abstract: SFM 27 SF-M1010T MAX1540 SFM SERIES SF-MR820T SFM tdk
Contextual Info: TDK Line Chokes 1A to 6QA SURFACE MOUNT TYPE SF COILS, SF-M SERIES TDK SF-M series prevents EMI in the 5 voltpower supply lines of digital systems. In response to market demands for smaller, lighter, and more highly integrated electronic devices, TDK has incorporated its

RIO 1R5

Abstract: RIO+1R5
Contextual Info: Filters LC M odules LCR M o d u le LEADLESS TRAPS NLT series FEATURES SPECIFICATIONS • Trap frequency tolerance of ±2%. O p e r a tin g te m p e ra tu r e ra n g e - 1 0 to + 6 0 ° C • Tem perature stability of ±1% relative to the 20°C value, over the

4060D

Abstract: 4-060-D 4300D
Contextual Info: Ferrite Chip EMI Suppressor Arrays ACA Series FEATURES • Availing EMI suppression in 4 or 6 lines by one chip. Highly effective in designing a higher density circuit. •The terminal pitch is 0.8mm or 1,27mm, which makes it suitable for EMI prevention in multiple lines, such as

C5750X7S2A106M

Abstract: MLCC CRACK tdk c3216 250V X7T voltage c4532x7t2e105m C3216X7S2A225M X7T 630V C3216 TDK TH SERIES C5750
Contextual Info: C Series Soft Termination Type Type: C2012 [EIA CC0805] C3216 [EIA CC1206] C3225 [EIA CC1210] C4532 [EIA CC1812] C5750 [EIA CC2220] Issue date: April 2011 TDK MLCC US Catalog Version B11 REMINDERS Please read before using this product SAFETY REMINDERS REMINDERS

marking LLA

Contextual Info: 1 Filters For Mobile Com m unication ICR CERAMIC CHIP DUPLEXERS For cordless phone HHM series HHM0140 TYPE FEATURES • HHM series are the m u ltila ye r sub stra te type chip du plexers • Due to EMI shield effects of th is low im pedance G ND layer, it

tdk marking code

Abstract: ON MARKING R59 SLF7032T220M SLF7032T-470M SLF10145T331MR54 SLF10145T SLF10145T-470M1R4 SLF12565T-150M4R2 slf12565t470m2
Contextual Info: Leadless Inductors Large Current SLF Series FEATURES CHARACTERISTICS • Low-profile SMD type. •The magnetic shielded type is suitable for stable and high density mounting. • Only reflow soldering is applicable. • Provide with embossed carrier tape packaging for

c2012 TDK ceramic capacitor

Abstract: tdk capacitors Y5V C3216 c2012 tdk Y5V CAPACITOR TDK
Contextual Info: Multilayer Ceramic Chip Capacitors C Series TYPICAL ELECTRICAL CHARACTERISTICS CAPACITANCE AGEINGS Place at 150°C for 1 hour anc measure th e initial V a u e ¿u mir uiet= lai er c 0G, C0H I X 7R Yiì\Tt ~ 100 1000 10000 Time Hours CAPACITANCE TEMPERATURE CHARACTERISTICS

TR4172

Abstract: temperature german 1000 - RO - 2R - 0 1 3 pin smd 24c Ci 2035 2R103
Contextual Info: SMD Type DC/DC Converters EPH SERIES SHINDENGEN ELECTRIC MFG. CO., LTD. • C o n ten ts ■ Features—1 ■ EPH Selection C hart—1 ■ General Specifications—2 ■ Electrical Specifications—2 ■ Environmental Characteristics—2 ■ Electrical Specifications—3

zjys-2

Abstract: ZJY-M4A tdk zjys-2 ZJY-4P tdk 2jys zjy-2p TDK ZJYS-4 zjy 2b tdk zjy TDK ZJYS2
Contextual Info: FILTERS EMI ZJY/ZJYS SERIES The ZJY/2JYS series are common m ode chokes th a t have an in tern a lferrite to rro id a l core construction. These are available in tw o and f o u r line packages. Advantages Packaging Isolation Between Coils See Product Summary page 81

Contextual Info: F ilte rs For Mobile Communication E M 1 /E M C L C R filt e r MULTILAYER CHIP EMI FILTERS For cellular and cordless phone MEM series FEATURES • T h e se T -sh a p e d EMI filte rs are d e sig n e d w ith a m o n o lith ic closed magnetic circuit consisting of two inductor elem ents and

tdk vco

Abstract: QVC10
Contextual Info: I O s c illa to rs /R e s o n a to rs I For M obile C o m m u n ica tio n VCOs MULTILAYER CERAMIC CHIP VCOs 0.8 to 1.9GHz for cellular and cordless phone QVC series FEATURES • QVC10 series, multilayer ceramic chip VCO have high C/N • By using TDK’s ceramic multilayer technology, Q value of 200