TDF 2011 Search Results
TDF 2011 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| 87520-1112APLF | Amphenol Communications Solutions | USB 2.0, Input Output Connector, USB Type A, Standard, Right Angle, Through Hole, Single Decks, 4 Positions | |||
| G832MC011201122HR | Amphenol Communications Solutions | 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 3.7 mm, 120 Positions, Dual Row, BTB Vertical Receptacle SMT, 15u\\ Gold Black. | |||
| 74978-202011LF | Amphenol Communications Solutions | Metral® High Speed 2000 Series, Backplane Connectors, Header, Vertical Signal, 8 Row, Press-Fit, 96 Position, Select Load, Extended | |||
| 73983-2011LF | Amphenol Communications Solutions | Metral®, Backplane connectors, 1000 Series Header, Vertical Signal, 5 Row, Press-Fit, 30 Position, Special Load, Standard | |||
| U77C11182011 | Amphenol Communications Solutions | SFP CAGE W LP |
TDF 2011 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: HI-3000, HI-3001, HI-3002 1Mbps Avionics CAN Transceiver with Low Power Standby Mode February 2011 PIN CONFIGURATIONS Top Views GENERAL DESCRIPTION TXD - 1 The HI-3000 is a 1 Mbps Controller Area Network (CAN) transceiver optimized for use in aerospace applications. |
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hi-3000hi-3001hi-3002hi-3000psi+3 | |
circuit diagram of o general split acContextual Info: HI-5000, HI-5001, HI-5002 1Mbps CAN Transceiver with Low Power Standby Mode April 2011 PIN CONFIGURATIONS Top Views GENERAL DESCRIPTION TXD - 1 The HI-5000 is a 1 Mbps Controller Area Network (CAN) transceiver. It interfaces between a CAN protocol controller and the physical wires of the bus in a CAN network. |
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hi-5000hi-5001hi-5002hi-5000psi+2 | |
HI-3001
Abstract: circuit diagram of o general split ac HI-3002 HI-3001PST HI-3000 ISO 11898-5
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Original |
hi-3000hi-3001hi-3002hi-3000psi+7 | |
ds3000
Abstract: HI-3002 circuit diagram of o general split ac ISO 11898-5 SS 3002
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hi-3000hi-3001hi-3002hi-3000psi+7 | |
ISO 11898-5
Abstract: circuit diagram of o general split ac
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Original |
hi-5000hi-5001hi-5002381min+2 | |
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Contextual Info: 19-6130; Rev 11/11 DS1500 Y2K Watchdog RTC with Nonvolatile Control GENERAL DESCRIPTION FEATURES The DS1500 is a full-function, year 2000-compliant real-time clock/calendar RTC with an alarm, watchdog timer, power-on reset, battery monitors, 256 bytes of on-board nonvolatile (NV) SRAM, NV |
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ds15002000-compliant768khz24-hour | |
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Contextual Info: 19-6130; Rev 11/11 DS1500 Y2K Watchdog RTC with Nonvolatile Control GENERAL DESCRIPTION FEATURES The DS1500 is a full-function, year 2000-compliant real-time clock/calendar RTC with an alarm, watchdog timer, power-on reset, battery monitors, 256 bytes of on-board nonvolatile (NV) SRAM, NV |
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ds15002000-compliant768khz24-hour | |
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Contextual Info: WMF2M8-XXX5 2Mx8 MONOLITHIC NOR FLASH, SMD 5962-97609 FEATURES Low Power CMOS Data# Polling and Toggle Bit feature for detection of program or erase cycle completion. Access Times of 90, 120, 150ns Packaging: • 56 lead, Hermetic Ceramic, 0.520" CSOP Package 207 . |
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150ns64kbytes | |
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Contextual Info: WF128K32-XXX5 128KX32 5V NOR FLASH MODULE, SMD 5962-94716 FEATURES Access Times of 50*, 60, 70, 90, 120, 150ns Low Power CMOS, 1mA Standby Typical Packaging: Embedded Erase and Program Algorithms TTL Compatible Inputs and CMOS Outputs |
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wf128k32-xxx5128kx32150ns16kbytes | |
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Contextual Info: WF1M32B-XXX3 1Mx32 3.3V NOR FLASH MODULE FEATURES Access Times of 100, 120, 150ns Low Power CMOS, 1.0mA Standby Packaging Embedded Erase and Program Algorithms Built-in Decoupling Caps for Low Noise Operation • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP |
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wf1m32b-xxx31mx32150ns16kbyte+2 | |
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Contextual Info: FTE512S8N 4 Megabit CMOS EEPROM DESCRIPTION: The FTE512S8N is a 512K X 8 high-density, low-power EEPROM module comprised of four ceramic 128K X 8 monolithic EEPROM’s, an advanced high-speed CMOS decoder and decoupling capacitors surface mounted on a co-fired ceramic substrate |
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fte512s8n600-mil-wide32-pin250ns | |
Memory
Abstract: FTE512S8N
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fte512s8n600-mil-wide32-pin250ns+1 | |
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Contextual Info: WF1M32B-XXX3 1Mx32 3.3V NOR FLASH MODULE FEATURES Access Times of 100, 120, 150ns Low Power CMOS Packaging Embedded Erase and Program Algorithms Built-in Decoupling Caps for Low Noise Operation • 66 pin, PGA Type H , 1.185" square, Hermetic Ceramic |
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wf1m32b-xxx31mx32150ns16kbyte+4 | |
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Contextual Info: WSF128K32-XH2X PRELIMINARY* 128KX32 SRAM/FLASH MODULE FEATURES FLASH MEMORY FEATURES Access Times of 25ns SRAM and 70, 90 and 120ns (FLASH) 10,000 Erase/Program Cycles Sector Architecture Packaging: • 8 equal size sectors of 16K bytes each |
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wsf128k32-xh2x128kx32120ns66-pin | |
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mx29ga257
Abstract: MX29GA257EHXCI-90Q MX29GA SEC555 MX29GA128E SA135 MX29GA129E MX29GA256ELXCI-90Q mx29ga257ehxci addr55
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mx29ga256/257emx29ga128/129emx29gapm1484+12 | |
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Contextual Info: WF1M32B-XXX3 1Mx32 3.3V NOR FLASH MODULE FEATURES Access Times of 100, 120, 150ns Low Power CMOS Packaging Embedded Erase and Program Algorithms Built-in Decoupling Caps for Low Noise Operation • 66 pin, PGA Type H , 1.185" square, Hermetic Ceramic |
Original |
wf1m32b-xxx31mx32150ns16kbyte+2 | |
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Contextual Info: WMF128K8-XXX5 128Kx8 MONOLITHIC NOR FLASH, SMD 5962-96690 FEATURES Access Times of 50*, 60, 70, 90, 120, 150ns Organized as 128Kx8 Packaging Commercial, Industrial and Military Temperature Ranges • 32 lead, Hermetic Ceramic, 0.400" SOJ Package 101 |
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wmf128k8-xxx5128kx8150ns16kbytes | |
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Contextual Info: WF4M32-XXX5 4Mx32 5V NOR FLASH MODULE FEATURES Access Times of 100, 120, 150ns 5 Volt Read and Write Packaging: Low Power CMOS • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . Data# Polling and Toggle Bit feature for detection of |
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wf4m32-xxx54mx32150ns990cqfj | |
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Contextual Info: WSF512K16-XXX 512KX16 SRAM/FLASH MODULE, SMD 5962-96901 FEATURES FLASH MEMORY FEATURES Access Times of 35ns SRAM and 90ns (FLASH) 100,000 Erase/Program Cycles Access Times of 70ns (SRAM) and 120ns (FLASH) Sector Architecture Packaging |
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wsf512k16-xxx512kx16120ns | |
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Contextual Info: WSF2816-39XX 128Kx16 SRAM/512Kx16 FLASH MODULE Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation FEATURES Access Times of 35ns SRAM and 90ns (FLASH) Weight: Packaging • WSF2816-39G2UX - 8 grams typical |
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wsf2816-39xx128kx16sram/512kx16wsf2816-39g2ux+2 | |
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Contextual Info: UM10460 Low-cost 4 W mains LED driver for the Japanese market using the TEA1523 Rev. 1 — 16 June 2011 User manual Document information Info Content Keywords TEA1523, SSL, low-cost, LED driver, AC/DC conversion, buck converter, driver, mains supply, user manual |
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um10460tea1523 | |
carli capacitor
Abstract: carli mpx
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febfl7732l25u008bfl7732carli capacitor+1 | |
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Contextual Info: WF4M32-XXX5 4Mx32 5V NOR FLASH MODULE FEATURES Access Times of 100, 120, 150ns 5 Volt Read and Write Packaging: Low Power CMOS • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . Data# Polling and Toggle Bit feature for detection of |
Original |
wf4m32-xxx54mx32150ns990cqfj+2 | |
SP338E
Abstract: SP339E SP338 RS-422 Transceiver SP338EER1
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Original |
sp338ers-232/rs-485/rs-422sp338rs-232+6 | |