TCR50 Search Results

TCR1000

Abstract: TCR500 TCR500-PCI
Contextual Info: Install Guide – TCR500-PCI New Installations 1. Verify your package contents o TCR500-PCI Time Code Reader PCI card o TCR Installation & Software CD CD Contents: Masterclock, Inc. provides the following on the Installation & Software CD, which ships with the TCR card.

TCR50

Abstract: 100-511K Resistance color bands RN41 size 0204
Contextual Info: RESISTORS MELF TYPE 1 2 3 4 5 6 RESISTORS STRUCTURE RN41 METAL FILM • JUMPER RN41 • CC Protective coating Trimming cut Ceramic rod Cap iron solder plated Metal film Marking STRUCTURE CC IDENTIFICATION TYPE Contact our sales representatives before you use our products for applications including

LOW RESISTANCE RESISTOR TLR

Abstract: TLR3AW
Contextual Info: LOW Ohm Metal plate Current Sensing Milliohm Chip TLR ⑤ STRUCTURE L 1 2 3 4 5 W ② ④ t Low Ohm d ① d ③ Protective bottom coating Electrode Resistive Element Solder Protective top coating 3A, 3AW (1mΩ only IDENTIFICATION PRODUCT CODE COATING TLR3AD,

MCS 0402 VG01

Contextual Info: MCS 0402 VG01, MCT 0603 VG01, MCU 0805 VG01, MCA 1206 VG01 Vishay Beyschlag 具有公认可靠性的薄膜晶片电阻器 Thin Film Chip Resistors with Established Reliability 特点 • • • • • • • MCS 0402 VG01 MCT 0603 VG01、 MCU 0805 VG01 和

TCR15

Contextual Info: RESISTORS TECHNOLOGY OF TOMORROW METAL FILM • JUMPER RN41 • CC STRUCTURE RN41 1 2 3 4 5 6 IDENTIFICATION TYPE RN41 2DS RN41 2A RN41 2ES RN41 2E RN41 2H RN41 3AS CC10M CC10 • CC12 CC12M • CC25 CC25M Specifications given herein may be changed at any time without prior notice.

Contextual Info: RESISTORS TECHNOLOGY OF TOMORROW METAL FILM • JUMPER RN41 • CC STRUCTURE RN41 1 2 3 4 5 6 IDENTIFICATION TYPE RN41 2DS RN41 2A RN41 2ES RN41 2E RN41 2H RN41 3AS CC10M CC10 • CC12 CC12M • CC25 CC25M Specifications given herein may be changed at any time without prior notice.

WALSIN 0603 resistor

Abstract: WALSIN 0603 ISO 9001 Sony WALSIN resistor WALSIN resistor 1206 walsin 0603 wr Array chip resistors size 8 0402 TCR50ppm WALSIN WR SERIES SAMSUNG 0805 thick film resistor
Contextual Info: PSi Milestones of a ssive PSA , rsrtM l u a h c ì mis« Incorporation of Walsin Tech Listed on TASDAQ Asian's Best Buy by Asia Weekly Strategic Alliances in Europe,Korea and Japan Listed on TSE - 2492.TW Mass Production China (DL) Plant HEADQUARTERS Taiwan-Yang-Mei

WR12W

Abstract: RM1A48D50 WA04X WF12P WW06P WF06Q WR04X WR25X 16p8r 0603 chip-R 100ohm
Contextual Info: INDEX w w w. p a s s i v e c o m p o n e n t . c o m Subject Page How to Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Chip Resistors Selection Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2~3

EN 60286-3

Abstract: 27M4 500R TCR50 CZ-56301 marking CDF cra 0805 CMF0805 cmf1206 cdf 1206
Contextual Info: Lead free since1994 RoHS Pb We about us The microtech GmbH electronic, a midrange firm, was founded in october 1990 placed in Teltow, near the southern border of Berlin. Our business field is the development, production and distribution of SMD-Chip Resistors, -Networks and Temperature sensors.

JEDEC 2a

Contextual Info: Datasheet CBW-Series Bondable Chip Resistors, non-magnetic Sizes: 0402, 0603, 0805, 1206 Features: •      Chip Resistors in thick film technology AgPd termination for flip chip assembly face-down; for conductive epoxy assembly or Gold termination for wire bonding (US/TC; face-up) as well as flip chip

CC10M

Contextual Info: RN41 • CC - MELF METAL FILM RESISTORS • JUMPERS TECHNOLOGY OF TOMORROW MELF TYPE METAL FILM • JUMPER RN41 • CC STRUCTURE RN41 1 2 3 4 5 6 IDENTIFICATION RN41 2DS RN41 2A RN41 2ES RN41 2E RN41 2H RN41 3AS CC10M CC10 • CC12 CC12M • CC25 CC25M STRUCTURE CC

8P4R 0805

Abstract: WR18X WW12P WW18X WF12P WW08X WF06U
Contextual Info: INDEX w w w. p a s s i v e c o m p o n e n t . c o m Subject Page How to Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Chip Resistors Selection Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2~3

RN41

Abstract: MELF 0207 TCR50 100-511K
Contextual Info: RESISTORS MELF TYPE 1 2 3 4 5 6 RESISTORS STRUCTURE RN41 METAL FILM • JUMPER RN41 • CC Protective coating Trimming cut Ceramic core Cap iron solder plated Metal film Marking STRUCTURE CC IDENTIFICATION TYPE Contact our sales representatives before you use our products for applications including

Contextual Info: CBW-Series Bondable Chip Resistors, non-magnetic Sizes: 0402, 0603, 0805, 1206 Features: • • • • • • Chip Resistors in thick film technology AgPd termination for face-down assembly flip chip; for conductive epoxy assembly or Gold termination for face-up assembly (wire bondable US/TC)

hep 154 silicon diode

Abstract: zy 406 transistor motorola HEP 801 hep 154 diode hep R1751 triac zd 607 2sb337 RS5743.3 F82Z hep 230 pnp
Contextual Info: SEMICONDUCTOR This guide has been prepared by the Motorola HEP technical staff to provide a cross-reference for the Hobbyist, Experimenter, and Profes­ sional service technician. The information contained herein is based on an analysis of the published specifications of each device listed. This

WR08X

Abstract: WW18X wr06x WT04X WR20X WR12X
Contextual Info: Walsin Technology Corporation WUSN h t t p ://w w w .p a s s iv e c o m p o n e n t .c o m Thick Film Chip Resistors & Arrays Quick Reference Data • General purpose Chip-R Type Series No. Size Power rating at 70°C WR12X WR12A 1206 3216 1/4W General purpose

Contextual Info: CBR Series High Temperature Bondable Thick Film Chip Resistors • • • • • • • • Resistances from 10Ohms to 1TOhms AgPd Termination for face-down assembly Gold Termination for face-up assembly Power Rating 0.05 to 0.25Watt Resistance Tolerances to ± 5%

IN2222A

Abstract: transitron catalog TCR43 TM106 IN443 1n9448 sv4091 IN4868 diode 3N68 IN536
Contextual Info: ron Tro nsitron electronic corporation e I ron 168 Albion Street . Wakefield. Massachusetts 01881 WAKEFIELD, MASSACHUSE TTS BOSTON, MASSACHUSETTS MELROSE, MASSACHUSETTS NUEVO LAREDO, MEXICO BERKSHIRE, ENGLAND PARIS, FRANCE AMSTERDAM, THE NETHERLANDS ~ ciectl'onic corpOI'atioll

TLR3AW

Abstract: TLR2HD TLR3AD 5L00 TCR50 TCR75
Contextual Info: LOW Ohm Metal plate Current Sensing Milliohm Chip TLR STRUCTURE Low Ohm 1 2 3 4 5 Bottom protective coating: Epoxy resin see "Identification" Resistive element: Metal alloy Solder electrode Marking (see "Identification") Top protective coating (see "Identification")

MC1468705

Abstract: 10002 motorola BR52 MC1468 MC146805F2 00FF M6805 MC146805 programming the mc1468705F2
Contextual Info: MOTOROLA BR527/D SEMICONDUCTOR TECHNICAL DATA MC146805F2 Technical Summary 8-Bit Microcomputer Unit The MC146805F2 CMOS Microcomputer Unit (MCU) is a member of the MC146805 Family of microcomputers. This low cost and low power MCU has parallel I/O capability with pins programm­

MELF-0204

Abstract: melf diodes color code RN41 TCR50 100-511K MELF 0207 code marking TI 9A marking code E96
Contextual Info: RESISTORS METAL FILM • JUMPER RN41 • CC STRUCTURE RN41 IDENTIFICATION TYPE RN41 2DS RN41 2A RN41 2ES RN41 2E RN41 2H RN41 3AS CC10M CC10 • CC12 CC12M • CC25 CC25M Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

TCR500

Abstract: SiCr wire bond 60k4
Contextual Info: PMC Passive Micro Components OVERVIEW PMC thin-film technology offers comprehensive materials and processes combinations allowing electronic designers superior space saving, tolerance and signal integrity for semi custom designs in the MHz to GHz spectrum.

code marking TI 9A

Abstract: cc12m
Contextual Info: RN41 • CC - MELF METAL FILM RESISTORS • JUMPERS TECHNOLOGY OF TOMORROW MELF TYPE METAL FILM • JUMPER RN41 • CC STRUCTURE RN41 1 2 3 4 5 6 IDENTIFICATION RN41 2DS RN41 2A RN41 2ES RN41 2E RN41 2H RN41 3AS CC10M CC10 • CC12 CC12M • CC25 CC25M STRUCTURE CC

Contextual Info: MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Precision Vishay Beyschlag 高精度薄膜引线电阻 Precision Thin Film Leaded Resistors 特性 • • • • • • • • • 通过 EN 140101-806 认证 先进的薄膜技术 低 TCR：± 15ppm/K 至± 25ppm/K