TANAKA MATERIAL SAFETY Search Results
TANAKA MATERIAL SAFETY Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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DE6B3KJ101KA4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6B3KJ331KB4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6E3KJ102MN4A | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6E3KJ472MA4B | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6B3KJ331KA4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive |
TANAKA MATERIAL SAFETY Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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MURATA NFM
Abstract: AEI cable audio amplifiers small signal audio FET murata chip suppression filter AUDIO AMPLIFIER tanaka material safety common mode power line dc filter for emi suppression DLW5BTN501SQ2 Transistor audio power amplifier application
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tanaka gold wire 1.0 mil
Abstract: tanaka wire DM6030HK tanaka epoxy CMM-5-BD-000X TS3332LD Mimix Broadband tanaka au wire tanaka material safety tanaka bonding wire
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15-Jan-07 39x40 CMM-5-BD-000X tanaka gold wire 1.0 mil tanaka wire DM6030HK tanaka epoxy CMM-5-BD-000X TS3332LD Mimix Broadband tanaka au wire tanaka material safety tanaka bonding wire | |
tanaka bonding wireContextual Info: 2.0-6.0 GHz GaAs MMIC Amplifier CMM-5-BD January 2007 - Rev 15-Jan-07 Features Chip Diagram High Gain: 16.5 dB 18 dBm P1dB Small Size: 39x40 mils Directly Cascadable Self-Biased Single Power Supply General Description Mimix Broadband's CMM-5 is a 2 to 6 GHz GaAs MMIC |
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15-Jan-07 39x40 CMM-5-BD-000X tanaka bonding wire | |
ROHM resistor
Abstract: MCR03 TSZ22111-03 TSZ22111-04 09001F
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MCR03 MAY/14/2003 MCR03N-IA TSZ22111-03 ET-7200A 000pcs TSZ22111-04 ROHM resistor 09001F | |
Contextual Info: 34.5-38.0 GHz GaAs MMIC Power Amplifier P1056-BD Mar 2009 - Rev 04-Mar-09 Features Chip Device Layout High Efficiency Power Amplifier >35% PAE 13 dB Small Signal Gain +25.0 dBm P1dB Compression Point +26.0 dBm Saturated Output Power 100% On-Wafer DC, RF and Output Power Testing |
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P1056-BD 04-Mar-09 MIL-STD-883 XP1056-BD-EV1 XP1056-BD | |
corrugated carton
Abstract: NA19020 FLC-13 FLCV-13 7 pin Inverter PWB ccfl Fujitsu inverter flcv-08 tanaka material safety data sheet inverter 4v to 12v SM02 lcd inverter ccfl transformer
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FLC-13 FLCV-13] P6015A FLCV-13 LCD-00105 corrugated carton NA19020 FLC-13 FLCV-13 7 pin Inverter PWB ccfl Fujitsu inverter flcv-08 tanaka material safety data sheet inverter 4v to 12v SM02 lcd inverter ccfl transformer | |
Contextual Info: 7.0-14.0 GHz GaAs MMIC Low Noise Amplifier L1018-BD May 2010 - Rev 11-May-10 Features Self Bias Architecture Small Size 20.0 dB Small Signal Gain 1.7 dB Noise Figure +10.0 dBm P1dB Compression Point 100% On-Wafer RF, DC and Noise Figure Testing 100% Visual Inspection to MIL-STD-883 |
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11-May-10 L1018-BD MIL-STD-883 XL1018 | |
Contextual Info: 0.05-50.0 GHz GaAs MMIC Distributed Amplifier D1002-BD January 2010 - Rev 18-Jan-10 Features Chip Device Layout Wide Band Driver Amplifier 9.0 dB Small Signal Gain 5.0 dB Noise Figure 15.0 dB Gain Control +9.0 dBm P1dB Compression Point 100% On-Wafer RF, DC and Output Power Testing |
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D1002-BD 18-Jan-10 MIL-STD-883 rep1002-BD-000V XD1002-BD-EV1 XD1002-BD | |
L1000-BD
Abstract: XL1000-BD-EV1 XL1000-BD
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L1000-BD 18-Jan-10 MIL-STD-883 aL1000-BD-EV1 XL1000 L1000-BD XL1000-BD-EV1 XL1000-BD | |
D1002-BD
Abstract: DM6030HK TS3332LD XD1002-BD XD1002-BD-000V XD1002-BD-EV1 152.01
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D1002-BD 18-Jan-10 MIL-STD-883 repeatabi02-BD-000V XD1002-BD-EV1 XD1002-BD D1002-BD DM6030HK TS3332LD XD1002-BD-000V XD1002-BD-EV1 152.01 | |
BD 139 140
Abstract: P1026 30SPA0553 DM6030HK P1026-BD TS3332LD XP1026-BD XP1026-BD-000V XP1026-BD-EV1 ID-2250
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P1026-BD 19-Jan-09 MIL-STD-883 XP1026-BD-000V XP1026-BD-EV1 XP1026-BD BD 139 140 P1026 30SPA0553 DM6030HK P1026-BD TS3332LD XP1026-BD-000V XP1026-BD-EV1 ID-2250 | |
XL1002-BD
Abstract: 28LN3BA0050 L1002-BD V550
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L1002-BD 09-Jan-10 MIL-STD-883 provideL1002-BD-EV1 XL1002 XL1002-BD 28LN3BA0050 L1002-BD V550 | |
Contextual Info: 2.0-18.0 GHz GaAs MMIC Buffer Amplifier September 2009 - Rev 21-Sep-09 CMM4000-BD Features Chip Device Layout Self Bias Architecture On-Chip Drain Bias Coil/DC Blocking 8.5 dB Small Signal Gain 4.5 dB Noise Figure +19.0 dBm P1dB Compression Point 100% Visual Inspection to MIL-STD-883 |
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21-Sep-09 CMM4000-BD MIL-STD-883 viaD-000V PB-CMM4000-BD-0000 CMM4000-BD | |
XD1001-BD-EV1
Abstract: DM6030HK TS3332LD XD1001-BD XD1001-BD-000V XD1001
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D1001-BD 11-Jan-10 MIL-STD-883 l01-BD-000V XD1001-BD-EV1 XD1001-BD XD1001-BD-EV1 DM6030HK TS3332LD XD1001-BD-000V XD1001 | |
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cmm303
Abstract: CMM3030-BD DM6030HK TS3332LD tanaka material safety
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Hz-30 CMM3030-BD 19-May-10 MIL-STD-883 provi-BD-0000 CMM3030-BD cmm303 DM6030HK TS3332LD tanaka material safety | |
CMM2030-BD
Abstract: CMM2030 DM6030HK TS3332LD DEGC120
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Hz-30 CMM2030-BD 07-May-10 MIL-STD-883 a-BD-0000 CMM2030-BD CMM2030 DM6030HK TS3332LD DEGC120 | |
CMM4000
Abstract: CMM4000-BD CMM4000-BD-000V DM6030HK M393 TS3332LD tanaka material safety
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CMM4000-BD 21-Sep-09 MIL-STD-883 holesD-000V PB-CMM4000-BD-0000 CMM4000-BD CMM4000 CMM4000-BD-000V DM6030HK M393 TS3332LD tanaka material safety | |
nl8048bc19-02
Abstract: NL8048BC19 THC63LVDM83R lcd screen LVDS connector 40 pins application of pick place robot nl8048 LVDS 30 pin hirose LVDS lvds 20 pin lcd panel NEC lcd led backlight JAE LVDS 30 PIN
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NL8048BC19-02 DOD-PP-0399 DOD-PP-0359 nl8048bc19-02 NL8048BC19 THC63LVDM83R lcd screen LVDS connector 40 pins application of pick place robot nl8048 LVDS 30 pin hirose LVDS lvds 20 pin lcd panel NEC lcd led backlight JAE LVDS 30 PIN | |
Contextual Info: 2.0-18.0 GHz GaAs MMIC Low Noise Amplifier CMM1100-BD February 2010 - Rev-05-Feb-10 Features Chip Device Layout Self Bias Architecture 17.0 dB Small Signal Gain 3.5 dB Noise Figure +16.0 dBm P1dB Compression Point 100% Commercial-Level Visual Inspection Using |
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CMM1100-BD Rev-05-Feb-10 Mil-Std-883 CMM1100-BD-000W PB-CMM1100-BD-0000 CMM1100-BD | |
28LN2BA0047
Abstract: XL1001-BD L1001-BD tanaka material safety
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L1001-BD 10-Jan-10 MIL-STD-883 aL1001-BD-EV1 XL1001 28LN2BA0047 XL1001-BD L1001-BD tanaka material safety | |
TEXAS 7697
Abstract: CMM1100 CMM1100-BD DM6030HK PB-CMM1100-BD-0000 TS3332LD
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CMM1100-BD Rev-05-Feb-10 Mil-Std-883 CMM1100-BD-000W PB-CMM1100-BD-0000 CMM1100-BD TEXAS 7697 CMM1100 DM6030HK PB-CMM1100-BD-0000 TS3332LD | |
XD9001
Abstract: D1008-BD XD1008-BD-000V mmic distributed amplifier XD1008 DM6030HK TS3332LD
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19-Mar-09 D1008-BD MIL-STD-883 XD1008 XD9001. XD9001 D1008-BD XD1008-BD-000V mmic distributed amplifier DM6030HK TS3332LD | |
Contextual Info: 2.0-18.0 GHz GaAs MMIC Low Noise Amplifier CMM1100-BD September 2009 - Rev 22-Sep-09 Features Self Bias Architecture 17.0 dB Small Signal Gain 3.5 dB Noise Figure +16.0 dBm P1dB Compression Point 100% Commercial-Level Visual Inspection Using Mil-Std-883 Method 2010 |
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CMM1100-BD 22-Sep-09 Mil-Std-883 metalD-000V PB-CMM1100-BD-0000 CMM1100-BD | |
NA19020-C953
Abstract: NA19020 C953 FLC48SXC8V-02 FI-X30M FLCV-13 SS26E3935N8365C3273111 FLCL-20 KOWA CORP DS90CF386
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FLC48SXC8V-02 NA19020-C953 NA19020 C953 FLC48SXC8V-02 FI-X30M FLCV-13 SS26E3935N8365C3273111 FLCL-20 KOWA CORP DS90CF386 |