T4C MARKING Search Results

Contextual Info: PRELIMINARY |W|IC=RC3N 512K M T4C 8 512/3 L WIDE DRAM X 8 512K x 8 DRAM WIDE DRAM LOW POWER, EXTENDED REFRESH FEATURES PIN ASSIGNMENT Top View OPTIONS 28-Pin ZIP (DB-3) 28-Pin SOJ (DC-4) MARKING • Timing 60ns access 70ns access 80ns access • MASKED WRITE

Contextual Info: ADVANCE M T4C 10016/7 16 MEG x1 DRAM FAST PAGE MODE: MT4C10016 STATIC COLUMN: MT4C10017 FEATURES • Industry standard xl pinout, timing, functions and packages • High performance, CMOS silicon gate process • Single power supply: +5V±10% or +3.3V±10%

Contextual Info: ED06DRAM TECHNOLOGY, INC. DRAM M T4C 16270 For the latest data sheet revisions, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html FEATURES • Industry-standard x l6 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process

Contextual Info: ADVANCE M T4C 1672 64K x 16 DRAM DRAM FAST PAGE MODE, DUAL CAS FEATURES • Industry standard xl6 pinouts, timing, functions and packages • High performance, CMOS silicon gate process • Single +5V±10% power supply • Low power, 3mW standby; 350mW active, typical

Contextual Info: ADVANCE CZR M T4C 10016/7 16 MEG X 1 DRAM FAST PAGE MODE: MT4C10016 STATIC COLUMN: MT4C10017 FEATURES • Industry standard xl pinout, timing, functions and packages • High performance, CMOS silicon gate process • Single power supply: +5V±10% or +3.3V±10%

Contextual Info: • h ÉidMiuiilBHááttaSflÉ BflE D MICRON TECHNOLOGY INC b llIS H T G G O E Tll =i ■ MRN ADVANCE ÉtaB*6â*ù^ÂeeÂfcâi - uMMüff T4C-2Z-/< 16K X 16 SRAM SYNCHRONOUS SRAM W ITH CLOCKED, REGISTERED INPUTS FEATURES • • • • OPTIONS MARKING « Timing

dram zip

Contextual Info: PRELIMINARY U | | C n D N 256K X M T4C 16260/1 16 W ID E DRAM 256K X 16 DRAM WIDE DRAM ASYMMETRICAL, FAST-PAGE-MODE FEATURES • Industry-standard x l6 pinouts, timing, functions and packages • Address entry: ten row-addresses, eight columnaddresses • High-performance CMOS silicon-gate process

4C8512

Contextual Info: ADVANCE 512K M T4C 8 512/3 S W IDE DRAM X 8 512K x 8 DRAM WIDE DRAM EXTENDED REFRESH SELF REFRESH FEATURES PIN ASSIGNMENT Top View • Industry-standard x8 pinouts, tim ing, functions and packages • A ddress entry: ten row -addresses, nine colum naddresses

Contextual Info: OBSOLETE 4 MEG x 1 FPM DRAM MICRON I TECHNOLOGY, INC. M T4C 1004J FEATURES • 1,024-cycle refresh distributed across 16ms MT4C1004J or 128m s (M T4C1004J L only) • Industry-standard pinout, tim ing, functions and packages • H igh-perform ance CM OS silicon-gate process

EDO DRAM

Abstract: MT4C4007JDJ-6L MT4C4007JDJ-6
Contextual Info: 1 MEG x 4 EDO DRAM V IIC Z R C H V S DRAM M T4C 4007J FEATURES PIN ASSIGNMENT (Top View Single+5V ±10% power supply JEDEC-standard pinout and packages High-performance CMOS silicon-gate process All inputs, outputs and clocks are TTL-compatible Refresh modes: RAS#-ONLY, CAS#-BEFORE- RAS#

LM 8512

Abstract: T4C marking marking t4c
Contextual Info: ADVANCE M T4C 8512/3 S 512K x 8 W IDE DRAM M IC R O N WIDE DRAM 512K x 8 DRAM FEATURES PIN ASSIGNMENT Top View • Industry-standard x8 pinouts, timing, functions and packages • Address entry: ten row-addresses, nine columnaddresses • High-perform ance CM O S silicon-gate process

Contextual Info: M ’ I C R O N 1 MEG X 1 FPM D R A M DRAM M T4C 1004J FEATURES • 1,024-cycle refresh distributed across 16ms M T4C1004J or 128ms (M T4C1004J L only) • Industry-standard pinout, tim ing, functions and packages • High-perform ance CM OS silicon-gate process

T4C16257DJ

Abstract: t4c16257 T4C16257DJ-7
Contextual Info: l^ lld R O N 256K DRAM M T4C 16257 X 16 DRAM 256K x 16 DRAM 5V, FAST PAGE MODE • Industry-standard x l6 pinouts, timing, functions and packages • High-perform ance CM OS silicon-gate process • Single +5V ±10% power supply* • Low power, 3m W standby; 375m W active, typical

Contextual Info: MICRON S E M I C O N D U C T O R INC b3E D • blllSHT MICRON I DDDfih22 T45 M M R N M T4C 8512/3 L m O K vX R8 WIDE \A/inP DRAM nOAM 512K S ili ICONOUCTOR MC WIDE DRAM 512K X 8 DRAM LOW POWER, EXTENDED REFRESH FEATURES • Industry-standard x8 pinouts, timing, functions and

Contextual Info: 1 M E G x 16 EDO DRAM V IIC Z R O N n P A V n * M M T4C 1M 16E 5 \ m M T4L C 1M 16E 5 FEATURES • JEDEC- and industry-standard x l6 tim ing, functions, pinouts and packages • High-perform ance CM OS silicon-gate process • Single pow er supply (+3.3V +0.3V or 5V ±10%

ite 8512

Abstract: LA 8512
Contextual Info: ADVANCE M T4C 8 512/3 512K X 8 DR AM M IC R O N DRAM 512K x 8 DRAM FAST PAGE MODE • • • • • • • • OPTIONS Vcc [ 1 DQ1 [ 2 • M asked W rite N o t available A v ailab le P ack ages P lastic SO J 400 m il P lastic T SO P (400 m il) P lastic Z IP (375 m il)

T4C4001

Contextual Info: M T4C 4001J 1 MEG X 4 DRAM [MICRON 1 MEG x 4 DRAM FAST PAGE MODE FEATURES PIN ASSIGNMENT Top View • Ind u stry stan d ard x4 p in o u t, tim in g , fu n ctio n s and p ackages • H ig h -p erfo rm an ce, C M O S silico n -g a te p ro cess • Sin g le + 5 V ± 1 0 % p o w er sup p ly

Contextual Info: ADVANCE WIDE DRAM 512K x 8 DRAM EXTENDED REFRESH SELF REFRESH FEATURES • Industry-standard x8 pinouts, timing, functions and packages • Address entry: ten row-addresses, nine columnaddresses • High-performance CMOS silicon-gate process • Single +5V ±10% power supply

mt4c256

Abstract: RCD 2226
Contextual Info: ADVANCE 256K X M T 4C 16270/1 16 W IDE DRAM 256K X 16 DRAM WIDE DRAM FAST-PAGE-MODE WITH EXTENDED DATA-OUT FEATURES PIN ASSIGNMENT Top View • Industry-standard xl6 pinouts, tim ing, functions and packages • H igh-perform ance CMOS silicon-gate process

RCD 2226

Contextual Info: ADVANCE M T 4 C 16256/7/8/9 256K X 16 DRAM p ilC Z R O IM DRAM 256K x 16 DRAM FAST PAGE MODE PIN ASSIGNMENT Top View • Industry standard x l6 pinouts, timing, functions and packages • High-performance, CM OS silicon-gate process • Single +5V ±10% power supply

MT4C16270DJ-7

Contextual Info: MICPON SFM JCONDUCTOR INC L.1E D • b 11 IS 4 e} DDDTìSB 2ST MflRN M IC R O N I MT4C16270 256K X 16 DRAM SEUiCOhOkJCTOH, INC. DRAM 256K x 16 DRAM EDO PAGE MODE FEATURES • Industry-standard x l6 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process

Contextual Info: MICRON B M T4C16256/7/8/9 L 256K X 16 WIDE DRAM BCMICDNDUCTaH. WC WIDE DRAM 256K x 16 DRAM LOW POWÉR, EXTENDED REFRESH FEATURES MARKING • T im ing 60ns access 70ns access 80ns access • W rite Cycle Access BYTE o r W ORD via WE nonm askable BYTE or W ORD via CAS

C5190

Contextual Info: M i r a r i M I . V J L Z m t 4 c i m i 6E5 S 1 MEG X 16 DRAM DRAM 1 MEG x 16 DRAM 5.0V, EDO PAGE MODE, OPTIONAL SELF REFRESH FEATURES * * * * * * * * * JEDEC- and industry-standard x l6 timing, functions, pinouts and packages H igh-perform ance CM OS silicon-gate process

Contextual Info: I^ IC R Q N 1 MEG DRAM 1 MEG X MT4C1026 X 1 DRAM 1 DRAM STATIC COLUMN FEATURES • Industry standard x l pinout, timing, functions and packages • High-performance, CM OS silicon-gate process • Single +5V ±10% power supply • Low power, 3mW standby; 175mW active, typical