SPECIFICATION Search Results

75ALS126

Abstract: mw137 n75a LS126 SN75129
Contextual Info: SN55ALS126, $N75ALS126 QUADRUPLE LINE DRIVERS D2299, FEBRUARY 1 9 8 6 -REVISED OCTOBER 1989 S N 55A LS126. S N 75A LS126 . . . J PACKAGE S N 75A LS126 . . . D OR N PACKAGE Meets IBM 3 6 0 /3 7 0 I/O Interface Specification G A22-6974-3 Also See SN55ALS130 and SN75ALS130

Reel Taping Specification JEDEC

Contextual Info: i V. AXIAL TAPING FOR DO-35 PACKAGE A. PRODUCT NAMING SYSTEM Type of package for shipment is classified by a symbol suffixed to a diode name. [Example] 1N4148 TPA2 © - © i- © B. Indicates the taping specifications Indicates JEDEC registration no.

TIM1414-4LA-371

Contextual Info: TOSHIBA MICROWAVE POWER GaAs FET MICROWAVE SEMICONDUCTOR TECHNICAL DATA TIM1414-4LA-371 RF PERFORMANCE SPECIFICATIONS CHARACTERISTICS Output Power at ldB Compression Point Linear Gain SYMBOL PldB Drain Current Power Added Efficiency 3rd Order Intermodulation

Contextual Info: DIRECTIONAL COUPLER .19 MAX IRAK MICROWAVE DIRECTIONAL COUPLER CPL / 1 0 B E - 0 8 SPECIFICATIONS: FREQUENCY LOSS COUPLING VSWR DIRECTIVITY POWER IN O- -O OUT TR4K MICROWAVE MATERIAL □ STANDARD □ SPECIAL • » o • BASE COVER MARKING FINISH FR— 4 VECTRA

TIM0910-20

Contextual Info: TIM0910-20 FE A TU R E S : • HIGH POWER ■ BROAD BAND INTERNALLY MATCHED ■ HERMETICALLY SEALED PACKAGE P 1dB = 43.0 dBm at 9.5 GHz to 10.5GHz ■ HIGH GAIN GldB B 7 0 dB at 9 5 GHz * 10 5 GHz RF PERFORMANCE SPECIFICATIONS Ta = 25°C CHARACTERISTIC

Contextual Info: CONVERSION CHART I INCH MM .002 0,05 .010 0.25 .020 0.51 .030 0.76 SPECIFICATIONS: I » X t O • 1 — < •—i • => 1.09 o o .020 12X < .100 2,54 .130 3.30 .172 4,37 .187 4,75 .200 5,08 .210 5,33 .216 5,49 .340 ELECTRICAL' CONTACT RATING: 0.4 VA a 20 VDC OR PEAK AC

TSP50C11

Contextual Info: TEXAS INSTR L I N / I N T F C SOE J> • STbl?5M OOflflfllfl 777 « T i m TSP50C14 PRELIMINARY TARGET SPECIFICATION 2/15/91 "?-T7-r*, ? 1. Scop«: The T S P 5 0 C 1 4 s p e e c h s y n t h e s i z e r is n e a r l y identical to the TSP50C11. T h i s d o c u ment d e s c r i b e s d i f f e r e n c e s b e t w e e n the T S P 5 0 C 1 4 a n d the TSP50C11. T h e

Contextual Info: SAFETY DRGANIZATIDNS RELIABILITY SPECIFICATIONS: TH IS F ILT E R HAS BEEN FORMALLY RRCDONIZOD, C ER TIFIED DR APPROVED BY THE LIST ED AGENCY, THEREFORE, ALL TEST/REQUIREMENTS SP EC IFIED IN THE LATEST REVISION OF TBE FOLLOWING AGENLY STANDARDS HAVE BEEN MET

Contextual Info: TRKMS037 *T R K M S 0 3 7 * l/Q - .0 2 5 .18 MAX MODULATOR STYLE - 0 9 PACKAGE TRAK MICROWAVE l/Q SPECIFICATIONS MODULATOR LO FREQUENCY LO POWER LEVEL M IQ /3 F F - 0 9 C INSERTION LOSS l/Q l/Q RATE LEVEL 1.8 - 2 .0 GHz + 10 dBm MAX 10 dB MAX DC - 10 MHz

LS125

Contextual Info: SN 75A LS125, SN 75A LS127 SEVEN-CHANNEL LINE RECEIVERS D 2 2 3 9 , APHIL 1 9 B 7 -R E V IS E D AU G U S T 1 9 8 9 • Meets IBM 3 6 0 /3 7 0 I/O Specification • Input Resistance . . . 7 kft to 20 k!7 • Output Compatible with TTL SN75ALS125 . D, J, OR N PACKAGE

T444

Contextual Info: 4 3 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. _ i_ LOC DIST AF 50 ALL RIGHTS RESERVED. REVISIONS LTR DESCRIPTION REV PER 0 G 3 H -0 1 4 7 - 0 4 DATE OWN APVD 250C T04 JR GJ 1, SPECIFICATIONS/ MAGNET WIRE #18 - #34 AWG,

Contextual Info: h- .5 0 -H .2 5 0 r 1 .075 — .19 7 .0 5 5 I F □ □ □ .031 — r Î •lo .38 I HIGH DYNAMIC RANGE DOUBLE BALANCED MIXER h-— -19 MAX —- - T .3 5 1 TRAK MICROWAVE RF MIXER $ M X R /3 C F -0 2 H D SPECIFICATIONS: IF OPERATING FREQUENCY

Contextual Info: D • f SN75124 TRIPLE LINE RECEIVER 0*^1.724 0005531 3 I TXI4 TEXAS INSTR L I N / I N T F C D 1 32 2 , SEPTEMBER 1973-BE V ISE D SEPTEMBER 1989 Meets IBM System 3 6 0 Input/Output Interface Specifications D, J, OR N PACKAGE (TOP VIEW) Operates from Single 5-V Supply

Contextual Info: u 1J POWER SPLITTER .19 MAX 7 1 TRAK MICROWAVE POWER SPLITTER .3 5 S P L /2 E F - 0 1 / 7 5 SPECIFICATIONS: FREQUENCY LOSS VSWR AMP BALANCE PHASE BALANCE ISOLATION POWER IMPEDANCE 5 0 0 - 2 0 0 0 MHz 0 .8 dB TYP, 2 .0 dB MAX 1.5:1 MAX ± 0 .1 dB TYP, ± 0 .3 dB MAX

p721f

Abstract: P721 TLP721F p72-1f VDE0303Part1
Contextual Info: TLP721 D4 series (T L P 7 2 H D 4 ) ATTACHMENT : SPECIFICATIONS FOR VDE0884 OPTION Types : TLP721, TLP721F Type designations for ‘ Option : (D4) ’ , which are tested under VDE0884 requirements. Ex. : TLP721 (D4-GR-LF4) D4 : VDE0884 option GR : CTR rank name

Contextual Info: TOSHIBA TPM1818-30 MICROWAVE POWER GaAs FET High Power GaAs FETs L, S-Band Features • High power • P-idB = 44.5 dBm at 1.8 GHz • High gain - G idB = 12 dB at 1.8 GHz • Partially matched type • Hermetically sealed package RF Performance Specifications (Ta = 25° C)

F585

Contextual Info: February 6, 1997 TIM5964-16L-151 1•RF PERFORMANCE SPECIFICATIONS CHARACTERISTICS Output Pow er at 1dB SYMBOL CONDITION P id B Ta= 25 °C MIN. TYP. MAX. UNIT 41.5 42.5 6.0 7.0 — dBm Com pression Point Pow er G ain at 1dB G id B Com pression Point V d s = 10V

Contextual Info: Apr. 1998 T IM 3 7 4 2 -4 5 S L -3 4 1 1. RF PERFORMANCE SPECIFICATIONS f Ta= 25 °C CHARACTERISTICS SYMBOL CONDITION MIN. TYP. MAX. UNIT Output Power at 1dB 46.0 46.5 PldB — dBm Compression Point VDS= 10V GldB — Power Gain at 1dB 10.0 f=3.3-3.6GHz —

75188

Abstract: S5188 76188
Contextual Info: SN55188, SN751B8 QUADRUPLE LINE DRIVERS D l 323 • Meets Specifications of EIA RS-232 C • Designed to Be Interchangeable With Motorola M C1488 • Current-Limited Output: 10 mA Typ • Power-Off Output Impedance: 300 1 Min SEPTEM BER 1983 SN 5S188 SN 7S188

Contextual Info: 74AC11204 HEX INVERTER/CLOCK DRIVER D3427, O C TO B ER 1989 DW OR N PACKAGE Low-Skew Propagation Delay Specifications for Clock Driver Applications TOP VIEW 1Y[ 1 2Y [ 2 3Y [ 3 Flow-Through Architecture Optimizes PCB Layout * * * Package Options Include Plastic “Small

VDE0884

Contextual Info: TLP12KD4 T LPl 2 1 (0 4 ) ATTACHMENT : SPECIFICATIONS FOR VDE0884 OPTION Types : TLP121 Type designations for ‘Option : (D4)’ , which are tested under VDE0884 requirements. Ex. : TLP121 (D4-GR-TPR) D4 : VDE0884 option GR CTR rank name TPR : standard taping name

Contextual Info: Taping Specifications TPS Packing Packing format Taping specification display # i Applicable package type Dimensions Unit: mm Packing unit O uiine 12 7 TP Ammo type 1 1 Ù n J - f f l ill , 2 ) 0 9 O/ 2000pcs /carton li211 TPS SOT-89 Packing Packing format

Contextual Info: REFERENCE DATA Production Standard Note TK111XXM Table of C ontents 1 . S tr u c tu r e /F e a tu r e 2 . E lectrical C haracteristics Specification for S ta n d ard Device 3 . P in Layout 4 . T est C ircuit 5 . Block D iagram D efinition of Term s Sensor C ircuit

Contextual Info: 4 3 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. “ . — LOC ALL RIGHTS RESERVED. REVISIONS DIST AD 00 LTR DESCRIPTION OWN DATE MB MZ 08JON04 REV PER EC 0G3C—0212—04 APVD SPECIFICATIONS; .4 1 3 .5 1 2