SOT920-1 |
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NXP Semiconductors
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Plastic rectangular-DIL-bent-SIL (reverse bent) |
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Original |
PDF
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SOT922-1 |
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NXP Semiconductors
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Ceramic earless flanged cavity package; 2 leads |
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Original |
PDF
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SOT923-1 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm |
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Original |
PDF
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SOT923-2 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm |
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Original |
PDF
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SOT925-1 |
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NXP Semiconductors
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Plastic ball grid array package; 364 balls; body 27 x 27 x 1.75 mm |
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Original |
PDF
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SOT926-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm |
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Original |
PDF
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SOT927-1 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 420 balls; body 13 x 13 x 1.1 mm |
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Original |
PDF
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SOT928-1 |
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NXP Semiconductors
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Plastic thin quad flat package; 64 leads; body 7 x 7 x 1 mm |
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Original |
PDF
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SOT929-1 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 272 balls; body 15 x 15 x 1 mm |
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Original |
PDF
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