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    SOT860 Search Results

    SOT860 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SOT860-1
    NXP Semiconductors Plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink Original PDF 302.19KB 1

    SOT860 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: Package outline HBGA624: plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink D D1 SOT860-1 B A ball A1 index area j E1 E A A2 A1 detail X C e1 e AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e M M AJ AG e AE AC


    Original
    HBGA624: OT860-1 PDF

    MS-034

    Abstract: sot860 HBGA624
    Contextual Info: Package outline Philips Semiconductors HBGA624: plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink D D1 SOT860-1 B A ball A1 index area j E1 E A A2 A1 detail X C e1 e AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b


    Original
    HBGA624: OT860-1 MS-034 MS-034 sot860 HBGA624 PDF