HBGA624 Search Results

Contextual Info: Package outline HBGA624: plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink D D1 SOT860-1 B A ball A1 index area j E1 E A A2 A1 detail X C e1 e AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e M M AJ AG e AE AC

Contextual Info: Package outline HBGA624: plastic thermal enhanced ball grid array package; 624 balls; heatsink SOT1095-1 B D D1 A ball A1 index area j E1 E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D

MS-034

Abstract: sot860 HBGA624
Contextual Info: Package outline Philips Semiconductors HBGA624: plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink D D1 SOT860-1 B A ball A1 index area j E1 E A A2 A1 detail X C e1 e AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b