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    SOT850 Search Results

    SOT850 Datasheets (1)

    NXP Semiconductors
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SOT850-1
    NXP Semiconductors Plastic thermal enhanced ball grid array package; 256 balls; body 17 x 17 x 1.4 mm; heatsink Original PDF 261.78KB 1

    SOT850 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: Package outline HBGA256: plastic thermal enhanced ball grid array package; 256 balls; body 17 x 17 x 1.4 mm; heatsink D SOT850-1 B D1 A ball A1 index area j A E1 E A2 A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C T R e P N M L K J H G F E D C B A


    Original
    hbga256ot850-1ms-034 PDF

    MS-034

    Abstract: sot850
    Contextual Info: Package outline Philips Semiconductors HBGA256: plastic thermal enhanced ball grid array package; 256 balls; body 17 x 17 x 1.4 mm; heatsink D SOT850-1 B D1 A ball A1 index area j A E1 E A2 A1 detail X C e1 e ∅v ∅w b 1/2 e M M y1 C C A B C y T R e P N


    Original
    hbga256ot850-1ms-034sot850 PDF