HBGA256 Search Results

Contextual Info: Package outline HBGA256: plastic thermal enhanced ball grid array package; 256 balls; body 17 x 17 x 1.4 mm; heatsink D SOT850-1 B D1 A ball A1 index area j A E1 E A2 A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C T R e P N M L K J H G F E D C B A

Contextual Info: Package outline HBGA256: plastic thermal enhanced ball grid array package; 256 balls; body 27 x 27 x 0.9 mm; heatsink A B D SOT602-1 ball A1 index area A A2 E A1 A4 detail X C e1 e f1 1/2 e e heatsink e2 1/2 e f2 X shape optional 4x 1 2 3 4 5 6 7 8 9 10

MS-034

Contextual Info: PDF: 2003 Mar 25 Philips Semiconductors Package outline HBGA256: plastic thermal enhanced ball grid array package; 256 balls; body 27 x 27 x 0.9 mm; heatsink A B D SOT602-1 ball A1 index area A A2 A1 E A4 detail X C e1 e f1 1/2 e ∅v M C A B b y1 C y ∅w M C

MS-034

Abstract: sot850
Contextual Info: Package outline Philips Semiconductors HBGA256: plastic thermal enhanced ball grid array package; 256 balls; body 17 x 17 x 1.4 mm; heatsink D SOT850-1 B D1 A ball A1 index area j A E1 E A2 A1 detail X C e1 e ∅v ∅w b 1/2 e M M y1 C C A B C y T R e P N

sot602

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline HBGA256: plastic, heatsink ball grid array package; 256 balls; body 27 x 27 x 0.9 mm B D SOT602-1 A ball A1 index area A2 E A A1 A3 detail X e1 b e C v M B ZD1 ∅w M y y1 C v M A WY U R N L J G E C A