SOT62 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HBGA1312 package SOT624-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline HBGA1312: plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink B D SOT624-1 A ball A1 index area A E A2 A1 detail X C e1 AV AT AP AM AK AH AF AD AB Y V T P M K H F D B ∅w M C AW AU AR AN AL AJ AG

SOT-623

Abstract: k 3683 MS-034
Contextual Info: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA658: plastic ball grid array package; 658 balls; body 40 x 40 x 1.75 mm SOT623-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AK AH AF AD AB Y V T P

MS-034

Abstract: sot624
Contextual Info: PDF: 2001 Feb 13 Philips Semiconductors Package outline HBGA1312: plastic, heatsink ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm A B D SOT624-1 ball A1 index area A E A2 A1 detail X e1 C v M B b e ∅w M v M A AW AV AU AT AR AP AN AM AL AK AJ

LFBGA180

Abstract: 11-90 MO-151 sot622
Contextual Info: PDF: 2000 Jun 26 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 v M B b e ∅w M y y1 C v M A P N M e L K

TFBGA81

Abstract: MO-216 sot627
Contextual Info: PDF: 2000 Jun 26 Philips Semiconductors Package outline TFBGA81: plastic thin fine-pitch ball grid array package; 81 balls; body 8 x 8 x 0.8 mm D SOT627-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B e y v C ∅w M b v M A J H G e F e1 E D C B A 1

HVQFN16

Abstract: SOT629-1 MO-220 sot629
Contextual Info: PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm A B D SOT629-1 terminal 1 index area A A 1 E c detail X e1 C 1/2 e e 8 y y1 C v M C A B w M C

MO-205

Abstract: LFBGA180
Contextual Info: PDF: 2002 Feb 13 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C P N

LFBGA36

Contextual Info: PDF: 2003 Feb 18 Philips Semiconductors Package outline LFBGA36: plastic low profile fine-pitch ball grid array package; 36 balls; body 6 x 6 x 1.05 mm D SOT620-1 A B ball A1 index area A2 A E A1 detail X C e1 ∅v M C A B b 1/2 e y1 C y ∅w M C e F e E D

LFBGA36

Abstract: sot620
Contextual Info: PDF: 2000 Jul 13 Philips Semiconductors Package outline LFBGA36: plastic low profile fine-pitch ball grid array package; 36 balls; body 6 x 6 x 1.05 mm D SOT620-1 A B ball A1 index area A2 A E A1 detail X C e1 v M B y y1 C ∅w M b e v M A F E D e1 C e B A

Contextual Info: Package outline BGA658: plastic ball grid array package; 658 balls; body 40 x 40 x 1.75 mm SOT623-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C AK AH AF AD AB Y V T P M K H F D B AJ e AG AE AC AA W U e2 R N

HVQFN16

Contextual Info: PDF: 2000 Oct 03 Philips Semiconductors Package outline HVQFN16: plastic, heatsink very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm A B D SOT629-1 terminal 1 index area A4 A E detail X e1 C v M B e 5 y y1 C w M b 8 L v M A 9 4 e e1

SOT-623

Abstract: MS-034 sot623 MS 034
Contextual Info: PDF: 2001 May 16 Philips Semiconductors Package outline BGA658: plastic ball grid array package; 658 balls; body 40 x 40 x 1.75 mm SOT623-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b e AJ AG AE AC AA W U R N L J G E C v M B ∅w M y y1 C v M A

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA658 package SOT623-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

TFBGA81

Abstract: MO-216
Contextual Info: PDF: 2002 Feb 15 Philips Semiconductors Package outline TFBGA81: plastic thin fine-pitch ball grid array package; 81 balls; body 8 x 8 x 0.8 mm D SOT627-1 A B ball A1 index area A A2 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C J H e G F e2 E D C B

MS-034

Abstract: HBGA1312
Contextual Info: PDF: 2003 Jan 29 Philips Semiconductors Package outline HBGA1312: plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink B D SOT624-1 A ball A1 index area A E A2 A1 detail X C e1 AV AT AP AM AK AH AF AD AB Y V T P M

HVQFN16

Abstract: MO-220 jedec package MO-220 16 pin
Contextual Info: PDF: 2001 Aug 14 Philips Semiconductors Package outline HVQFN16: plastic, heatsink very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm A B D SOT629-1 terminal 1 index area A4 A E detail X e1 C 1/2 e e ∅v M C A B b 5 y y1 C ∅w M C

Contextual Info: HV QF N1 6 SOT629-1 HVQFN16; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 17 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA180 package SOT622-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm A B D SOT629-1 terminal 1 index area A A 1 E c detail X e1 C 1/2 e e 8 y y1 C v M C A B w M C b 5 L 9 4 e e2 Eh 1/2 e 1 12 terminal 1

Contextual Info: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e b y y1 C ∅v M C A B ∅w M C P N e M L K J H e2 G 1/2 e F E D C B A ball A1

Contextual Info: Package outline TFBGA81: plastic thin fine-pitch ball grid array package; 81 balls; body 8 x 8 x 0.8 mm D SOT627-1 A B ball A1 index area A E A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C J H e G F e2 E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 X

HVQFN16

Abstract: JESD22-A114 JESD22-A115 JESD78 PCA9531 PCA9554 PCF8574 TSSOP16
Contextual Info: PCA9531 8-bit I2C-bus LED dimmer Rev. 06 — 19 February 2009 Product data sheet 1. General description The PCA9531 is an 8-bit I2C-bus and SMBus I/O expander optimized for dimming LEDs in 256 discrete steps for Red/Green/Blue RGB color mixing and back light applications.

Contextual Info: Spansion Analog and Microcontroller Products The following document contains information on Spansion analog and microcontroller products. Although the document is marked with the name “Fujitsu”, the company that originally developed the specification, Spansion