SOT575 Search Results

SOT575 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
SOT575 Abstract: D 304 x MS-029 Contextual Info: PDF: 1999 Dec 08 Philips Semiconductors Package outline SQFP304: plastic shrink quad flat package; 304 leads; lead length 1.3 mm , body 40 x 40 x 3.8 mm SOT575-1 c y X A 153 228 152 229 ZE e A E HE A2 A1 (A3) w M θ bp Lp L detail X pin 1 index 304 77 1 76	Original	sqfp304 ot575-1 ms-029 sot575 +1d 304 x	PDF
JEDEC TRAY DIMENSIONS Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors	Original	manuf86 tqfp80 ot357 tqfp64 +12ot543 tfbga64 jedec tray dimensions hssop20 ic packages tray tssop20 14 x 35 so16 package trays bga304 hlqfp100 msd504 lqfp64 reel size plcc84 package	PDF

Catalog Datasheet

Type

Document Tags

PDF

SOT575

Abstract: D 304 x MS-029
Contextual Info: PDF: 1999 Dec 08 Philips Semiconductors Package outline SQFP304: plastic shrink quad flat package; 304 leads; lead length 1.3 mm , body 40 x 40 x 3.8 mm SOT575-1 c y X A 153 228 152 229 ZE e A E HE A2 A1 (A3) w M θ bp Lp L detail X pin 1 index 304 77 1 76

Original

sqfp304 ot575-1 ms-029 sot575 +1

PDF

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors

Original

manuf86 tqfp80 ot357 tqfp64 +12

PDF