SOT53 Search Results

Contextual Info: SOT538A CDIP2; blister pack; standard product orientation 12NC ending 112 Rev. 1 — 29 November 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bottom ESD Label Printed plano box Space for additional label Preprinted ESD warning

Contextual Info: Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-2 B D D1 A ball A1 index area E1 E A A2 A1 detail X e1 e AF AD AB Y 1/2 e ∅v ∅w b M M C C A B C y y1 C AE AC AA V e W T P M K H F D B U R e2 N L 1/2 e J G

Contextual Info: Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e 1 2 shape optional 4x

Contextual Info: Package outline Earless flanged balanced ceramic package; 4 leads SOT539B D A F 5 D1 D U1 H1 w2 1 c D 2 E1 U2 H E L 3 4 w3 b Q e 5 10 mm scale Dimensions Unit 1 A b 4.7 11.81 4.2 11.56 w2 w3 0.25 0.25 max 0.185 0.465 0.007 1.242 1.241 0.374 0.375 0.069 0.674 1.005 0.137 0.089 1.275 0.405

Contextual Info: Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm SOT530-1 E A D X c y HE v M A Z 8 5 A2 A A3 A1 pin 1 index θ Lp L detail X 1 4 e w M bp 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max.

Contextual Info: Package outline Plastic single-ended package IPAK ; 3 leads (in-line) SOT533 E A E1 A1 D1 mounting base D2 L1 Q L 1 2 3 e1 w b c M e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b c D1 D2 E mm 2.38 2.22 0.93 0.46 0.89 0.71 0.56 0.46

PHE13002AU

Contextual Info: Philips Semiconductors Product specification Silicon Diffused Power Transistor PHE13002AU GENERAL DESCRIPTION High-voltage, high-speed planar-passivated npn power switching transistor in the SOT533 envelope intended for use in high frequency electronic lighting ballast applications, converters and inverters, etc.

philips H1

Abstract: sot539a
Contextual Info: PDF: 1999 Dec 09 Philips Semiconductors Package outline Flanged balanced LDMOST package; 2 mounting holes; 4 leads SOT539A Package under development Philips Semiconductors reserves the right to make changes without notice. D A F D1 U1 B q C w2 M C M H1 1 c

sot536

Contextual Info: PDF: 1999 Jun 07 Philips Semiconductors Package outline LFBGA96: plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm SOT536-1 D ball A1 index area A2 A E A1 detail X b A ∅w M ZD e y v A ZE T R P N M L K J H G F E D

M3D438

Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D438 BLF2043 UHF power LDMOS transistor Objective specification Supersedes data of 1999 Apr 01 2000 Feb 17 Philips Semiconductors Objective specification UHF power LDMOS transistor BLF2043 FEATURES PINNING - SOT538A

Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET M3D427 BLF2048 UHF power LDMOS transistor Objective specification 1998 Nov 19 Objective specification UHF power LDMOS transistor BLF2048 PINNING - SOT539A FEATURES • High power gain PIN DESCRIPTION • Easy power control

Capacitor Tantal SMD

Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET M3D427 BLF2048 UHF push-pull power LDMOS transistor Preliminary specification 1999 Nov 23 Preliminary specification UHF push-pull power LDMOS transistor BLF2048 PINNING - SOT539A FEATURES • High power gain PIN DESCRIPTION

LFBGA64

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm D SOT534-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B y y1 C ∅w M b e v M A H e G F E e1 D C

S 1040 smd

Abstract: multilayer ceramic capacitor philips 200B BLA1011-2 MGU487
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D438 BLA1011-2 Avionics LDMOS transistor Product specification Supersedes data of 2001 Jun 07 2001 Nov 05 Philips Semiconductors Product specification Avionics LDMOS transistor BLA1011-2 FEATURES PINNING - SOT538A

sot539bpo

Contextual Info: Package outline Earless flanged balanced ceramic package; 4 leads SOT539B D A F 5 D1 D U1 H1 w2 1 c D 2 E1 U2 H E L 3 4 w3 b Q e 5 10 mm scale Dimensions Unit 1 A b 4.7 11.81 4.2 11.56 c D D1 E E1 0.18 31.55 31.52 9.5 9.53 0.10 30.94 30.96 9.3 9.27 e F H

MS-034

Abstract: SOT532-1 BGA388
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AF AD AB AE e AC AA Y

LFBGA64

Contextual Info: PDF: 2003 Feb 05 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm D SOT534-1 A B ball A1 index area A A2 E A1 detail X C e1 ∅v M C A B b 1/2 e y1 C y ∅w M C e H e G F

BGA316

Abstract: MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C Y W V U T R P N M L K

blf2043

Abstract: TRANSISTOR D 471
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D438 BLF2043 UHF power LDMOS transistor Objective specification Supersedes data of 2000 Feb 17 2000 Feb 23 Philips Semiconductors Objective specification UHF power LDMOS transistor BLF2043 FEATURES PINNING - SOT538A

TRANSISTOR D 471

Abstract: BLF1043 SOT538A
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D438 BLF1043 UHF power LDMOS transistor Objective specification Supersedes data of 2000 Feb 17 2000 Feb 23 Philips Semiconductors Objective specification UHF power LDMOS transistor BLF1043 FEATURES PINNING - SOT538A

MCE021

Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET M3D438 BLF2043 UHF power LDMOS transistor Product specification Supersedes data of 2002 Jul 02 2002 Sep 10 Philips Semiconductors Product specification UHF power LDMOS transistor BLF2043 PINNING - SOT538A FEATURES • Easy power control

sot538a

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline Ceramic surface mounted package; 2 leads SOT538A Package under development D Philips Semiconductors reserves the right to make changes without notice. A 3 D1 D2 B c 1 L E2 H E1 E 2 α w1 M B M b Q 2.5

SOT538A

Abstract: 0,047 63 iec 157 1b
Contextual Info: PDF: 2000 Mar 08 Philips Semiconductors Package outline Ceramic surface mounted package; 2 leads SOT538A D A 3 D1 D2 B c 1 L E2 H E1 E 2 α w1 M B M b Q 2.5 5 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions UNIT A

388 transistor

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA388: plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm SOT532-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M AF AE AD AC AB AA Y W V U T R P N M L K