SOT527 Search Results

Contextual Info: Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad SOT527-1 E D A X c y HE exposed die pad side v M A Dh Z 11 20 A2 Eh pin 1 index A 3 A A1 θ Lp L 1 10 e detail X w M bp 2.5

sot527

Abstract: 01z1
Contextual Info: PDF: 1999 Nov 12 Philips Semiconductors Package outline HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm E D A SOT527-1 X c y HE heathsink side v M A Dh Z 11 20 A 3 A2 Eh pin 1 index A A1 θ Lp L 1 10 detail X w M

HTSSOP20

Abstract: m.a date sheet
Contextual Info: PDF: 2000 Jul 13 Philips Semiconductors Package outline HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm E D A SOT527-1 X c y HE heathsink side v M A Dh Z 11 20 A 3 A2 Eh pin 1 index A A1 θ Lp L 1 10 detail X w M

HTSSOP20

Contextual Info: SOT527-1 HTSSOP20; reel pack; standard product orientation 12NC ending 518 Rev. 1 — 23 October 2012 Packing information 1. Packing method %DUFRGH ODEHO %DJ 6' SULQW 0RLVWXUH FDXWLRQ SULQW 7DSH %DUFRGH ODEHO 'U\DJHQW 5HODWLYH KXPLGLW\ LQGLFDWRU (6' HPERVVHG

Contextual Info: SOT527-1 HTSSOP20; reel pack; standard product orientation 12NC ending 118 Rev. 1 — 6 November 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape Barcode label Circular sprocket holes opposite the label side of reel QA Seal

HTSSOP-20

Abstract: HTSSOP20
Contextual Info: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad SOT527-1 E D A X c y HE exposed die pad side v M A Dh Z 11 20 A 3 A2 Eh pin 1 index

TDA1517ATW

Abstract: HTSSOP20
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA1517ATW 8 W BTL or 2 x 4 W SE power amplifier Product specification Supersedes data of 2001 Feb 14 2001 Apr 17 NXP Semiconductors Product specification 8 W BTL or 2 × 4 W SE power amplifier TDA1517ATW FEATURES • Electrostatic discharge protection

Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA1517ATW 8 W BTL or 2 x 4 W SE power amplifier Preliminary specification File under Integrated Circuits, IC01 2001 Feb 14 Philips Semiconductors Preliminary specification 8 W BTL or 2 × 4 W SE power amplifier TDA1517ATW FEATURES

smd diode HB

Abstract: BA891 CGY2014ATW HTSSOP20 philips application
Contextual Info: INTEGRATED CIRCUITS DATA SHEET CGY2014ATW GSM/DCS/PCS power amplifier Preliminary specification File under Integrated Circuits, IC17 2000 Nov 28 Philips Semiconductors Preliminary specification GSM/DCS/PCS power amplifier CGY2014ATW FEATURES GENERAL DESCRIPTION

tda 8139

Abstract: IC tda 2140 1517ATW
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA1517ATW 8 W BTL or 2 x 4 W SE power amplifier Product specification Supersedes data of 2001 Feb 14 File under Integrated Circuits, IC01 2001 Apr 17 Philips Semiconductors Product specification 8 W BTL or 2 × 4 W SE power amplifier

fca173

Abstract: h2lb FCA175 BA891 CGY2014TT philips rf manual HTSSOP20
Contextual Info: INTEGRATED CIRCUITS DATA SHEET CGY2014TT GSM/DCS/PCS power amplifier Product specification Supersedes data of 2000 Apr 11 File under Integrated Circuits, IC17 2000 Oct 16 Philips Semiconductors Product specification GSM/DCS/PCS power amplifier CGY2014TT FEATURES

tda8921th

Abstract: TDA8947J TDA8947 BTL audio 50W HSOP24 TDA8944J tda8925st TDA7056 TDA8920TH tda8921
Contextual Info: Semiconductors Amplifier overview Philips Semiconductors has a strong track record in audio solutions, built on our extensive in-house experience and world-leading products such as our audio amplifiers.With audio being integrated into more and more applications, we have expanded our focus to develop flexible, highquality audio amplifiers that can be easily integrated into any system.

LXA 102 103

Abstract: TEA1211TW HTSSOP20 MBL513
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TEA1211TW High efficiency auto-up/down DC-to-DC converter Objective specification 2002 Jul 24 Philips Semiconductors Objective specification High efficiency auto-up/down DC-to-DC converter CONTENTS 1 FEATURES 2 APPLICATIONS 3

Contextual Info: INTEGRATED CIRCUITS DAT TDA1517ATW 8 W BTL or 2 x 4 W SE power amplifier Product specification Supersedes data of 2001 Feb 14 2001 Apr 17 NXP Semiconductors Product specification 8 W BTL or 2 × 4 W SE power amplifier TDA1517ATW FEATURES • Electrostatic discharge protection

fca173

Abstract: BA891 Philips DC Power Amplifier 380 CGY2014TT HTSSOP20 Philips DATA Handbook system
Contextual Info: INTEGRATED CIRCUITS DATA SHEET CGY2014TT GSM/DCS/PCS power amplifier Preliminary specification File under Integrated Circuits, IC17 2000 Apr 11 Philips Semiconductors Preliminary specification GSM/DCS/PCS power amplifier CGY2014TT FEATURES GENERAL DESCRIPTION

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors