SOT506 Search Results

LQFP-176

Abstract: LQFP176
Contextual Info: Philips Semiconductors Package outlines LQFP176: plastic low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm 1998 Jan 21 149 SOT506-1

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP176 package SOT506-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

LQFP176

Abstract: MS-026 LQFP-176 2615
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline LQFP176: plastic low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm SOT506-1 c y X A 132 133 89 88 ZE e E HE A 3 A A2 A1 θ wM Lp bp L detail X pin 1 index 45 176 44 1 ZD wM bp e v M A

LQFP176

Abstract: sot506 LQFP-176 24X24
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline LQFP176: plastic low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm SOT506-1 c y X A 132 133 89 88 ZE e E HE A 3 A A2 A1 θ wM Lp bp L detail X pin 1 index 45 176 1 44 ZD wM bp e v M A

LQFP176

Abstract: MS-026
Contextual Info: PDF: 2000 Feb 15 Philips Semiconductors Package outline LQFP176: plastic low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm SOT506-1 c y X A 132 133 89 88 ZE e E HE A 3 A A2 A1 θ wM Lp bp L detail X pin 1 index 45 176 44 1 ZD wM bp e v M A

Contextual Info: Package outline LQFP176: plastic low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm SOT506-1 c y X A 132 133 89 88 ZE e E HE A 3 A A2 A1 θ wM Lp bp L detail X pin 1 index 45 176 1 44 ZD wM bp e v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

SOT411

Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Contextual Info: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which

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JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors

wxdh

Abstract: atj2001 Biphase mark decoder mp3 fm "actions semiconductor" Actions Semiconductor
Contextual Info: ATJ2001 PDA+MP3 Decoder Actions Semiconductor Co.,LTD 1. Pin descriptions Pin No. Pin Name I/O Type Reset Default 1 LOSCI AI / Low frequency crystal OSC input 2 LOSCO AO / Low frequency crystal OSC output 3 GND PWR / Digital signal ground 4 4 1 A15 O L Bit15 of ext. memory address bus