SOT48 Search Results

sot486

Abstract: SOT486-1
Contextual Info: PDF: 1999 Nov 03 Philips Semiconductors Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 73 72 108 109 ZE e E HE A A2 A 3 A1 θ wM Lp bp L pin 1 index detail X 37 144 1 36 v M A ZD wM bp e

sot488

Contextual Info: PDF: 1999 Jun 08 Philips Semiconductors Package outline LFBGA48: plastic low profile fine-pitch ball grid array package; 48 balls; body 5.5 x 5.5 x 1.05 mm SOT488-1 D ball A1 index area A2 A E A1 detail X A b ∅w M y v A ZD e ZE J H G e F E D C B A 1 2 3 4 5 6 7 8 9

TSSOP32

Abstract: TSSOP-32
Contextual Info: PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm SOT487-1 E D A X c y HE v M A Z 17 32 A2 A 3 A A1 pin 1 index θ Lp L 1 detail X 16 w M bp e 2.5 5 mm

1337k

Contextual Info: DISCRETE SEMICONDUCTORS BGY241 UHF amplifier module P relim inary specification Philips Semiconductors PHILIPS Philips Semiconductors Preliminary specification UHF amplifier module BGY241 FEATURES PINNING - SOT482B • 3.5 V nominal supply voltage PIN DESCRIPTION

Contextual Info: Package outline Leadless surface-mounted package; plastic cap; 4 terminations e b 4x e1 e d b1 b2 b2 b3 SOT482B b3 1 2 3 L 4 L1 L2 D D1 c A 5 E1 E pin 1 index 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b b1 b2 b3 c D D1 d E E1 e e1

Contextual Info: Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A2 A 3 A1 pin 1 index A θ Lp L detail X 1 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

BGA-292

Abstract: BGA292 C BGA292 MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K

TSSOP48

Abstract: SOT480-1
Contextual Info: PDF: 2003 Apr 07 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5

transistor D 1710

Abstract: TRANSISTOR D 1785 BGY212A pn1999 BGY21
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D373 BGY212A UHF amplifier module Preliminary specification 1999 Aug 23 Philips Semiconductors Preliminary specification UHF amplifier module BGY212A PINNING - SOT482C FEATURES • 3.5 V nominal supply voltage

Contextual Info: Package outline TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm SOT487-1 E D A X c y HE v M A Z 17 32 A2 A 3 A A1 pin 1 index θ Lp L 1 detail X 16 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

LQFP144

Abstract: MS-026 136E23
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 73 72 108 109 ZE e E HE A A2 A 3 A1 θ wM Lp bp L pin 1 index detail X 37 144 1 36 v M A ZD wM bp e

sot480

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5

MO-194

Abstract: sot481
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm; lead pitch 0.4 mm SOT481-1 E D A X c y HE v M A Z 29 56 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 28 bp e w M 2.5

TSSOP32

Abstract: TSSOP-32 sot487
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm SOT487-1 E D A X c y HE v M A Z 17 32 A2 A 3 A A1 pin 1 index θ Lp L 1 detail X 16 w M bp e 2.5 5 mm

9.1 b3

Abstract: sot482c
Contextual Info: PDF: 1999 Aug 25 Philips Semiconductors Package outline Leadless surface mounted package; plastic cap; 4 terminations e b 4x e1 e d b1 b2 b2 b3 SOT482C b3 1 2 3 L 4 L1 L2 D D1 A c 5 E1 E pin 1 index 5 10 mm scale DIMENSIONS (mm are the original dimensions)

MO-151

Abstract: BGA292 transistor t 04 27 C BGA292
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K

BGY241

Abstract: pn1999
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D373 BGY241 UHF amplifier module Product specification Supersedes data of 1999 May 01 1999 Sep 09 Philips Semiconductors Product specification UHF amplifier module BGY241 FEATURES PINNING - SOT482C • 3.5 V nominal supply voltage

Contextual Info: Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 73 72 108 109 ZE e E HE A A2 A 3 A1 θ wM Lp bp L pin 1 index 144 detail X 37 1 36 v M A ZD wM bp e D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)

TSSOP48

Contextual Info: PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5

TSSOP32

Abstract: TSSOP-32
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm SOT487-1 E D A X c y HE v M A Z 17 32 A2 A 3 A A1 pin 1 index θ Lp L 1 detail X 16 w M bp e 2.5 5 mm

BGA292

Abstract: sot489 C BGA292
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 D D1 ball A1 corner A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1

BGA292

Abstract: BGA-292
Contextual Info: Philips Semiconductors Package outlines BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm 1998 May 06 1 SOT489-1

Contextual Info: DISCRETE SEMICONDUCTORS BITÂ SIH]H T BGY241 UHF amplifier module P relim inary specification Philips Sem iconductors 1999 A p r 16 PHILIPS Philips Semiconductors Preliminary specification UHF amplifier module BGY241 FEATURES PINNING - SOT482B • 3.5 V nominal supply voltage

Contextual Info: DISCRETE SEMICONDUCTORS BITÂ SIH]H T BGY241 UHF amplifier module P relim inary specification Philips Sem iconductors 1999 M ar 25 PHILIPS Philips Semiconductors Preliminary specification UHF amplifier module BGY241 FEATURES PINNING - SOT482B • 3.5 V nominal supply voltage