SOT462 Search Results

Contextual Info: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads non-concave SOT462-2 Dh x D Eh view B: mounting base side A2 d B j E Q A L c 1 e2 13 e1 Z bp e L1 w M 5 v M 10 mm scale DIMENSIONS (mm are the original dimensions)

sot462

Contextual Info: PDF: 1999 Dec 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e v M L1 w M bp 5 10 mm scale

Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E Q A L c 1 e2 13 e1 Z e L1 w M bp 5 v M 10 mm scale

Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e v M L1 w M bp 5 10 mm scale

Contextual Info: PDF: 2000 Mar 16 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e v M L1 w M bp 5 10 mm scale

SOT462-2

Abstract: sot462
Contextual Info: PDF: 2000 Oct 19 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e L1 w M bp 5 v M 10 mm scale

SO20-300

Abstract: QFP PACKAGE thermal resistance SO14-150 MBK360 SOT411 QFP-80-14 die bond diode handbook MBK368 QFP120
Contextual Info: CHAPTER 6 THERMAL DESIGN CONSIDERATIONS page Introduction 6-2 Thermal resistance 6-2 Junction temperature 6-2 Factors affecting Rth j-a 6-2 Thermal resistance test methods 6-3 Test procedure 6-3 Forced air factors for thermal resistance 6-4 Thermal resistance data - assumptions and precautions

SOT411

Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Contextual Info: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors