SOT334 Search Results

MS-029

Abstract: SQFP240 601ZD
Contextual Info: PDF: 2003 May 27 Philips Semiconductors Package outline SQFP240: plastic shrink quad flat package; 240 leads lead length 1.3 mm ; body 32 x 32 x 3.4 mm; high stand-off height SOT334-2 c y X A 180 121 120 181 ZE e E HE A A2 A1 (A3) θ wM Lp bp L detail X pin 1 index

SQFP240

Abstract: sot334
Contextual Info: PDF: 1999 Dec 08 Philips Semiconductors Package outline SQFP240: plastic shrink quad flat package; 240 leads lead length 1.3 mm ; body 32 x 32 x 3.4 mm SOT334-2 c y X A 180 121 120 181 ZE e E HE A A2 A1 (A3) wM θ Lp bp L pin 1 index detail X 240 61 60 1

Contextual Info: Package outline SQFP240: plastic shrink quad flat package; 240 leads lead length 1.3 mm ; body 32 x 32 x 3.4 mm; high stand-off height SOT334-2 c y X A 180 121 120 181 ZE e E HE A A2 A1 (A3) wM θ Lp bp L detail X pin 1 index 61 240 60 1 ZD wM bp e v M A

36150

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SQFP240 package SOT334-2 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors