SOT263 Search Results

Contextual Info: Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 SOT263B E p1 A ∅p A1 q D1 mounting base D L1 Q L2 m L 1 5 e b c w M 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A1 b c D D1 E e L mm 4.5 4.1

Contextual Info: 1-1-3 Multi-Output Type Regulator IC SI-3000KWD Series 2-Output, Surface-Mount, Low Dropout Voltage Linear Regulator IC •Features ■Absolute Maximum Ratings Ta=25°C • Surface-mount package (SOT263-5) Ratings Parameter • Output current: 1.0A x 2

buk7530-55

Abstract: mosfet-n SOT166 TOPFET buk7530
Contextual Info: SELECTION GUIDE Page TOPFETs 14 PowerMOS Transistors 16 Insulated Gate Bipolar Transistors 23 Philips Semiconductors TOPFETs VDS Selection Guide @ID FUSION O) (V) (A) Id w Pd (W) TYPE NUMBER TECHNOLOGY ENVELOPE 50 0.028 25 50 125 BUK106-50L TOPFET SOT263

T0-220AB

Abstract: SOT-263
Contextual Info: MOUNTING INSTRUCTIONS Page SOT223 1140 SOT186; SOT263; T0220AB 1152

T0-220AB

Abstract: SOT-263
Contextual Info: MECHANICAL DATA page SOT93 618 SOT 186 619 T0220AB 620 SOT223 621 SOT227B 622 SOT263 623 SOT263 lead form option 624

sot89 stencil

Contextual Info: Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION 1898 LEADED DEVICES Handling Soldering 1898 GENERAL DATA AND INSTRUCTIONS FOR THE SOT186A; SOT263; TO 220AB General rules Mounting methods Heatsink requirements

TO-220 JEDEC

Abstract: sot263b 16l22
Contextual Info: PDF: 2001 Jan 11 Philips Semiconductors Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 SOT263B E p1 A ∅p A1 q D1 mounting base D L1 Q L2 m L 1 5 e b c w M 5 10 mm scale DIMENSIONS mm are the original dimensions

T0-220AB

Abstract: SOT-263
Contextual Info: PACKAGE OUTLINES Page SOT186 1126 SOT186A 1127 SOT223 1128 SOT263 1129 SOT263-01 1130 SOT404 1131 SOT426 1132 T0220AB 1133

T0-220AB

Abstract: SOT-263
Contextual Info: MOUNTING INSTRUCTIONS page SOT93 626 SOT186; SOT263; T0220AB 633 SOT227B ISOTOP 639 SOT223 642

BUK444-200

Abstract: 100a mosfet Philips Semiconductors Selection Guide BUK454-60H BUK108-50DL BUK102-50GL BUk2 BUK44 BUK9630-55 BUK9570-55
Contextual Info: Philips Semiconductors TOPFETs Selection Guide VDs Rdsion lD Id V) (fl) (A) (A) Pd (W) TYPE NUMBER TECHNOLOGY ENVELOPE 50 0.028 25 50 125 BUK106-50L TOPFET 50 0.028 25 50 125 BUK106-50LP TOPFET SOT263-O1 50 0.028 25 50 125 BUK116-50L TOPFET SOT426 50

56359B

Contextual Info: MOUNTING INSTRUCTIONS Page SOT223 1140 SOT186; SOT263; T0220AB 1152 Philips Semiconductors Mounting instructions SOT223 TAPE and REEL PACKING SOT223 Tape and reel packing meets the feed requirements of automatic pick and place equipment (packing conforms

Contextual Info: Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option SOT263B-01 E p1 A ∅p A1 q D1 mounting base D L3 L L1 R L4 m 1 L2 5 e b R w M c Q Q1 Q2 5 10 mm scale DIMENSIONS mm are the original dimensions

SOT426

Abstract: SOT-263 SOT263 Philips Semiconductors Selection Guide High side switch
Contextual Info: Philips Semiconductors TOPFET High side switch Selection Guide VDS RDS ON @ID ID PD (V) (Ω) (A) (A) (W) TYPE NUMBER TECHNOLOGY ENVELOPE 1 50 0.038 10 20 125 BUK202-50X TOPFET High side switch SOT263-01 50 0.038 10 20 125 BUK202-50Y TOPFET High side switch

SOT263

Abstract: SOT-263 sot263-01 TO-220 JEDEC
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option SOT263-01 E A A1 P q D1 mounting base D L4 L3 L1 R L L5 m 1 L2 5 e b w M R c Q Q1 Q2 5 10 mm scale DIMENSIONS mm are the original dimensions

Contextual Info: Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 E SOT263 A A1 p q D1 mounting base D L1 Q L2 m L 1 5 e b c w M 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A1 b c D D1 E e L mm 4.5 4.1 1.39

SOT263

Abstract: SOT-263
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic single-ended package; heatsink mounted; 1 moumting hole; 5-lead TO-220 E SOT263 A A1 P q D1 mounting base D L1 L3 Q L2 m L 1 5 e b c w M 5 10 mm scale DIMENSIONS mm are the original dimensions

BUK108-50DL

Abstract: TOPFET SOT-263 Philips Semiconductors Selection Guide SOT404 BUK100 buk106
Contextual Info: Philips Semiconductors TOPFET Low side switch Selection Guide VDS RDS ON @ID ID PD (V) (Ω) (A) (A) (W) TYPE NUMBER TECHNOLOGY ENVELOPE 50 0.028 25 50 125 BUK106-50L TOPFET SOT263 50 0.028 25 50 125 BUK106-50LP TOPFET SOT263-01 50 0.028 25 50 125 BUK116-50L

Contextual Info: Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option SOT263-01 E A A1 p q D1 mounting base D L3 L L1 R L4 m 1 L2 5 e b R w M c Q Q1 Q2 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT

qfp 32 land pattern

Abstract: SSOP16 SSOP24
Contextual Info: Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE SOT186A; SOT263; TO 220AB General rules Mounting methods Heatsink requirements

L3 Package

Abstract: SOT263 TO-220 JEDEC sot263b
Contextual Info: PDF: 2001 Jan 11 Philips Semiconductors Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option SOT263B-01 E p1 A ∅p A1 q D1 mounting base D L3 L1 R L L4 m 1 L2 5 e b R w M c Q Q1 Q2 5 10 mm scale DIMENSIONS mm are the original dimensions

BUK417-500B

Abstract: TOPFETs FETs T0-220AB mosfet BUK454-600 BUK617-500BE BUK551-100A PHILIPS MOSFET igbt Philips Semiconductors Selection Guide Igbts guide
Contextual Info: Philips Semiconductors PowerMOS Transistors including TO P FETs and IGBTs V DS V @ ID (A) Rdsjon) (ß) Id w Selection Guide Pd (W) TYPE NUMBER TECH NO LO GY ENVELOPE SOT263 50 0.028 25 50 125 BUK106-50L TOPFET 50 0.028 25 50 125 BUK106-50S TOPFET SOT263

BUK9907-55ATE

Contextual Info: BUK9907-55ATE N-channel TrenchPLUS logic level FET Rev. 02 — 16 February 2009 Product data sheet 1. Product profile 1.1 General description Logic level N-channel enhancement mode Field-Effect Transistor FET in a plastic package using TrenchMOS technology. The devices include TrenchPLUS diodes for

BUK7907-55AIE

Contextual Info: BUK7907-55AIE N-channel TrenchPLUS standard level FET Rev. 02 — 9 February 2009 Product data sheet 1. Product profile 1.1 General description Standard level N-channel enhancement mode Field-Effect Transistor FET in a plastic package using TrenchMOS technology. The devices include TrenchPLUS current sensing

BUK10B-50US

Abstract: philips ldh d6506 BUK106-50L BUK106-50S buk106
Contextual Info: bSE » PHILIPS INTERNATIONAL • 7110fl2b D0b3flbS 2TM BiPHIN Product Specification Philips Semiconductors PowerMOS transìstor Logic level TOPFET_ DESCRIPTION Monolithic temperature and overload protected logic level power MOSFET in a 5 pin plastic