SOT132 Search Results
SOT132 Datasheets (7)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT1322-1 | NXP Semiconductors | Footprint for reflow soldering SOT1322-1 | Original | 336.24KB | 1 | ||
| SOT1324-1 | NXP Semiconductors | Plastic fine-pitch ball grid array package; 144 balls | Original | 341.23KB | 1 | ||
| SOT1325-1 | NXP Semiconductors | Plastic thermal enhanced very thin small outline package; no leads; 10 terminals | Original | 339.81KB | 1 | ||
| SOT1327-1 | NXP Semiconductors | HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals | Original | 339.22KB | 1 | ||
| SOT1327-1 | NXP Semiconductors | Footprint for reflow soldering SOT1327-1 | Original | 326.6KB | 1 | ||
| SOT1328-1 | NXP Semiconductors | Plastic thin fine-pitch ball grid array package; 80 balls | Original | 344.08KB | 1 | ||
| SOT1329-1 | NXP Semiconductors | Plastic thin fine-pitch ball grid array package; 100 balls | Original | 344.87KB | 1 |
SOT132 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: Package outline FBGA144: plastic fine-pitch ball grid array package; 144 balls SOT1324-1 A B D ball A1 index area A A2 A1 E detail X e1 e C 1/2 e M L K J H G F E D C B A ball A1 index area C A B C Øv Øw b y y1 C e e2 1/2 e 1 2 3 4 5 6 7 8 9 10 11 12 X 5 mm |
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fbga144ot1324-1sot1324-1mo-205 | |
MRC265
Abstract: MRC264 Amplifier Modules BGY135 BGY136 VHF Power Amplifier
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bgy135bgy136-sot132b7110fl2fci+6 | |
vHF amplifier module
Abstract: BGY143 S-12 PL-13W RF amplifier module VHF Amplifier Chip vhf power module
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bgy143ot132b-sot132bmsb029+9 | |
BGY36
Abstract: BGY32 BGY33 BGY35 an power amplifier 108 mhz
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bgy32bgy33bgy35bgy36+3 | |
BGY43
Abstract: vHF amplifier module 245 VHF AMplifier 1047B u1047 PINNING-SOT132B
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bgy43ot132bpinning-sot132bmbe663+7 | |
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Contextual Info: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls A B D SOT1329-1 ball A1 index area A E A2 A1 detail X e1 e C 1/2 e C A B C Øv Øw b y y1 C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X 5 mm scale |
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tfbga100ot1329-1sot1329-1 | |
hwson8 footprintContextual Info: Reflow soldering footprint Footprint information for reflow soldering of HWSON8 package SOT1327-1 Gx pa + oa 2.0 D P 0.025 0.025 Hy 0.825 0.7 By 0.35 Gy Ay 0.6 0.95 1.25 solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm |
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ot1327-1sot1327-1hwson8 footprint | |
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Contextual Info: Package outline TFBGA80: plastic thin fine-pitch ball grid array package; 80 balls A B D SOT1328-1 ball A1 index area A E A2 A1 detail X e1 e C 1/2 e C A B C Øv Øw b y y1 C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X 5 mm scale |
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tfbga80ot1328-1sot1328-1 | |
245 VHF AMplifier
Abstract: BGY43 vhf power module philips vhf amplifier module
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bgy43ot132bpinning-sot132b7110fl2b+5 | |
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Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 7 in-line leads SOT132B D A F U q q1 U2 U1 p E 1 2 3 4 5 6 7 L bp w M c e Q e1 e2 e3 e4 e5 e6 10 20 mm scale DIMENSIONS mm are the original dimensions |
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ot132b | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of LFBGA223 package SOT1322-1 Hx P P Hy see detail X1 see detail X2 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste |
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lfbga223ot1322-1sot1322-1 | |
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Contextual Info: Package outline HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; body 2 x 2 x 0.75 mm A B D SOT1327-1 X E terminal 1 index area A A1 c detail X e1 e terminal 1 index area 1/2 e C A B C v w b C y y1 C 1 4 L K Eh |
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ot1327-1mo-229sot1327-1 | |
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Contextual Info: Package outline HVSON10: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 10 x 10 x 0.85 mm X A B D SOT1325-1 E A A1 c terminal 1 index area detail X terminal 1 index area e1 e L C b 1 5 C A B C v w y1 C y Eh 10 6 Dh 5 mm |
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hvson10ot1325-1mo-229sot1325-1 | |
d1047
Abstract: BGY33 d1047* Transistor BGY36 88-108 rf amplifier vHF amplifier module capacitor polyester philips BGY32 BGY35 68-88MHz
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bgy32bgy33bgy35bgy36+7 | |
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bgy113f
Abstract: BGY113E SOT321 RF Power Modules BGY113G BGY204 BGY113B BGY133 SOT246 SOT342
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ot132bbgy143bgy132bgy133+11 | |
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Contextual Info: Enabling the Mobile Experience High Performance RF for wireless infrastructure Unleash the performance of your RF and microwave designs www.nxp.com/unleash-rf Enabling the Mobile Experience The future is mobile. And mobility means the freedom to innovate, communicate, connect and win. |
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Contextual Info: N A PIER PHILIPS/DISCRETE b^E » • b b S B ' m D030E11 4b7 « A P X J V BGY32 BGY35 BGY33 BGY36 VHF POWER AMPLIFIER MODULES A range o f broadband amplifier modules designed fo r mobile communications equipments, operating directly from 12 V vehicle electrical systems. The devices w ill produce 18 W output into a 50 S2 load. |
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d030e11bgy32bgy35bgy33+1 | |
BGY33
Abstract: "Amplifier Modules" Philips bgy32 Philips BGY36 VHF Power amplifier Module philips rf power amplifier module BGY32 BGY35 88-108 rf amplifier an power 88-108 mhz BGY36
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qq3de11bgy32bgy33bgy35+7 | |
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Contextual Info: +: 62 1 BGU8053 Low noise high linearity amplifier Rev. 2 — 30 December 2013 Product data sheet 1. Product profile 1.1 General description The BGU8053 is a low noise high linearity amplifier for wireless infrastructure applications, equipped with fast shutdown to support TDD systems. The LNA has a high |
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bgu8053 | |
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Contextual Info: RF Power Modules INDEX SELECTION GUIDE GENERAL CONTENTS Page 5 8 12 DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. |
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c4382 | |
BPW22A
Abstract: cm .02m z5u 1kv pin configuration of BFW10 la4347 B2X84 TDA3653 equivalent TRIAC TAG 9322 HEF40106BP equivalent fx4054 core dsq8
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bs9000d3007he4000b80ribution+10 | |
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Contextual Info: AN11416 1900 MHz low noise, high linearity amplifier using BGU8052 Rev. 1 — 2 December 2013 Application note Document information Info Content Keywords BGU8052, 1900 MHz, LNA, BTS Abstract This document provides circuit schematic, layout, BOM and typical EVB |
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an11416bgu8052om7956 | |
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Contextual Info: N AMER P H I L I P S / D I S C R E T E ^ 53=131 0030221 30 b BGY43 b 'l E D J APX L VHF POWER AMPLIFIER MODULE A broadband VHF amplifier module primarily designed for mobile communications equipment, operating directly from 12 V electrical systems. The module will produce a minimum output of 13 W |
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bgy43mgy430d3d22bbbs3t31+2 | |
Amplifier Modules
Abstract: 22 swg copper wire copper wire s.w.g 22 swg copper wire
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bgy49a/bgy49bbgy49abgy49bamplifier modules+3 | |