SOT131 Search Results
SOT131 Datasheets (8)
NXP Semiconductors
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT131-2 |
|
Plastic single in-line power package; 9 leads | Original | 229.63KB | 1 | ||
| SOT1312-1 |
|
Footprint for reflow soldering SOT1312-1 | Original | 324.61KB | 1 | ||
| SOT1313-1 |
|
Plastic thermal enhanced low profile quad flat package: 208 leads | Original | 399.71KB | 1 | ||
| SOT1314-1 |
|
Plastic very thin small outline package; no leads; 4 terminals | Original | 322.43KB | 1 | ||
| SOT1315-1 |
|
Footprint for reflow soldering SOT1315-1 | Original | 307.44KB | 1 | ||
| SOT1315-1 |
|
LFBGA170: plastic low profile fine-pitch ball grid array package; 170 balls | Original | 341.74KB | 1 | ||
| SOT1317-1 |
|
Plastic thermal enhanced thin quad flat package; no leads; 80 terminals; resin based; body 12 x 12 x 1.1 mm | Original | 335.84KB | 1 | ||
| SOT1318-1 |
|
Plastic thermal enhanced extremely thin quad flat package; no leads; 32 terminals | Original | 340.77KB | 1 |