| SOT131-2 |
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NXP Semiconductors
|
Plastic single in-line power package; 9 leads |
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Original |
PDF
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| SOT1312-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT1312-1 |
|
Original |
PDF
|
| SOT1313-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced low profile quad flat package: 208 leads |
|
Original |
PDF
|
| SOT1314-1 |
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NXP Semiconductors
|
Plastic very thin small outline package; no leads; 4 terminals |
|
Original |
PDF
|
| SOT1315-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1315-1 |
|
Original |
PDF
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| SOT1315-1 |
|
NXP Semiconductors
|
LFBGA170: plastic low profile fine-pitch ball grid array package; 170 balls |
|
Original |
PDF
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| SOT1317-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin quad flat package; no leads; 80 terminals; resin based; body 12 x 12 x 1.1 mm |
|
Original |
PDF
|
| SOT1318-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin quad flat package; no leads; 32 terminals |
|
Original |
PDF
|
