LFBGA170 Search Results
LFBGA170 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of LFBGA170 package SOT1315-1 Hx P P Hy see detail X solder land solder paste deposit 0.65 solder land plus solder paste 0.525 0.40 occupied area solder resist detail X Dimensions in mm |
Original |
LFBGA170 OT1315-1 sot1315-1 | |
Contextual Info: Package outline LFBGA170: plastic low profile fine-pitch ball grid array package; 170 balls A B D SOT1315-1 ball A1 index area A A2 A1 E detail X C e1 e P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 2 3 4 5 6 7 8 9 10 11 12 13 14 X 10 mm scale |
Original |
LFBGA170: OT1315-1 sot1315-1 MO-205 MO-205 | |
Terrestrial digital radio processor
Abstract: SAF3560EL SAF3560HV SAF3560_SDS saf356 SAF3560 HLQFP144
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Original |
SAF3560 SAF3560 001aal423 Terrestrial digital radio processor SAF3560EL SAF3560HV SAF3560_SDS saf356 HLQFP144 |