SOLDERING RECOMMENDATIONS Search Results

Contextual Info: Soldering Recommendations Vishay Vitramon Monolithic Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 5. Soldering Techniques: Follow the soldering curves shown on next page. A. Our tin plate nickel barrier termination Termination

Contextual Info: Surface Mount Resistors Recommended Soldering Conditions • Recommended Soldering Conditions Recommendations and precautions are described below. ● Rectagular Type ● Recommended soldering conditions for reflow • Reflow soldering shall be performed a maximum of

Contextual Info: RECOMMENDED PATTERN Pattern Dimensions Unit: mm LL1005-FH and PTL1005-F Series • LL1608-FH/FS and PTL1608-F Series LL2012-FH and PTL2012-F Series R o w Soldering R eflow Soldering R o w Soldering R eflow Soldering Flow Soldering R eflow Soldering & 0 .3 - 0.5

Contextual Info: Soldering Conditions Recommended Pattern Pattern Dimensions Unit: mm LL2012-F Series a b c Flow Soldering 1.0-1.4 0.8 - 1.2 0.8 ~ 1.0 Reflow Soldering 1.0- 1.2 0 .6 - 1.0 0.8 - 1.2 LL1608-F/FH Series Flow Soldering 0.8 - 1.0 0.8 - 1.0 0.6 - 0.8 Reflow Soldering

JEDEC J-STD-020d.1

Abstract: paste profile J-STD-020d.1 JEDEC SMT reflow profile Altera ROHS AN81 J-STD-020D J-STD-033
Contextual Info: Reflow Soldering Guidelines for Lead-Free and RoHS-Compliant Packages AN-353-3.0 Application Note This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow

JEDEC J-STD-020d.1

Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA
Contextual Info: AN 353: Reflow Soldering Guidelines for Lead-Free Packages February 2009 AN-353-2.0 Introduction This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow

ISP2100

Abstract: reflow reflow profile
Contextual Info: QLogic Corporation Applications Note No. 83210-514-01 A Reflow Soldering Recommendations Products Affected Chip Name Part Number ISP2100 2405088 This applications note describes the reflow soldering recommendations for the ISP2100 chip. The recommended reflow soldering conditions are

Rosin Flux Type RMA

Contextual Info: VJ Soldering Recommendations Vishay Surface Mount Multilayer Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.

vapor condensation cooling

Abstract: 45034
Contextual Info: VJ Soldering Recommendations Vishay Surface Mount Multilayer Ceramic Chip Capacitors SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.

Vitramon

Abstract: vitramon VJ
Contextual Info: VJ Soldering Recommendations Vishay Vitramon Multilayer Ceramic Chip Capacitors Speciality Products SOLDERING RECOMMENDATIONS 1. Termination Selection: 6. Soldering With a Solder Iron: A. Our tin-plated termination terminations code “X” is recommended for all attachment methods which use solder.

ipc 610 Class 3 pin protrusion

Abstract: flux ef 2202 ipc 610D ipc 610 Class 3 IPC-A-610D ipc 610 non-wetting IPCA610D ipc 610 IPC-A-610-D IPC-A610D
Contextual Info: Application Note AN:017 RoHS-Compliant Through-Hole V•I Chip Soldering Recommendations By Ankur Patel, Associate Product Line Engineer Introduction Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 3 Pin/Lead Protrusion 4 Board Cleaning 4 Solder Joint Inspection

flux ef 2202

Abstract: ipc 610D ipc 610 Class 3 pin protrusion ipc 610 non-wetting IPC-A610D ipc 610 Class 3 IPC-A-610D ipc 610 AN017 IPC-A-610-D
Contextual Info: Application Note AN:017 RoHS-Compliant Through-Hole V•I Chip Soldering Recommendations By Ankur Patel, Associate Product Line Engineer Introduction Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 3 Pin/Lead Protrusion 4 Board Cleaning 4 Solder Joint Inspection

AN10376

Abstract: Dow Corning 340 AN1037
Contextual Info: AN10376 Mounting and soldering recommendations for CATV modules Rev. 01 — 21 April 2005 Document information Info Content Keywords CATV, mounting, soldering, SOT115 Abstract Mounting CATV hybrid modules Application note AN10376 Philips Semiconductors Mounting and soldering recommendations for CATV modules

Soldering Recommendations

Abstract: JEDEC wave J-STD020C HALO SOLDERING REFLOW smt
Contextual Info: Pb-Free Soldering Recommendations HALO Electronics recommends the following reflow soldering*, IPC/JEDEC J-STD-020C compatible, and wave soldering profiles for processing its Pb-Free surface mount and through-hole products. HALO SMT products are tested to withstand maximum peak

STR3234

Abstract: D1268 NL-5700 M130 D-12681 K1306 k1306 datasheet V23814-U1306-M130 V23815-K1306-M230 V23815-N1306-M130
Contextual Info: Hot-Bar Soldering and Hot-Air Soldering for PAROLI =Modules Appnote 76 by Arun Agarwal, updated by Elmar Dröge DESCRIPTION OVERVIEW OF SURFACE MOUNT SOLDERING METHODS This technical note provides information on the two soldering methods recommended for Infineon PAROLI Parallel Optical

Contextual Info: AN10376 Philips Semiconductors Mounting and soldering recommendations for CATV modules 1. Introduction This document deals with the mounting and soldering of CATV modules. 2. Mounting and soldering recommendations 2.1 Mounting The heatsink surface must be flat, free of burrs and oxidation and be parallel to the

Melf composition

Contextual Info: Recommended Soldering Techniques Recommended Soldering Techniques by David B. Hutchins, Senior Applications Engineer Introduction The soldering process is the means by which electronic components are mechanically and electrically connected into the circuit assembly. Adhering to good soldering practices will preserve the inherent reliability of the original

945801

Contextual Info: LEAD FINISH: GDLD BUSHING FINISH: S IL V E R SOLDERING NOTES: 1. SOLDERING TO FILTER TERMINALS: DO NOT EXCEED 2 8 0 ’C IRON TIP TEMP. 2. MACHINE/OVEN SOLDERING: DO NOT EXCEED 210'C MAX. 0.O4OÌ.OO1 3. CONTACT SCI FOR [1 .0 2 Ì.0 2 ] MORE DETAILED SOLDERING

UEI 15 SP 020

Abstract: 691 OHD 3 - 115 M VMUX to3a SAA7140A SAA7140B new 60 ypf UEI 20 SP 010
Contextual Info: Philips Semiconductors Objective specification High Performance Scaler HPS CONTENTS 1 FEATURES SAA7140A; SAA7140B 14 PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 3 ORDERING INFORMATION

UEI 20 SP 010

Abstract: bord SAA7140A SAA7140B FEY G4 LQFP128 VR029 SAA7196 t3044 UL705
Contextual Info: Philips Semiconductors Objective specification High Performance Scaler HPS CONTENTS SAA7140A; SAA7140B 14 PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 1 FEATURES 2 GENERAL DESCRIPTION

Contextual Info: Recommended Soldering Techniques Introduction The soldering process is the means by which electronic components are mechanically and electrically connected into the circuit assembly. Adhering to good soldering practices will preserve the inherent reliability of the original

MICRON 63

Abstract: SOLDERING REFLOW smt
Contextual Info: TN-00-15: Recommended Soldering Parameters Introduction Technical Note Recommended Soldering Parameters Introduction This technical note defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. Using these techniques and parameters will prevent

Reflow Soldering Guide

Abstract: berex
Contextual Info: BeRex Reflow Soldering Guide Application Note RF MMIC Innovator www.berex.com Classification: Reflow Soldering Document Number: Reflow61110 Revision code: 0.1 Reflow Soldering Guide for Surface Mount Devices Name Writer Date Signature BY KIM JH Bae OK Dr. Yoo

Contextual Info: AN11120 Application and soldering information for the PCA2129T automotive TCXO RTC Rev. 2 — 23 January 2013 Application note Document information Info Content Keywords PCA2129T soldering, application, timekeeping, timestamp Abstract This application note gives additional information about soldering and