SOLDER PASTE Search Results
SOLDER PASTE Equivalents
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SOLDER PASTE Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| CN-AC3MMDZBAU |
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3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) | |||
| CN-DSUB25PIN0-000 |
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Amphenol CN-DSUB25PIN0-000 D-Subminiature (DB25 Male D-Sub) Connector, 25-Position Pin Contacts, Solder-Cup Terminals | |||
| CN-DSUBHD26PN-000 |
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Amphenol CN-DSUBHD26PN-000 High-Density D-Subminiature (HD26 Male D-Sub) Connector, 26-Position Pin Contacts, Solder-Cup Terminals | |||
| CN-DSUB15SKT0-000 |
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Amphenol CN-DSUB15SKT0-000 D-Subminiature (DB15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals | |||
| CN-DSUBHD15SK-000 |
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Amphenol CN-DSUBHD15SK-000 High-Density D-Subminiature (HD15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals |
SOLDER PASTE Price and Stock
DIGIKEY DKS-SOLDERPASTE15GSOLDER PASTE NO-CLEAN 63/37 5CC |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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DKS-SOLDERPASTE15G | Bag | 46 | 1 |
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Buy Now | |||||
Olimex SOLDER PASTE SAC305 CLASS4SOLDER PASTE SAC305 CLASS4 |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SOLDER PASTE SAC305 CLASS4 | Bulk | 10 |
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Buy Now | ||||||
Olimex SOLDER PASTE SN63PB37 CLASS4SOLDER PASTE SN63PB37 CLASS4 |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SOLDER PASTE SN63PB37 CLASS4 | Bulk | 1 |
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Buy Now | ||||||
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SOLDER PASTE SN63PB37 CLASS4 |
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Get Quote | ||||||||
AIM Metals & Alloys LP 50In50Pb Solder PasteSolder |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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50In50Pb Solder Paste |
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Get Quote | ||||||||
SOLDER PASTE Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of hermetically sealed glass surface-mounted package; 2 connectors SOD80C 4.55 4.30 2.30 2.25 1.70 1.60 0.90 2x solder land solder land plus solder paste solder paste deposit solder resist |
Original |
OD80C sod080c | |
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Contextual Info: HIGH DENSITY PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints * Insures a reliable solder joint by prc ing an exact amount of solder 9 Eliminates the need for solder paste |
OCR Scan |
18x18 | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of LFBGA170 package SOT1315-1 Hx P P Hy see detail X solder land solder paste deposit 0.65 solder land plus solder paste 0.525 0.40 occupied area solder resist detail X Dimensions in mm |
Original |
LFBGA170 OT1315-1 sot1315-1 | |
Robinson Nugent
Abstract: Robinson Nugent pga 18x18 Nugent
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OCR Scan |
13x13 18x18 Robinson Nugent Robinson Nugent pga Nugent | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of LFBGA267 package SOT1332-1 Hx ball A1 index area P P Hy see detail X solder land solder paste deposit 0.65 solder land plus solder paste 0.525 0.40 occupied area solder resist detail X |
Original |
LFBGA267 OT1332-1 sot1332-1 | |
sod962Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962 0.85 0.4 0.4 R0.025 8x 0.22 (2×) 0.12 (2×) 0.2 (2×) solder land solder land plus solder paste solder paste deposit solder resist |
Original |
OD962 sod962 | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HXSON4 package SOT1192-1 1.2 1.15 0.65 0.25 0.48 45° 1.55 0.5 1.2 1.3 0.025 0.48 www.nxp.com r= 0.05 solder land solder land plus solder paste solder paste deposit solder resist occupied area |
Original |
OT1192-1 sot1192-1 | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HXQFN60 package SOT1134-2 4.25 0.5 0.3 0.3 3.9 2.55 0.35 5.2 5.8 6.25 1.1 0.45 1.1 1.9 solder land solder paste deposit 125 mm stencil solder land plus solder paste occupied area solder resist |
Original |
HXQFN60 OT1134-2 sot1134-2 Publicat35 | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of TFBGA208 package SOT950-1 Hx P P Hy 0.475 see detail X solder land CL solder paste deposit SR CU solder land plus solder paste SP occupied area solder resist detail X Dimensions in mm |
Original |
TFBGA208 OT950-1 sot950-1 | |
sod323 reflowContextual Info: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD323 3.05 2.1 0.5 2x 1.65 0.95 0.6 (2×) 2.2 0.5 (2×) 0.6 (2×) solder land solder land plus solder paste solder paste deposit solder resist |
Original |
OD323 sod323 sod323 reflow | |
SOT-457Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of TSOP6 package SOT457 3.45 1.95 0.45 0.55 6x (6×) 0.95 3.3 2.825 0.95 0.7 (6×) 0.8 (6×) 2.4 solder land solder land plus solder paste solder paste deposit solder resist occupied area |
Original |
OT457 sot457 liceSOT457 SOT-457 | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962-2 0.85 0.4 0.4 R0.025 8x 0.22 (2×) 0.12 (2×) 0.2 (2×) solder land solder land plus solder paste solder paste deposit solder resist |
Original |
OD962-2 sod962-2 | |
SOD123WContextual Info: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD123W 4.4 2.9 2.8 1.1 1.2 2x (2×) 2.1 1.6 1.1 (2×) 1.2 (2×) solder land solder land plus solder paste solder paste deposit solder resist |
Original |
OD123W sod123w | |
SOD128
Abstract: SOD-128
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Original |
OD128 sod128 SOD-128 | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted package; 3 leads SOT323 2.65 1.85 1.325 2 2.35 3 0.6 3x 1.3 1 0.5 (3×) 0.55 (3×) solder land solder land plus solder paste solder paste deposit solder resist |
Original |
OT323 sot323 | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering SOD883 1.3 0.7 R0.05 8x 0.9 0.6 0.7 0.25 (2×) 0.3 (2×) 0.3 0.4 (2×) 0.4 solder land solder land plus solder paste solder paste deposit solder resist occupied area Dimensions in mm |
Original |
OD883 sod883 | |
SOD523 footprintContextual Info: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD523 2.15 1.4 0.5 0.6 2x (2×) 1.2 0.4 (2×) 0.5 (2×) solder land solder land plus solder paste solder paste deposit solder resist occupied area |
Original |
OD523 sod523 SOD523 footprint | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HXSON4 package SOT1194-1 1.2 1.15 0.65 0.25 0.48 45° 1.55 0.5 1.2 1.3 0.025 0.48 r= 0.05 solder land solder land plus solder paste solder paste deposit solder resist occupied area Dimensions in mm |
Original |
OT1194-1 sot1194-1 | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD323F 3.05 2.2 2.1 0.5 2x 1.65 0.95 0.6 (2×) 0.5 (2×) 0.6 (2×) solder land solder land plus solder paste solder paste deposit solder resist |
Original |
OD323F sod323f | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of DFN1608D-2 package SOD1608 1.15 0.75 1.05 0.65 0.95 0.55 0.9 0.8 0.7 0.7 0.8 0.9 1 2 0.1 1.8 0.2 1.9 2.0 solder land solder land plus solder paste solder paste deposit solder resist Dimensions in mm |
Original |
DFN1608D-2 OD1608 sod1608 | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XQFN10 package SOT1049-3 Hx Gx pa + oa 2.000 P 0.500 D 9x 0.0125 0.0125 Hy Gy pa + oa By Ay Bx D1 Ax solder land solder paste deposit solder land plus solder paste occupied area solder resist |
Original |
XQFN10 OT1049-3 sot1049-3 | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of leadless ultra small plastic package; 3 solder lands SOT883 1.3 0.7 R0.05 12x 0.9 0.6 0.7 0.25 (2×) 0.3 (2×) 0.3 0.4 (2×) 0.4 solder land solder land plus solder paste solder paste deposit |
Original |
OT883 sot883 | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted package; 3 leads SOT23 3.3 2.9 1.9 3 0.6 3x 0.7 (3×) solder land solder paste deposit 0.5 (3×) solder land plus solder paste 0.6 (3×) solder resist 1 occupied area |
Original |
sot023 | |
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Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of SOD923 package SOD923 1.4 0.9 0.9 0.4 2x 0.3 (2×) 0.3 (2×) 0.5 (2×) 0.2 (2×) 0.4 (2×) solder land solder land plus solder paste solder paste deposit solder resist occupied area |
Original |
OD923 OD923 sod923 | |