SOJ 36 Search Results

Molded SOJ V34

Contextual Info: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 24-Lead (300-Mil) Molded SOJ V13 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 28-Lead (400-Mil) Molded SOJ V28 2 Package Diagram 32-Lead (300-Mil) Molded SOJ V32 32-Lead (400-Mil) Molded SOJ V33

soj 36

Abstract: V28 Package SOJ 24 diode in 400 Molded SOJ V34 V32 Package
Contextual Info: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 24-Lead (300-Mil) Molded SOJ V13 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 28-Lead (400-Mil) Molded SOJ V28 2 Package Diagram 32-Lead (300-Mil) Molded SOJ V32 32-Lead (400-Mil) Molded SOJ V33

Contextual Info: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 51-85029-A 24-Lead (300-Mil) Molded SOJ V13 51-85030-A 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 51-85031-B 28-Lead (400-Mil) Molded SOJ V28 51-85032-A 2 Package Diagram

SOJ-400

Contextual Info: 5.7 UNIT : mm 13.2 MJ400-01A, LB-044 length : 493±2.0 thickness : 0.6 +0.3 − 0.2 tolerance : ±0.4 material : plastic with antistatic finish Applied package Quantity (pcs) 28-pin plastic SOJ (400 mil) MAX. 25 32-pin plastic SOJ (400 mil) MAX. 22 36-pin plastic SOJ (400 mil)

soj 36

Abstract: 51-85041-A 85031 SOJ 24 V28 Package V32 Package V36 Package 51-85082-B 300MIL
Contextual Info: Package Diagram Plastic Small Outline J - Bend 20-Lead 300-Mil Molded SOJ V5 51-85029-A 24-Lead (300-Mil) Molded SOJ V13 51-85030-A 1 Package Diagram 28-Lead (300-Mil) Molded SOJ V21 51-85031-B 28-Lead (400-Mil) Molded SOJ V28 51-85032-A 2 Package Diagram

Contextual Info: SOJ Socket 165-200097-01 165-200005-03 PERFORMANCE SPECIFICATIONS: FEATURES: Augat's new SOJ Socket provides the user an easy means of socketing their SOJ devices. These full featured devices are available in a variety of sizes. • Sizes range from 24 to 42 positions

AS5C512K8

Abstract: AS5C512K8DJ 10 35L
Contextual Info: SRAM AS5C512K8 Austin Semiconductor, Inc. 512K x 8 SRAM PIN ASSIGNMENT Top View HIGH SPEED SRAM with REVOLUTIONARY PINOUT 36-Pin SOJ (DJ, ECJ & SOJ) 36-Pin CLCC (EC) AVAILABLE AS MILITARY SPECIFICATIONS •SMD 5962-95600 •SMD 5962-95613 •MIL-STD-883

C10943X

Abstract: mounting pad
Contextual Info: Mounting pad of SOJ The nominal dimensions of an SOJ package are determined by the package width E . The center-to-center distance between the mounting pad arrays of an SOJ ( e1 ) is equal to the distance between the pin arrays, and the pad pitch is equal to the pin pitch e . Figure 1-11 shows the mounting

SOJ package MSL

Abstract: 8361H Cypress soj 36 140C JESD22
Contextual Info: Cypress Semiconductor Qualification Report QTP# 98148 VERSION 1.0 July, 1998 36 Ld, 400-mil SOJ Package Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 36 Ld, 400-mil SOJ QTP# 98148, V. 1.0 Page 2 of 4 July, 1998 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION

AS5C512K8ECJ-15

Abstract: QV smd 10 35L st diode cross reference AS5C512K8 AS5C512K8DJ 12L marking AS5C512 5962-9560004mma AS5C512K8ECJ
Contextual Info: SRAM AS5C512K8 512K x 8 SRAM PIN ASSIGNMENT Top View HIGH SPEED SRAM with REVOLUTIONARY PINOUT 36-Pin SOJ (DJ, ECJ & SOJ) 36-Pin CLCC (EC) AVAILABLE AS MILITARY SPECIFICATIONS •SMD 5962-95600 •SMD 5962-95613 •MIL-STD-883 FEATURES • Ultra High Speed Asynchronous Operation

HB56D436

Abstract: HM514100
Contextual Info: HB56D436 Series 4,194,304-word x 36-bit High Density Dynamic RAM Module Description The HB56D436 is a 4 M × 36 dynamic RAM module, mounted 8 pieces of 16-Mbit DRAM HM5117400BS sealed in SOJ package and 4 pieces of 4-Mbit DRAM (HM514100CS) sealed in SOJ

HB56G136

Contextual Info: HB56G136 Series 1,048,576-word x 36-bit High Density Dynamic RAM Module Description The HB56G136 is a 1M × 36 dynamic RAM module, mounted 2 pieces of 16-Mbit DRAM HM5118160AJ sealed in SOJ package and 2 pieces of 2-Mbit DRAM (HM512200BS) sealed in SOJ

5962-9561309HZC

Abstract: 5962-9560003MNA SMD 10 - 25L
Contextual Info: SRAM AS5C512K8 512K x 8 SRAM PIN ASSIGNMENT Top View HIGH SPEED SRAM with REVOLUTIONARY PINOUT 36-Pin SOJ (DJ, ECJ & SOJ) 36-Pin CLCC (EC) AVAILABLE AS MILITARY SPECIFICATIONS •SMD 5962-95600 •SMD 5962-95613 •MIL-STD-883 FEATURES • Ultra High Speed Asynchronous Operation

5962-956001

Abstract: 5962-9561310HUA 5962-9560009QM 5962-9561329HN soj 36 10 35L A8 AS5C512 AS5C
Contextual Info: SRAM AS5C512K8 512K x 8 SRAM PIN ASSIGNMENT Top View HIGH SPEED SRAM with REVOLUTIONARY PINOUT 36-Pin SOJ (DJ, ECJ & SOJ) 36-Pin CLCC (EC) AVAILABLE AS MILITARY SPECIFICATIONS •SMD 5962-95600 •SMD 5962-95613 •MIL-STD-883 FEATURES • Ultra High Speed Asynchronous Operation

max3808

Contextual Info: HB56G136 Series 1,048,576-word x 36-bit High Density Dynamic RAM Module HITACHI Description The HB56G136 is a 1M x 36 dynamic RAM module, mounted 2 pieces of 16-Mbit DRAM HM5118160 AJ sealed in SOJ package and 2 pieces of 2-Mbit DRAM (HM512200BS) sealed in SOJ package.

Contextual Info: HB56G236 Series 2,097,152-word x 36-bit High Density Dynamic RAM Module HITACHI Description The HB56G236 is a 2M x 36 dynamic RAM module, mounted 4 pieces of 16-Mbit DRAM HM5118160AJ sealed in SOJ package and 4 pieces of 2-Mbit DRAM (HM512200BS) sealed in SOJ package.

Contextual Info: HB56D836 Series 8,388,608-word x 36-bit High Density Dynamic RAM Module HITACHI Description The HB56D836 is a 8 M x 36 dynamic RAM module, mounted 16 pieces of 16-Mbit DRAM HM5117400BS sealed in SOJ package and 8 pieces of 4-Mbit DRAM (HM514100CS) sealed in SOJ

hy5118160b

Contextual Info: «HYUNDAI HYM536220A W-Series 2M X 36-bit CMOS DRAM MODULE DESCRIPTION The HYM536220A is a 2M x 36-bit Fast page mode CMOS DRAM module consisting of four HY5118160B in 42/42 pin SOJ and eight HY531000Ain 20/26pin SOJ on a 72 pin glass-epoxy printed circuit board. 0.22nFdecoupling

HB56D436BR-6A

Abstract: HB56D436SBR-7AC HB56D436 HM5117400AS HB56D436BR-7A HB56D436BR-6AC HB56D436SBR-7A
Contextual Info: HB56D436 Series 4,194,304-word x 36-bit High Density Dynamic RAM Module The HB56D436 is a 4 M × 36 dynamic RAM module, mounted 8 pieces of 16-Mbit DRAM HM5117400AS sealed in SOJ package and 4 pieces of 4-Mbit DRAM (HM514100BS/CS) sealed in SOJ package. An outline of the

PNY Technologies

Abstract: 72 simm function block diagram of FPM FPM RAM
Contextual Info: 32M x 36 Bit 5V FPM SIMM Fast Page Mode FPM DRAM SIMM 363206-S54m24JL 72 Pin 32Mx36 FPM SIMM Unbuffered, 4k Refresh, 5V General Description The module is a 32Mx36 bit dynamic RAM module consisting of (16) 16Mx4 (SOJ) DRAMs and (8) 16MX1 (SOJ) DRAMS. The module is unbuffered and supports Fast

Contextual Info: @ LG Semicon. Co., LTD._ Description Features The GMM7361000DS/SG is a 1M x 36 bits Dynamic RAM MODULE which is assembled 8 pieces of 1M x 4bit DRAMs in 20/26 pin SOJ package and 4 pieces of 1M x 1bit DRAMs in 20/26 pin SOJ package on both sides the

hb56d836sbr-7a

Abstract: HB56D836BR-6A HB56D836SBR-6A HB56D836 HM5117400AS HB56D836BR7AC
Contextual Info: HB56D836 Series 8,388,608-word x 36-bit High Density Dynamic RAM Module The HB56D836 is a 8 M × 36 dynamic RAM module, mounted 16 pieces of 16-Mbit DRAM HM5117400AS sealed in SOJ package and 8 pieces of 4-Mbit DRAM (HM514100BS/CS) sealed in SOJ package. An outline of the

Contextual Info: HB56D436 Series 4,194,304-word x 36-bit High Density Dynamic RAM Module HITACHI Description The HB56D436 is a 4 M x 36 dynamic RAM module, mounted 8 pieces of 16-Mbit DRAM HM5117400BS sealed in SOJ package and 4 pieces of 4-Mbit DRAM (HM514100CS) sealed in SOJ package. An outline of

HB56D136

Abstract: hb56d136bv-7b
Contextual Info: HB56D136 Series 1,048,576-word x 36-bit High Density Dynamic RAM Module The HB56D136 is a 1M × 36 dynamic RAM module, mounted 8 pieces of 4-Mbit DRAM HM514400BS/BLS sealed in SOJ package and 4 pieces of 1-Mbit DRAM (HM511000AJP/ALJP) sealed in SOJ package. An outline of the