SOIC 8 Search Results

s34 diode

Abstract: s16 transistor S28 Package 24 lead s13 package S33 Package S8 Package soic 300 18 SOIC 16 Package 330-MIL
Contextual Info: Package Diagram Plastic Small Outline ICs 16-Lead Molded SOIC S1 18-Lead 300-Mil Molded SOIC S3 1 Package Diagram 20-Lead (300-Mil) Molded SOIC S5 8-Lead (150-Mil) SOIC S8 2 Package Diagram 24-Lead (300-Mil) Molded SOIC S13 14-Lead SOIC S14 3 Package Diagram

AS002R2-12

Contextual Info: Diversity Switches in SOIC Packages SOIC 8 SOIC 14 Insertion Loss max dB Isolation (min) dB Power Handling dBm Package Style DC - 2.5 0 .9 - 1.3 3 5 -1 8 30 SOIC 8 New, Low Cost Diversity Switch ADH01D2-24 D C - 1.6 0 5 - 1 .2 3 5 -1 7 40 SOIC 14 New, High Power

150mil

Abstract: WINBOND Serial flash cross reference SST25LF040-33-4C-S2A M25P80-VMW6G SST25LF080-33-4C-S2AE AT25F4096N W25P40VSNIG SST25LF020-33-4C-SAE w25p20vsnig 200mil
Contextual Info: Serial Flash Cross Reference Package Density ST Micro 8-pin SOIC 150mil 8-pin SOIC 150mil Green 1M-bit M25P10-AVMN6 SST25VF010-20-4C-SA M25P10-AVMN6G SST25VF010-20-4C-SAE AT25F1024AN-10SU-2.7 W25P10VSNI W25P10VSNIG 8-pin SOIC 150mil 8-pin SOIC 150mil Green

Contextual Info: Surface Mount SOIC Resistor Networks Surface Mount SOIC Resistor • Tested for COTSNetworks applications SOIC Series · Both narrow and wide body versions available · Standard SOIC Series JEDEC 8, 14, 16, and 20 pin packages Ultra-stable TaNSil resistors on silicon substrates

Contextual Info: ACCUTEK Wide SOIC to Narrow SOIC Adapter Modules MICROCIRCUIT CORPORATION SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek family of SOIC Adapter Modules permit the connection

tc818a

Abstract: OP AMP
Contextual Info: MIXED-SIGNAL ix±_ STANDARD PRECISION LOW POWER MICRO POWER 1.2xV 2.5V TC04A/B 2%, 50ppm/°C TO-92 and 8-Pin SOIC TC05A/B 2%, 50ppm/°C TO-92 and 8-Pin SOIC LM285/385-1.2 1%, 30ppm/°C TO-92 and 8-Pin SOIC LM285/385-2.5V 1%, 30ppm/°C TO-92 and 8-Pin SOIC

HVD178x

Contextual Info: RHL QFN D-8 (SOIC) SN65HVD30 – SN65HVD35 D-14 (SOIC) www.ti.com . SLLS665G – SEPTEMBER 2005 – REVISED DECEMBER 2008

Contextual Info: RHL QFN D-8 (SOIC) SN65HVD30 – SN65HVD35 D-14 (SOIC) www.ti.com . SLLS665G – SEPTEMBER 2005 – REVISED DECEMBER 2008

UC1573

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 16-Jul-2010 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty UC1573J OBSOLETE CDIP J 8 UC2573D ACTIVE SOIC D 8 75 UC2573DG4 ACTIVE SOIC D 8 UC2573DTR ACTIVE SOIC D UC2573DTRG4

SN65HVD30

Abstract: SN65HVD31 SN65HVD35
Contextual Info: RHL QFN D-8 (SOIC) SN65HVD30 – SN65HVD35 D-14 (SOIC) www.ti.com . SLLS665G – SEPTEMBER 2005 – REVISED DECEMBER 2008

S16-4148

Abstract: S16-4150 MARKING CODE S16 marking S16
Contextual Info: SOIC Reliability & Qualification Data This is the reliability and qualification data for the S16-4148 and S16-4150. Features Mechanical 8 Diode Array SOIC 16 Pin Surface Mount Package UL 94V-0 Flammability Classification Molded SOIC 16 Pin Weight: 2.5 grams approximate

NDS spec

Abstract: 9959 CBVK741B019 F011 F63TNR F852 FDS9953A L86Z fairchild soic marking fairchild NDS
Contextual Info: SOIC-8 Tape and Reel Data SOIC 8lds Packaging Configuration: Figure 1.0 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES N NT IO NS AT TERVE PR ECAUTIO OBSE Packaging Description: SOIC-8 parts are shipped in tape. The carrier tape is

DS1425L-F5

Abstract: rtc ds1307 dallas ds2501 dallas ds2501 Datasheet dallas ds1280 DS2501 ds1642-150 DS1669 replacement ds2501 Datasheet DS1608S
Contextual Info: ORDERING INFORMATION DEVICE DS0621–SDK DS0630 DS1000 DS1000–IND DS1003 DS1004 DS1005 DS1007 DS1010 DS1012 DS1013 DS1020 DS1021 DS1033 DS1035 DS1040 PACKAGE TYPE Software Software 14–Pin DIP 8–Pin DIP 16–Pin SOIC 8–Pin SOIC 8–Pin DIP 8–Pin SOIC

soic8

Contextual Info: P a s s i v C o jmccM p o n e n t s ^ K WHY i-u- Filters Filtering Freq. MHz SMT package Part No. High Pass High Pass Low Pass Low Pass 800 - 3000 1700-3000 DC-1000 DC-2000 SOIC-8 SOIC-8 SOIC-8 SOIC-8 FL05-0001-G FL05-0002-G FL07-0002-G FL07-0002-G Diplexing

cd 4070 data

Abstract: AZG489 AZG489D AZG489DTR1 AZG489DTR2 FU10
Contextual Info: ARIZONA MICROTEK, INC. AZG489 PECL Video Cable Driver FEATURES • • • • PACKAGE AVAILABILITY 720 Mb/s Typical Data Rate 1.6V Typical Output Swing Independent Outputs Operate in Phase 5V±10% Supply Voltage PACKAGE SOIC 8 SOIC 8 T&R SOIC 8 T&R PART NO.

1109814

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

TQFN 48 7X7

Abstract: QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel
Contextual Info: TAPE AND REEL PACKAGING DEVICE TYPE BODY SIZE PIN COUNT TAPE WIDTH TAPE PITCH REEL SIZE QUANTITY PER REEL ORIENTATION IN TAPE SOIC .150 8 12mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 14 16mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 16 16mm 8mm 13 inch 2500 FIGURE 2

AS338-12

Abstract: EUA SOIC
Contextual Info: GaAs MMIC SPDT FET Switch in 8 Lead SOIC Non-Reflective DC-2.5 GHz EUA lpha AS338-12 Features Low DC Power Consumption Non-Reflective Surface Mount 8 Lead SOIC Package Description The AS338-12 is a low cost MMIC SPD T non-reflective switch in a plastic SOIC package for

DIP to SOIC Adapter Modules

Contextual Info: ACCUTEK DIP to SOIC Adapter Modules MICROCIRCUIT CORPORATION DIP to SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek SOIC family of Adapter Modules permit the connection of older Dual-Inline-Packages onto circuit board sites which are designed for standard pitch SOIC devices.

1109814

Abstract: 8 soic pcb footprint 18012 ASTM-B16-85
Contextual Info: Part No. 1109814/4102-113-18 SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

TSOP to SOIC BGA Adapter Modules

Contextual Info: Thin Small Outline Packages TSOP to SOIC BGA Adapters ACCUTEK MICROCIRCUIT CORPORATION TSOP to SOIC BGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description The Accutek family of SOIC Adapter Modules permit the connection

LD128

Abstract: PPF leadframe
Contextual Info: LEADFRAME data sheet SOIC Features Small Outline IC Package SOIC : SOIC is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package runs in very high volume and

qsop 16 pcb footprint

Abstract: qsop 24 footprint 16 QSOP pcb footprint 16 soic pcb footprint qsop 20 pcb footprint footprint soic AKB163237 AKL163220 footprint soic 20 AKB203237
Contextual Info: Accutek Microcircuit Corporation SOIC Adapter Modules SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek SOIC family of Adapter Modules permit the connection of smaller fine pitch TSOP and SSOP packages onto circuit board

NTMD2P01R2

Abstract: NTMD2P01R2G
Contextual Info: NTMD2P01R2 Power MOSFET −2.3 Amps, −16 Volts Dual SOIC−8 Package Features • • • • • http://onsemi.com High Efficiency Components in a Single SOIC−8 Package High Density Power MOSFET with Low RDS on Logic Level Gate Drive SOIC−8 Surface Mount Package,