SOIC 28 Search Results

s34 diode

Abstract: s16 transistor S28 Package 24 lead s13 package S33 Package S8 Package soic 300 18 SOIC 16 Package 330-MIL
Contextual Info: Package Diagram Plastic Small Outline ICs 16-Lead Molded SOIC S1 18-Lead 300-Mil Molded SOIC S3 1 Package Diagram 20-Lead (300-Mil) Molded SOIC S5 8-Lead (150-Mil) SOIC S8 2 Package Diagram 24-Lead (300-Mil) Molded SOIC S13 14-Lead SOIC S14 3 Package Diagram

Contextual Info: ACCUTEK Wide SOIC to Narrow SOIC Adapter Modules MICROCIRCUIT CORPORATION SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek family of SOIC Adapter Modules permit the connection

AS002R2-12

Contextual Info: Diversity Switches in SOIC Packages SOIC 8 SOIC 14 Insertion Loss max dB Isolation (min) dB Power Handling dBm Package Style DC - 2.5 0 .9 - 1.3 3 5 -1 8 30 SOIC 8 New, Low Cost Diversity Switch ADH01D2-24 D C - 1.6 0 5 - 1 .2 3 5 -1 7 40 SOIC 14 New, High Power

B1340

Abstract: sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E
Contextual Info: Q1-2004-MICREL- PKG STORAGE LIFE TEST BAKE TA = + 150C Package Family PKG Type Lds Device WM W-SOIC W-SOIC W-SOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC 16 16 16 20 28 28 28 28 28 28 28 MIC2027 MIC2527 MIC2527 MIC2177 MIC1700B SY69952ZC SY69952ZC

HVD178x

Contextual Info: RHL QFN D-8 (SOIC) SN65HVD30 – SN65HVD35 D-14 (SOIC) www.ti.com . SLLS665G – SEPTEMBER 2005 – REVISED DECEMBER 2008

Contextual Info: RHL QFN D-8 (SOIC) SN65HVD30 – SN65HVD35 D-14 (SOIC) www.ti.com . SLLS665G – SEPTEMBER 2005 – REVISED DECEMBER 2008

DIP to SOIC Adapter Modules

Contextual Info: ACCUTEK DIP to SOIC Adapter Modules MICROCIRCUIT CORPORATION DIP to SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek SOIC family of Adapter Modules permit the connection of older Dual-Inline-Packages onto circuit board sites which are designed for standard pitch SOIC devices.

SN65HVD30

Abstract: SN65HVD31 SN65HVD35
Contextual Info: RHL QFN D-8 (SOIC) SN65HVD30 – SN65HVD35 D-14 (SOIC) www.ti.com . SLLS665G – SEPTEMBER 2005 – REVISED DECEMBER 2008

TSOP to SOIC BGA Adapter Modules

Contextual Info: Thin Small Outline Packages TSOP to SOIC BGA Adapters ACCUTEK MICROCIRCUIT CORPORATION TSOP to SOIC BGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description The Accutek family of SOIC Adapter Modules permit the connection

DS1425L-F5

Abstract: rtc ds1307 dallas ds2501 dallas ds2501 Datasheet dallas ds1280 DS2501 ds1642-150 DS1669 replacement ds2501 Datasheet DS1608S
Contextual Info: ORDERING INFORMATION DEVICE DS0621–SDK DS0630 DS1000 DS1000–IND DS1003 DS1004 DS1005 DS1007 DS1010 DS1012 DS1013 DS1020 DS1021 DS1033 DS1035 DS1040 PACKAGE TYPE Software Software 14–Pin DIP 8–Pin DIP 16–Pin SOIC 8–Pin SOIC 8–Pin DIP 8–Pin SOIC

LD128

Abstract: PPF leadframe
Contextual Info: LEADFRAME data sheet SOIC Features Small Outline IC Package SOIC : SOIC is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package runs in very high volume and

qsop 16 pcb footprint

Abstract: qsop 24 footprint 16 QSOP pcb footprint 16 soic pcb footprint qsop 20 pcb footprint footprint soic AKB163237 AKL163220 footprint soic 20 AKB203237
Contextual Info: Accutek Microcircuit Corporation SOIC Adapter Modules SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek SOIC family of Adapter Modules permit the connection of smaller fine pitch TSOP and SSOP packages onto circuit board

NTMD2P01R2

Abstract: NTMD2P01R2G
Contextual Info: NTMD2P01R2 Power MOSFET −2.3 Amps, −16 Volts Dual SOIC−8 Package Features • • • • • http://onsemi.com High Efficiency Components in a Single SOIC−8 Package High Density Power MOSFET with Low RDS on Logic Level Gate Drive SOIC−8 Surface Mount Package,

Marking Code A27 DIODE

Contextual Info: NTMD2P01R2 Power MOSFET −2.3 Amps, −16 Volts Dual SOIC−8 Package Features • • • • • http://onsemi.com High Efficiency Components in a Single SOIC−8 Package High Density Power MOSFET with Low RDS on Logic Level Gate Drive SOIC−8 Surface Mount Package,

ED3P03

Abstract: NTMD3P03R2 NTMD3P03R2G
Contextual Info: NTMD3P03R2 Power MOSFET −3.05 Amps, −30 Volts Dual P−Channel SOIC−8 Features • • • • • • • • High Efficiency Components in a Dual SOIC−8 Package High Density Power MOSFET with Low RDS on Miniature SOIC−8 Surface Mount Package − Saves Board Space

E3P03

Abstract: NTMS3P03R2 NTMS3P03R2G
Contextual Info: NTMS3P03R2 Power MOSFET −3.05 Amps, −30 Volts P−Channel SOIC−8 http://onsemi.com Features • • • • • • • • High Efficiency Components in a Single SOIC−8 Package High Density Power MOSFET with Low RDS on Miniature SOIC−8 Surface Mount Package − Saves Board Space

Contextual Info: NTMD3P03R2 Power MOSFET −3.05 Amps, −30 Volts Dual P−Channel SOIC−8 Features • • • • • • • • High Efficiency Components in a Dual SOIC−8 Package High Density Power MOSFET with Low RDS on Miniature SOIC−8 Surface Mount Package − Saves Board Space

SOIC-16

Abstract: PLCC-20 SIP 9 SOIC-8 lr 014
Contextual Info: PACKAGE DESIGNATORS A DIP 14 to 40 pins B (Semi-Tab DIP) 8 to 24 pins Dwg. OA-004-18 Dwg. OA-004-17 K (SIP) 4 pins KA (SIP) 5 pins LL, LR, or LT (SOT) Dwg. OA-014-64 L (SOIC) 8, 14, or 16 leads Dwg. OA-008-3 LB (Semi-Tab SOIC) 16 to 24 leads LW (Wide-Body SOIC) 16 to 28 leads

TQFN 48 7X7

Abstract: QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel
Contextual Info: TAPE AND REEL PACKAGING DEVICE TYPE BODY SIZE PIN COUNT TAPE WIDTH TAPE PITCH REEL SIZE QUANTITY PER REEL ORIENTATION IN TAPE SOIC .150 8 12mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 14 16mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 16 16mm 8mm 13 inch 2500 FIGURE 2

AS338-12

Abstract: EUA SOIC
Contextual Info: GaAs MMIC SPDT FET Switch in 8 Lead SOIC Non-Reflective DC-2.5 GHz EUA lpha AS338-12 Features Low DC Power Consumption Non-Reflective Surface Mount 8 Lead SOIC Package Description The AS338-12 is a low cost MMIC SPD T non-reflective switch in a plastic SOIC package for

ir2131

Contextual Info: IR2131 28 Lead PDIP wide body 28 Lead SOIC (wide body) 01-3024 02

Contextual Info: Low Cost Five-way GMIC SMT Power Divider, 1850 - 1990 MHz Features • • • • • • • DS55-0003 V2 SOIC-16 Small Size, Low Profile Superior Repeatability Lot-to-Lot Variation Industry Standard SOIC-16 SMT Plastic Package Typical Isolation: 28 dB

soic 28 wide body

Contextual Info: IR2131 28 Lead PDIP wide body 28 Lead SOIC (wide body) 01-3024 02

soic 28 wide body

Abstract: ir2131
Contextual Info: IR2131 28 Lead PDIP wide body 28 Lead SOIC (wide body) 8 01-3040 01