SOIC 16 JEDEC PACKAGE OUTLINE Search Results

MS-012 soic 16

Abstract: MS-012 M16A jedec MS-012 soic 16 Jedec package outline
Contextual Info: Revised January 1999 Package M16A 16-Lead Small Outline Integrated Circuit SOIC , JEDEC MS-012, 0.150” Narrow Package Number M16A 1999 Fairchild Semiconductor Corporation m16a.prf www.fairchildsemi.com Package M16A January 1999

soic 16 Jedec package outline

Abstract: jedec MS-013 MS-013 M16B
Contextual Info: Revised January 1999 Package M16B 16-Lead Small Outline Intergrated Circuit SOIC , JEDEC MS-013, 0.300” Wide Package Number M16B 1999 Fairchild Semiconductor Corporation m16b.prf www.fairchildsemi.com Package M16B January 1999

74S133

Abstract: DM74S133 DM74S133M DM74S133N M16A MS-001 N16E 13-INPUT
Contextual Info: Revised April 2000 DM74S133 13-Input NAND Gate General Description This device contains a single gate which performs the logic NAND function. Ordering Code: Order Number Package Number Package Description DM74S133M M16A 16-Lead Small Outline Integrated Circuit SOIC , JEDEC MS-012, 0.150 Narrow

1256A-12

Abstract: 8 pin 393 atmel 0420
Contextual Info: Package Drawing 16S2, 16-lead, 0.300" Wide, Plastic Gull Wing Small Outline JEDEC SOIC Dimensions in Inches and (Millimeters) 0.020 (0.508) 0.013 (0.330) 0.299 (7.60) 0.291 (7.39) PIN 1 0.420 (10.7) 0.393 (9.98) 0.050 (1.27) BSC 0.394 (10.00) 0.386 (09.80)

16s1

Contextual Info: Package Drawing 16S1, 16-lead, 0.150" Wide, Plastic Gull Wing Small Outline JEDEC SOIC Dimensions in Inches and (Millimeters) 0.020 (0.51) 0.013 (0.33) 0.158 (4.00) 0.150 (3.80) PIN 1 0.244 (6.20) 0.228 (5.80) .050 (1.27) BSC 0.394 (10.00) 0.386 (09.80)

jedec MS-012-AC

Abstract: MS-012-AC
Contextual Info: Plastic Package Small Outline Plastic Package SOIC M16.15 (JEDEC MS-012-AC ISSUE C) N 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004)

MS-013-AA

Contextual Info: Plastic Package Small Outline Plastic Package SOIC M16.3 (JEDEC MS-013-AA ISSUE C) 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004)

jedec MS-013

Abstract: MS-013-AA
Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.3 (JEDEC MS-013-AA ISSUE C) 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B1 2 3 L SEATING PLANE -A- A D hx -CA1 B C 0.10(0.004)

jedec MS-012-AC

Abstract: MS-012-AC
Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.15 (JEDEC MS-012-AC ISSUE C) N INDEX AREA H 0.25(0.010) M 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M E INCHES -B- 1 2 SYMBOL 3 L SEATING PLANE -A- h x 45o A D -C-

jedec MS-012-AC

Abstract: MS-012-AC MS-012AC
Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.15 (JEDEC MS-012-AC ISSUE C) N INDEX AREA H 0.25(0.010) M 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1

MS-013-AA

Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.3 (JEDEC MS-013-AA ISSUE C) N INDEX AREA 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE H 0.25(0.010) M B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M

98ARL10519D

Abstract: JESD51-5 JEDEC JESD51-8 BGA AN2409 JESD51-7 JESD51-51 jesd51 8 54ld JESD51-8
Contextual Info: Freescale Semiconductor Application Note AN2409 Rev. 1.0, 12/2005 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,

Contextual Info: Freescale Semiconductor Application Note AN2409 Rev. 2.0, 4/2013 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,

MTTF analysis data

Abstract: JEDEC JESD51-8 BGA 98ARL10519D JESD51-51 QFN PACKAGE thermal resistance JESD51-5 JESD51-7 jesd51 8 1147 x motorola SOICW-32
Contextual Info: Freescale Semiconductor, Inc. Application Note AN2409/D Rev. 0, 01/2003 Small Outline Integrated Circuit-Fine Pitch Package SOIC Freescale Semiconductor, Inc. CONTENTS 1.0 PURPOSE 3 2.0 SCOPE 3 3.0 SOIC PACKAGE 3 3.1 PACKAGE DESCRIPTION 3 3.2 PACKAGE DIMENSION

Contextual Info: Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB ExposedPad Thin Shrink Small Outline Package TSSOP , Micro Small Outline Package (MSOP), Small Outline IC Package (SOIC), Shrink Small Outline (SSOP)

footprint jedec MS-026 TQFP AEB

Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS040D − Revised October 2003 The CD4042B types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffixes , 16-lead dual-in-line plastic package (E suffix), 16-lead small-outline packages (D, DR, DT, DW, DWR, and NSR

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS040D − Revised October 2003 The CD4042B types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffixes , 16-lead dual-in-line plastic package (E suffix), 16-lead small-outline packages (D, DR, DT, DW, DWR, and NSR

CD4014B

Abstract: CD4014BE CD4014BEE4 CD4014BF3A CD4014BM CD4014BM96 CD4014BM96E4 CD4014BM96G4 CD4014BME4 CD4014BMG4
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS024C − Revised October 2003 The CD4014B and CD4021b series types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR

CD4043BEE4

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS041D − Revised October 2003 The CD4043B and CD4044B types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (D, DR, DT, DW, DWR,

CD4014B

Abstract: CD4014BE CD4014BEE4 CD4014BF3A CD4014BM CD4014BM96 CD4014BM96E4 CD4014BM96G4 CD4014BME4 CD4014BMG4
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS024C − Revised October 2003 The CD4014B and CD4021b series types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR

Contextual Info: PACKAGE soie DIAGRAM OUTLINES PACKAGE DIAGRAM OUTLINES SOIC C o n t i n u e d REVISIONS DWG § NOM N MAX T E S 0 18- -1 DWG § JEDEC VARIATION □ AA MIN DWG § S016- JEDEC VARIATION □ AB MIN NOM MAX S020- 2 JEDEC VARIATION T E NOM MAX T E S024- 2 NOM

LD128

Abstract: PPF leadframe
Contextual Info: LEADFRAME data sheet SOIC Features Small Outline IC Package SOIC : SOIC is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package runs in very high volume and

footprint jedec MS-026 TQFP

Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat