SOIC 08 Search Results

ic packages

Abstract: MO-137
Contextual Info: LEADFRAME data sheet ExposedPad SOIC/SSOP Features: ExposedPad SOIC/SSOP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power-constrained standard SOIC and SSOP packages. The ExposedPad SOIC/ SSOPs can increase heat dissipation by

Contextual Info: IPS022G/IPS024G Case Outline - 8 Lead SOIC 01-0021 08 Case Outline - 16 Lead SOIC narrow body 01-3064 00 www.irf.com 5

DS1425L-F5

Abstract: ds1480s F5 sot223 DS1868 DS75U ds1642-150 DS1669SN-10 DS1220Y-200IND ds1386-8-150 DS1251W-120
Contextual Info: DEVICE DS0621 DS1000 DS1000-IND DS1004 DS1005 DS1007 DS1010 DS1013 DS1020 PACKAGE TYPE OPERATING TEMPERATURORDERING RANGE CELSIUS NUMBER Software 8-Pin DIP 8-Pin SOIC 8-Pin SOIC T&R 8-Pin DIP 8-Pin SOIC 8-Pin SOIC T&R 8-Pin DIP 8-Pin DIP 8-Pin DIP 8-Pin DIP

DS1425L-F5

Abstract: rtc ds1307 dallas ds2501 dallas ds2501 Datasheet dallas ds1280 DS2501 ds1642-150 DS1669 replacement ds2501 Datasheet DS1608S
Contextual Info: ORDERING INFORMATION DEVICE DS0621–SDK DS0630 DS1000 DS1000–IND DS1003 DS1004 DS1005 DS1007 DS1010 DS1012 DS1013 DS1020 DS1021 DS1033 DS1035 DS1040 PACKAGE TYPE Software Software 14–Pin DIP 8–Pin DIP 16–Pin SOIC 8–Pin SOIC 8–Pin DIP 8–Pin SOIC

DS1669-100

Abstract: TQFP 100 pin Socket 4 pin dip switch DS2401 PACKAGE 16 pin DIP socket DS1804 NV 2 pin dip switch ds1232(ind) data sheet ds1642-150 DS1620S
Contextual Info: ORDERING INFORMATION DEVICE DS0621–SDK DS1000 DS1000–IND DS1003 DS1004 DS1005 DS1007 DS1010 DS1012 DS1013 DS1020 DS1021 DS1033 DS1035 DS1040 PACKAGE TYPE Software 14–Pin DIP 8–Pin DIP 16–Pin SOIC 8–Pin SOIC 8–Pin DIP 8–Pin SOIC 14–Pin DIP

EIA-608

Abstract: 125H Z86129 Z86130 Z86131 Z86129-12PSC v-chip
Contextual Info: PRELIMINARY PRODUCT SPECIFICATION 1 Z86129/130/131 1 NTSC LINE 21 DECODER FEATURES Devices Speed MHz Pin Count/ Package Types Standard Temp. Range On-Screen Display & Closed Captioning Z86129 Z86130 Z86131 12 12 12 18-Pin DIP, SOIC 18-Pin DIP, SOIC 18-Pin DIP, SOIC

18013

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

1109814

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

18012

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

1109814

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

1109814

Abstract: 8 soic pcb footprint 18012 ASTM-B16-85
Contextual Info: Part No. 1109814/4102-113-18 SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: Part No. 1109814/1109902 SOIC TO to Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

8 soic pcb footprint

Abstract: IPC4101A 1109814
Contextual Info: SOIC to TO Adapter RoHs Compliant FEATURES: • Lead Free RoHs/WEEE Compliant • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: g MOTOROLA QUAD 2-INPUT EXCLUSIVE-OR GATE QUAD 2-INPUT EXCLUSIVE-OR GATE FAST SCHOTTKY TTL VCC J SUFFIX CERAMIC CASE 632-08 N SUFFIX PLASTIC CASE 646-06 B D SUFFIX SOIC CASE 751A-02 ORDERING INFORMATION MC54FXXJ MC74FXXN MC74FXXD Ceramic Plastic SOIC

Contextual Info: MOTOROi-A TRIPLE 3-INPUT NAND GATE TRIPLE 3-INPUT NAND GATE FAST SCHOTTKY TTL vcc J SUFFIX CERAMIC CASE 632-08 N SUFFIX PLASTIC CASE 646-06 14 D SUFFIX SOIC CASE 751A-02 14 ORDERING INFORMATION MC54FXXJ MC74FXXN MC74FXXD Ceramic Plastic SOIC GUARANTEED OPERATING RANGES

SN54LSXXXJ

Contextual Info: <8> MOTOROLA SN54/74LS260 DUAL 5-INPUT NOR GATE DUAL 5-INPUT NOR GATE vcc LOW POWER SCHOTTKY J SUFFIX CERAMIC CASE 632-08 GND 1 N SUFFIX FrP csss, 1 D SUFFIX SOIC CASE 751A-02 5 ORDERING INFORMATION SN54LSXXXJ SN74LSXXXN SN74LSXXXD Ceramic Plastic SOIC GUARANTEED OPERATING RANGES

Z86CCP00ZAC

Abstract: ccp protocol Z86CCP00ZEM Z86E40 35 pin zif cable ZILOG MOUSE CONTROLLER
Contextual Info: CUSTOMER PROCUREMENT SPECIFICATION Z86CCP00ZEM 1 Z8 CCP IN-CIRCUIT EMULATOR FEATURES • Supported Products Packages Emulation OTP Programming 18-Pin PDIP Z86C02/03/C04/06/08/16 Z86E02/031/04/061/08 18-Pin SOIC N/A Z86E02/03/04/06/082 28-Pin PDIP, PLCC, SOIC

z86e2112psc

Abstract: Z86C1200ZEM Z86E0812PSC Z86C07 Z86E0812
Contextual Info: Z86C1200ZEM S UPPOR TP RODUCT Z86C1200ZEM ICEBOX FAMILY Z8 IN-CIRCUIT EMULATOR –C12 HARDWARE FEATURES • Supported Devices Package Emulation 18-Pin DIP Z86C04/07/08/ Z86E04/07/08 N/A 18-Pin SOIC 20-Pin DIP 20-Pin SOIC 20-Pin SSOP 28-Pin DIP 40-Pin DIP

IR2101

Contextual Info: IR2101/IR21014/IR2102/IR21024 8 Lead PDIP 01-3003 01 8 Lead SOIC 01-0021 08 8

led phototransistor pair

Abstract: t-1 ir phototransistor 213AT IL211AT IL212AT IL213AT VDE0884
Contextual Info: IL211AT/ 212AT/ 213AT Vishay Semiconductors Optocoupler, Phototransistor Output, With Base Connection in SOIC-8 package Features • Isolation Voltage, 3000 VRMS • Industry Standard SOIC-8A Surface Mountable Package • Compatible with Dual Wave, Vapor Phase and IR

Contextual Info: RELIABILITY DATA LTC5505/07/08/09/30/31/32/33 8/21/2006 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE SOIC/SOT/MSOP SSOP/TSSOP 155 0201 386 0302 541 • PRESSURE COOKER TEST AT 15 PSIG, +121°C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP QFN/DFN

CAT24C01

Contextual Info: CAT24C01 /02/04/08/16 1K/2K/4K/8K/16K-Bit Serial E2PROM FEATURES • 400 KHZ l2C Bus Compatible* ■ 1,000,000 Program/Erase Cycles ■ 1.8 to 6.0 Volt Operation ■ 100 Year Data Retention ■ Low Power CMOS Technology ■ 8-pin DIP, 8-pin SOIC or 14-pin SOIC Package