SOIC 08 Search Results

DS1425L-F5

Abstract: rtc ds1307 dallas ds2501 dallas ds2501 Datasheet dallas ds1280 DS2501 ds1642-150 DS1669 replacement ds2501 Datasheet DS1608S
Contextual Info: ORDERING INFORMATION DEVICE DS0621–SDK DS0630 DS1000 DS1000–IND DS1003 DS1004 DS1005 DS1007 DS1010 DS1012 DS1013 DS1020 DS1021 DS1033 DS1035 DS1040 PACKAGE TYPE Software Software 14–Pin DIP 8–Pin DIP 16–Pin SOIC 8–Pin SOIC 8–Pin DIP 8–Pin SOIC

1109814

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

1109814

Abstract: 8 soic pcb footprint 18012 ASTM-B16-85
Contextual Info: Part No. 1109814/4102-113-18 SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: MOTOROi-A TRIPLE 3-INPUT NAND GATE TRIPLE 3-INPUT NAND GATE FAST SCHOTTKY TTL vcc J SUFFIX CERAMIC CASE 632-08 N SUFFIX PLASTIC CASE 646-06 14 D SUFFIX SOIC CASE 751A-02 14 ORDERING INFORMATION MC54FXXJ MC74FXXN MC74FXXD Ceramic Plastic SOIC GUARANTEED OPERATING RANGES

Z86CCP00ZAC

Abstract: ccp protocol Z86CCP00ZEM Z86E40 35 pin zif cable ZILOG MOUSE CONTROLLER
Contextual Info: CUSTOMER PROCUREMENT SPECIFICATION Z86CCP00ZEM 1 Z8 CCP IN-CIRCUIT EMULATOR FEATURES • Supported Products Packages Emulation OTP Programming 18-Pin PDIP Z86C02/03/C04/06/08/16 Z86E02/031/04/061/08 18-Pin SOIC N/A Z86E02/03/04/06/082 28-Pin PDIP, PLCC, SOIC

z86e2112psc

Abstract: Z86C1200ZEM Z86E0812PSC Z86C07 Z86E0812
Contextual Info: Z86C1200ZEM S UPPOR TP RODUCT Z86C1200ZEM ICEBOX FAMILY Z8 IN-CIRCUIT EMULATOR –C12 HARDWARE FEATURES • Supported Devices Package Emulation 18-Pin DIP Z86C04/07/08/ Z86E04/07/08 N/A 18-Pin SOIC 20-Pin DIP 20-Pin SOIC 20-Pin SSOP 28-Pin DIP 40-Pin DIP

IR2101

Contextual Info: IR2101/IR21014/IR2102/IR21024 8 Lead PDIP 01-3003 01 8 Lead SOIC 01-0021 08 8

Contextual Info: RELIABILITY DATA LTC5505/07/08/09/30/31/32/33 8/21/2006 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE SOIC/SOT/MSOP SSOP/TSSOP 155 0201 386 0302 541 • PRESSURE COOKER TEST AT 15 PSIG, +121°C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP QFN/DFN

Contextual Info: VOD205T, VOD206T, VOD207T, VOD211T, VOD213T, VOD217T Vishay Semiconductors Optocoupler, Phototransistor Output, Dual Channel, SOIC-8 Package FEATURES A1 8C • Two channel coupler C2 7E • SOIC-8 surface mountable package A3 6C • Standard lead spacing of 0.05"

VOD205

Abstract: VOD205T
Contextual Info: VOD205T, VOD206T, VOD207T, VOD211T, VOD213T, VOD217T Vishay Semiconductors Optocoupler, Phototransistor Output, Dual Channel, SOIC-8 Package FEATURES A1 8C • Two channel coupler C2 7E • SOIC-8 surface mountable package A3 6C • Standard lead spacing of 0.05"

AT88SC1604

Abstract: AT88SC1608 AT88SC1601 09CT Module Size AT88SC101 AT88SC102 AT88SC153 AT45DB021 at24c02 AT24C32
Contextual Info: Secure Memories in Standard Packages Ordering Code: 10SC Ordering Code: 10WC 8S1, 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline JEDEC SOIC Products: AT88SC153 8S2, 8-lead, 0.210" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC) Products: AT88SC1608, AT88SC153

DIN 58405

Abstract: ILD1207T ILD1205T ILD1206T VDE0884
Contextual Info: ILD1205T/ 1206T/ 1207T Vishay Semiconductors Optocoupler, Phototransistor Output, Dual Channel, SOIC-8 package, 110 °C Rated Features • • • • • Operating temperature from - 55 °C to + 110 °C Two Channel Coupler SOIC-8 Surface Mountable Package

SOIC8 package

Contextual Info: IL205AT/206AT/207AT/208AT Vishay Semiconductors Optocoupler, Phototransistor Output, with Base Connection in SOIC-8 package FEATURES • High BVCEO, 70 V • Isolation test voltage, 4000 VRMS A 1 8 NC • Industry standard mountable package SOIC-8A surface

M0680

Abstract: m068 m043 821-M0776 821-M0773
Contextual Info: T3/DS3/E3/STS-1 TRANSFORMER Dual, SOIC, 1500Vrms, Standard and Extended Temperature Range E & E Magnetic Products Limited Dual SOIC package contains both transmit and receive transformers Models designed for leading transceiver ICs Return loss meets requirements of G.703

R411

Contextual Info: RELIABILITY DATA LTC2400/08/10/12/13/14/15/18/30/31/36/39 8/21/2006 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE SOIC/SOT/MSOP SSOP/TSSOP 154 9845 478 0001 632 • PRESSURE COOKER TEST AT 15 PSIG, +121°C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP

Contextual Info: ILD1205T/1206T/1207T Vishay Semiconductors Optocoupler, Phototransistor Output, Dual Channel, SOIC-8 package, 110 °C Rated Features • Operating temperature from - 55 °C to + 110 °C • Two Channel Coupler e3 • SOIC-8 Surface Mountable Package • Isolation Test Voltage, 3000 VRMS

footprint WSON

Abstract: WSON WSON socket S72030-00-000 soic 16 Jedec package outline DSAE003956 land pattern wson
Contextual Info: Recommended Land Pattern for SST’s SOIC and WSON Packages Design Versatility of the Ultra-thin, Small Outline No-lead WSON Package Application Note May 2002 INTRODUCTION SOIC PACKAGE SST introduces an innovative, ultra-thin package for it’s Serial Flash family of devices.

Contextual Info: Series 350000 SOIC and SOJ-to-DIP Adapter FEATURES • A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout • Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for adaptors on 0.400 [10.16] or 0.600 [15.24] centers

AMS-QQ-N-290

Contextual Info: Series 350000-10-HT High-Temperature SOIC-to-DIP Adapter FEATURES • A cost-effective means of upgrading to SOIC without changing your PCB layout • Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for Adapters on 0.400 [10.16] or 0.600 [15.24] centers

SOIC-36

Abstract: SOIC-36 300 resistor pack RISC and CISC
Contextual Info: AN-08: QSOP Packages for 32-Bit Buses Q QSOP Packages Provide High Density In 32-Bit Bus Design Application Note AN-08 QSOP Quarter Size SOIC Outline Package packages for high-speed logic such as the FCT family provide 2.5 to 3 times the packing density of the SOIC packages they replace. QSOPs in bus designs provide the

Contextual Info: S Advanced CAT25C02/04/08/16/32 2K/4K/8K/16K/32K SPI Serial CMOS E2PROM FEATURES 1,000,000 Program/Erase Cycles • 10 MHz SPI Compatible 100 Year Data Retention ■ 1.8 to 6.0 Volt Operation Self-Timed Write Cycle ■ Hardware and Software Protection 8-Pin DIP/SOIC, 16-Pin SOIC and 14-Pin TSSOP

ltc4151

Contextual Info: RELIABILITY DATA LTC4151 / LTC6101 / LTC6102 / LTC6103 / LTC6104 8/13/2009 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP QFN/DFN 505 154 659 • PRESSURE COOKER TEST AT 15 PSIG, +121°C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP QFN/DFN 10,427

Contextual Info: ILD205T/206T/207T/211T/213T/217T Vishay Semiconductors Optocoupler, Phototransistor Output, Dual Channel, SOIC-8 package FEATURES • Two channel coupler • SOIC-8 surface mountable package A1 8C • Standard lead spacing of 0.05" C2 7E • Available only on tape and reel option

IPC4101A/26

Abstract: 14-350000-11-RC 16-350000-11-RC AMS-QQ-N-290 IS410
Contextual Info: Series 350000-11-RC RoHS/WEEE-Compliant SOIC-to-DIP Adapter FEATURES • A cost-effective means of upgrading to SOIC without changing your PCB layout • Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for adapters on 0.400 [10.16] or 0.600 [15.24] centers