SN63 PB37 ALPHA Search Results

PT1000 CONVERSION TABLE

Abstract: ER 2510 type bobbin RG-9B/U cable 2j 183j a431 csp 1040 39p SMD MARKING CODE 19l RG-180 connector 685 35K 222M SE SMD marking code BR24
Contextual Info: Table of Contents RF Inductors Surface Mount Radial Leaded Series EMI Series 4221 Series 4222 Series 8454 Series SMB 2.5 107 108 109 110 111 112 113 114 115 Surface Mount Series P1330 Series P1812 Series 2512 Series 3483 Series S3483 Series SDS130 Series SDS680

SAC387

Abstract: NXR-1400 tamura solder paste SN63 PB37 alpha PowerPAK 1212-8 stencil ekra e5 SAC387 solder MIL-STD-750 method 1037 UP78 SAC-387
Contextual Info: VISHAY SILICONIX Power MOSFETs Application Note 914 "PowerPAK 1212-8", The Proven Automotive Package By Kandarp Pandya INTRODUCTION This application note presents useful information on the PowerPAK 1212-8 to facilitate SQE and design engineers. Vishay introduced the PowerPAK power MOSFET package

AN1035

Abstract: tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602
Contextual Info: AN-1035 DirectFET TM Technology Board Mounting Application Note page Device construction 2 Design considerations 3 Assembly considerations 4 Mechanical test results 5 International Rectifier AN-1035 DirectFET Technology Board Mounting Application Note Introduction

SN63 PB37 alpha

Contextual Info: ^EDI Ceramic SOJ Electronic D#rign*lnc. Military Surface Mount Advances in the density ol Static SRAM and Dynamic Surface Mount Packages (DRAM) memory devices have resulted in increased die size Packaging of active devices for surface mount has been and elevated power requirements. With these issues, the

73494

Abstract: NXR-1400 ekra e5 ekra nicolet nxr1400 pyramax tamura solder paste IPC-9701 nicolet SAC387
Contextual Info: AN611 Vishay Siliconix Development of a Lead Pb -Free Soldering Process for PolarPAK By Kandarp Pandya ABSTRACT PolarPAK is one of the latest Vishay Siliconix SMD packages with enhanced thermal efficiency. Heat from the semiconductor MOSFET chip is removed from

tamura solder paste

Abstract: AN-1035 SN63 PB37 multicore SN62 PB36 ag2 kester SN62 MP AN1035 tamura solder paste PROFILE Litton SN62 PB36 ag2 100N
Contextual Info: Application Note AN-1035 DirectFET Technology Board Mounting Table of Contents Page Device construction Design considerations Assembly considerations Mechanical test results Model-specific data 2 2 3 5 8 DirectFET™ is a new surface mount semiconductor technology designed primarily for boardmounted power applications. It eliminates unnecessary elements of packaging that contribute to

663n

Abstract: technical data sheet of tamura solder paste 100N AN-1050 AN-1080 IEC 68-2-32 tamura solder paste
Contextual Info: Application Note AN-1035 DirectFET Technology Board Mounting Application Note Table of Contents Page Device construction . 2 Design considerations . 3 Assembly considerations. 4

varistor 10c 471

Abstract: 420 v 592 BC varistor PTGL07AS5R6K4B51A0 903M18 varistor 471 14 PTC 15K VARISTOR Y10 10c 471 varistor
Contextual Info: !注 ・本PDF产品目录是从株式会社村田制作所网站中下载的。规格若有变更，或若其中产品停产，恕不另行通知。请在订购之前向我公司销售代表或产品工程师查询。 ・本PDF产品目录所记载的产品规格，因受篇幅的限制，只提供了主要产品资料。在您订购前，必须确认规格表内容，或者互换协商定案图。

AN-1035

Abstract: technical data sheet of tamura solder paste 100N AN-1050 AN-1080 A142A 663n tamura solder paste PROFILE
Contextual Info: Application Note AN-1035 DirectFET Technology Board Mounting Application Note Table of Contents Page Device construction . 2 Design considerations . 3 Assembly considerations. 4

termistor ptc 10k

Abstract: termistor NTC 103 Termistor PTC NCP18XH103F0SRB NTC 503 3950 termistor ntc 10K 103 Catalog termistor termistor NTC 103 at NCP18WF104F3SRB termistor NTC 104
Contextual Info: !Note Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this PDF catalog to prevent smoking and/or burning, etc. This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.

chair massage circuit electronic

Abstract: transistor 1502c Senju M705-GRN360-K2-V SMD Transistor W01 Senju M705-GRN360-K2-V solder paste PRF15BB103RB6RC M705-GRN360-K2 PTGL07AR560M9B51A0 PRF18BB471QB5RB RAPID Charger CSA 160
Contextual Info: !Note • Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

M705-GRN360

Abstract: Senju M705-GRN360-K2-V solder paste PRF15BB103RB6RC PTGL07AR820M9B51A0 chair massage circuit electronic Thermistor PTC 265V Senju M705-GRN360-K2-V TIP 29 Powertransistor SMD resistors 2r2 M705-GRN360-K2
Contextual Info: !Note • Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

varistor 10c 471

Abstract: Senju M705-GRN360-K2-V Senju M705-GRN360-K2-V solder paste refrigerator PTC relay RMA9086 pth posistor ultrasonic distance sensor waterproof PRF18BC471QB5RB prf151 TIP 120c
Contextual Info: !Note • Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

QFN-48 LAND PATTERN

Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
Contextual Info: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when

termistor NTC 103

Abstract: termistor ptc 10k ntc termistor marking code ntc 0641 R03E termistor ntc 10K 103 NCP18XH103F0SRB NCP18XQ NCP15WF104F0SRC Catalog termistor
Contextual Info: !Note • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.

Senju M705-GRN360-K2-V datasheet

Abstract: M705-GRN360-K2-V Senju M705-GRN360-K2-V NCP18XH103D0SRB NCP18XH103F0SRB termistor NTC 103 NCG18XH103 termistor ptc 10k NCP18WF104F3SRB NCG18XH103F0SRB
Contextual Info: !Note • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.

M9627

Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire
Contextual Info: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in

marking code SMD Transistor 2ak

Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
Contextual Info: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written

GE4F

Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
Contextual Info: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written

NCP18XH103D0SRB

Abstract: heraeus pc 3000 NCG18XH103 NCP15XH103D0SRC NCP18WF104D0SRB NCG18XH103F0SRB Senju M705-grn360-k2-v NXFS15XH103 PRF18BE471QS5RB BC 5609
Contextual Info: !Note • Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

Contextual Info: Preliminary Technical Data Micropower Three-Axis ±2g/±4g/±8g Digital-Output MEMS Accelerometer ADXL362 FEATURES GENERAL DESCRIPTION Ultra low power Power can be derived from coin cell battery 1.8 µA @ 100 Hz ODR, 2.0V supply 3.0 µA @ 400 Hz ODR, 2.0V supply

ic 6116 datasheet from texas instruments

Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram
Contextual Info: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any

an 1025

Abstract: adxl362 adxl345
Contextual Info: Micropower, 3-Axis, ±2 g/±4 g/±8 g Digital Output MEMS Accelerometer ADXL362 Data Sheet FEATURES GENERAL DESCRIPTION Ultralow power Power can be derived from coin cell battery 1.8 µA @ 100 Hz ODR, 2.0 V supply 3.0 µA @ 400 Hz ODR, 2.0 V supply 270 nA motion activated wake-up mode

adxl362

Abstract: aCCELEROMETER APPLICATION CIRCUIT adxl345
Contextual Info: Micropower, 3-Axis, ±2 g/±4 g/±8 g Digital Output MEMS Accelerometer ADXL362 Preliminary Technical Data FEATURES GENERAL DESCRIPTION Ultralow power Power can be derived from coin cell battery 1.8 µA @ 100 Hz ODR, 2.0 V supply 3.0 µA @ 400 Hz ODR, 2.0 V supply