senju solder paste
Abstract: Senju
Text: !Solder and Flux 1 Solder Paste Reflow Soldering : Use RA type or equivalent type of solder paste (Sn:Pb:Ag=63wt%:35wt%:2wt%, Sn:Pb=60wt%:40wt% or Sn:Pb=63wt%:37wt%) For your reference, we are using 'SPT-70-0F-2063', manufactured by SENJU METAL INDUSTRY CO.,
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SPT-70-0F-2063'
senju solder paste
Senju
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Senju
Abstract: H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste SPT-70-OF-2063 Ultrasonic flow
Text: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).
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SPT-70-OF-2063
Senju
H60A
senju h63a
Senju Sn Pb 60 40 solder
senju solder paste
H63A
Senju metal solder paste
Ultrasonic flow
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Senju
Abstract: SPT-70-OF-2063 senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A
Text: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).
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SPT-70-OF-2063
Senju
senju h63a
senju solder paste
Senju flux
solder paste
H63A
Senju metal solder paste
H60A
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Untitled
Abstract: No abstract text available
Text: 0.5mm Pitch FPC/FFC/Membrane FF14A Series 【Cable Lock Type】 OUTLINE FF14A series is a 0.9mm height connector with a cable lock mechanism, in conformity to FPC of 0.5mm pitch and 0.2mm thick. Applicable cable is 0.2mm thick FPC, FFC and membrane. APPLICATIONS
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FF14A
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SENJU SOLDER PASTE
Abstract: Senju Senju metal solder paste Senju flux senju solder h63 37wt viscosity senju H63
Text: gSolder and Flux 1 Solder Paste 1) Flow Soldering : Use H60 (Sn:Pb=60wt%:40wt%) type, H63 (Sn:Pb=63wt%:37wt%) type or equivalent type of solder paste. 2) Reflow Soldering : Use RA type or equivalent type of solder paste (Sn:Pb:Ag=63wt%:35wt%:2wt%, Sn:Pb=60wt%:40wt% or Sn:Pb=63wt%:37wt%)
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SPT-70-0F-2063'
SENJU SOLDER PASTE
Senju
Senju metal solder paste
Senju flux
senju solder h63
37wt
viscosity
senju H63
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Senju M705
Abstract: Senju eco solder M705 Senju M705 m705 m705-tva Senju eco solder paste senju m705 solder paste Solder bar of Senju M705 M705-TVA03 Senju m705-tva senju solder bar
Text: Application Report SWPA156 – February 2009 Part – II Assembly Guidelines for 0.4-mm Package-On-Package Packages Steven Kummerl . OMAP ABSTRACT
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SWPA156
Senju M705
Senju eco solder M705
Senju M705 m705 m705-tva
Senju eco solder paste
senju m705 solder paste
Solder bar of Senju M705
M705-TVA03
Senju
m705-tva
senju solder bar
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Senju
Abstract: OX63-101F senju L1 flux
Text: LOW Ohm METAL PLATE Current sensing CERAMIC CASE BLR W NE STRUCTURE Ceramic case Termination electrode Resistive element metal plate Cement Heat sink LOW OHM 1 2 3 4 5 Identification produCt code coating color BLR marking None (White Ceramic) Alpha Numeric
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OX63-101F
D-25578
Senju
OX63-101F
senju L1 flux
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Senju
Abstract: MARKING CODE 2l marking code 1L
Text: POWER TYPE RESISTORS TECHNOLOGY OF TOMORROW METAL PLATE CERAMIC CASE BLR W NE STRUCTURE 1 Ceramic case 2 Termination electrode 3 Resistive element metal plate 4 Cement IDENTIFICATION PRODUCT CODE COATING COLOR MARKING BLR None (White Ceramic) Alpha Numeric
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OX63-101F
D-25578
Senju
MARKING CODE 2l
marking code 1L
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senju solder paste
Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.3 SOLDER SUPPLY PROCESS 2.3.1 SOLDER PASTE 1 Material Composition Soldering paste is mainly made from soldering powder and flux. Soldering powder makes up approximately 80-95wt% of soldering paste
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80-95wt%
63Sn/37Pb)
62Sn/36Pb/2Ag)
senju solder paste
senju printing speed
Senju metal solder paste
viscometer
Rosin Flux Type RMA
Senju flux
Senju
soldering paste
solder powder
62Sn36Pb2Ag
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Senju
Abstract: 15W 50 Ohm Ceramic Resistors
Text: LOW Ohm METAL PLATE Current sensing CERAMIC CASE BLR STRUCTURE Ceramic case Termination electrode Resistive element metal plate Cement Heat sink LOW OHM 1 2 3 4 5 Identification produCt code coating color marking None BLR (White Ceramic) Alpha Numeric (Type, R-value,
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OX63-101F
D-25578
Senju
15W 50 Ohm Ceramic Resistors
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senju m705 solder paste
Abstract: Solder bar of Senju M705 M705-221BM5-42-11
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-5-14-A
senju m705 solder paste
Solder bar of Senju M705
M705-221BM5-42-11
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4E *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-7-14-A
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senju m705 solder paste
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB50GT1C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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GM2BB50GT1C
LD-E7-2-14-A
senju m705 solder paste
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QT1C *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-1-14-A
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senju m705 solder paste
Abstract: 1mm 30 pin fpc connector datasheet 40 pin zif connector 1mm FPC FH26-35S-0.3SHW SN 0203 FPC CONNECTOR SENJU 221CM5 32 PIN FPC CONNECTOR FH26-13S-0.3SHW FH26-39S-0.3SHW
Text: 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors FH26 Series 1.0mm ●Space saving 51 pos. shown 3.2mm 16.8mm Metal fittings do no protrude outside of the connector body •Features 1. Extremely light weight ●Can be mounted over conductive traces.
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05N/pin
senju m705 solder paste
1mm 30 pin fpc connector datasheet
40 pin zif connector 1mm FPC
FH26-35S-0.3SHW
SN 0203
FPC CONNECTOR
SENJU 221CM5
32 PIN FPC CONNECTOR
FH26-13S-0.3SHW
FH26-39S-0.3SHW
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SnBiAg
Abstract: senju solder paste WALSIN philips mlcc Senju flux Senju oz
Text: Walsin Technology Corporation Lead Free MLCC, Chip-R, MLCI SMA Application Guideline HTTP://WWW.PASSIVECOMPONENT.COM Version 03 Page-1 Walsin Technology Corporation Background Sn/Pb Phase Diagram Engineering version Pb free solder material was started in 1995. A
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OZ-7085-340F-32-12)
2Ag-20In
SnBiAg
senju solder paste
WALSIN
philips mlcc
Senju flux
Senju oz
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QT4E *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-6-14-A
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Senju ESR-250
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2AA50GV6* *:1.2 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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GM2AA50GV6*
LD-E7-9-14-A
Senju ESR-250
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40 pin zif connector 1mm FPC
Abstract: g3244 M705-221CM5-42-10 Senju flux FH265 senju solder specification
Text: 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors FH26 Series 1.0mm ●Space saving 51 pos. shown 3.2mm 16.8mm Metal fittings do no protrude outside of the connector body •Features 1. Extremely light weight ●Can be mounted over conductive traces.
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05N/pin
40 pin zif connector 1mm FPC
g3244
M705-221CM5-42-10
Senju flux
FH265
senju solder specification
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QB2C *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-3-14-A
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QT4c
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QT4C *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-4-14-A
QT4c
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Untitled
Abstract: No abstract text available
Text: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2AA*QV6F *:27,30,35,40,50,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
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LD-E7-8-14-A
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101F
Abstract: No abstract text available
Text: BLR 角形セメント面実装抵抗器 Ceramic Case Surface Mount Resistors •構造図 Construction W L ③ H ④ ② t 抵抗器 Resistors CURRENT SENSING ① T W1 L1 ① ② ③ ④ ■特長 Features セラミックケース 電極 抵抗体 封入剤
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000pcs)
fluxOX63-101F
1000h
50N/0
101F
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Senju
Abstract: No abstract text available
Text: CURRENT SENSING BLR 角形セメント面実装抵抗器 Ceramic Case Surface Mount Resistors •構造図 Construction W L 電流検出用面実装抵抗器 Current Detecting Chip Resistors ③ H ④ t ② ① T W1 L1 ① ② ③ ④ ■特長 Features
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000pcs)
1000h
50N/0
OX63101F
fluxOX63101F
Senju
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