SDRAM, SMT, 128M X 16 Search Results

Contextual Info: Data Sheet Rev. 1.0 SDU12872H1BF2MT-50R 07-Apr-08 184-pin DDR1 PC3200 ECC DDR-SDRAM Module 01.2 5 13 4.7 DIMM 1GB DDR400 in TSOP Technique Features: • • • 184-pin 72-bit DDR1 Dual In-line Memory Module for desktop applications. DDR1-400 3.0-3-3 (CL-tRCD-tRP), 64Mx8 organized

CDC2509

Abstract: lvds to eDP TLC320AD55 TPIC1310 PC404 MSP50P37 MSP50C30 CDC2510 CDC509 CDC516
Contextual Info: ANALOG & MIXED-SIGNAL • M AY 1 9 9 8 VOLUME 27 Inside Showcase ■ PowerFLEX , a low-cost alternative to TO-220 Page 2 ■ High performance PLL clock drivers Page 3 ■ Digital control loop for 3-phase brushless dc motor Pages 4 and 5 ■ Cost-effective gigabit

ENE CP2211

Abstract: CP2211 Insyde bios manual PTC SY 16P SiS301LV QD141X1LH03-MP01 emp generator 36v SiS650 prestigio toko transformer color code
Contextual Info: PRESTIGIO CAVALIERE 141 TECHNICAL SERVICE MANUAL Prestigio Cavaliere 141 Technical Service Manual Contents 1. Hardware Engineering Specification - 3 1.1 Introduction- 3

toshiba satellite a10

Abstract: TX4925 PCMCIA SRAM Card AC97 TMPR4925XB NAND Flash memory controller toshiba trace code
Contextual Info: TOSHIBA RISC PROCESSOR INTEGRATED CIRCUIT TMPR4925XB TENTATIVE TOSHIBA RISC PROCESSOR TMPR4925XB 64-bit RISC MICROPROCESSOR 1. GENERAL DESCRIPTION The TMPR4925XB, to be referred as TX4925 MIPS RISC micro-controller is a highly integrated ASSP solution based on Toshiba’s TX49/H2 processor core, a 64-bit MIPS I,II,III

AS4DDR264M72PBG

Abstract: DDR2 SDRAM with SSTL_18 interface SDRAM, SMT, 128M X 16
Contextual Info: i PEM 4.8 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR264M72PBG 64Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp

csp defects

Abstract: handling damage LGA socket MANUAL PCB Samsung MCP 1mm pitch BGA socket air handling unit CRACK pcb substrate HCFC141B
Contextual Info: USER’S MANUAL Chip Scale Package • To make a win-win situation for CSP products supplier and customer, Samsung provides the information of CSP package’s characteristics and manuals to maintain high quality so that the problems of customer process can be minimized or prevented

mitsumi dc motor r-14

Abstract: QD141X1LH03 south bridge SIS 968 samsung crt monitor 56v circuit diagram SDR-081 F3437 mitac 8 diode S4 68a resistor 56E R87 motherboard mPGA478 circuit
Contextual Info: SERVICE MANUAL FOR 8575 BY: Sissel Diao TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Jun. 2002 8575 N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………

P4N266

Abstract: Insyde bios manual MDC56S-I TDK Ferrite Core PC40 B-H loops P4N266A smd w2k 117 MITAC MPU VT8653 mitac 8 E-8590
Contextual Info: SERVICE MANUAL FOR E-8590 BY: Dragon TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Jan . 2003 LCD PC E-8590 MAINTENANCE Contents 1. Hardware Engineering Specification - 3

MT47H32M16BM

Abstract: QSE-060-01-F-D-A XC3SD1800A-4FG676C UG454 3SD1800A-FG676 rs232 db15 pin male to db9 pin female DB15 VGA FOOTPRINT PCB QTE-060-09-F-D-A DB15 MALE TO DB9 FEMALE connector pinout 3SD1800AFG676
Contextual Info: Spartan-3A DSP Starter Platform User Guide UG454 v1.0 October 3, 2007 R R 2007 Xilinx, Inc. All Rights Reserved. XILINX, the Xilinx logo, and other designated brands included herein are trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners.

lcd CP5 94V0

Abstract: CP5 94V0 sumida Inverter notebook VR501 TDA 1808 ph163112 cp5 94v-0 mp4 lcd schematics lcd hyundai c547c
Contextual Info: SERVICE MANUAL FOR M762 BY: Sissel Diao TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Jun. 2002 M762 N/B Maintenance Contents 1. Hardware Engineering Specification -1.1

pu2211

Abstract: 4835D SiS 961 tp51112 MITAC MPU mitac 8 PU516 SiS961 SERVICE MANUAL tv hyundai w220 foxconn
Contextual Info: SERVICE MANUAL FOR 8575A 8 5 7 5 A BY: Sissel Diao TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Aug . 2002 8575A N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………

Contextual Info: iPEM 4.8 Gb SDRAM-DDR2 AS4DDR264M72PBG 64Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm

AS4DDR264M72PBG

Abstract: DDR2 16 meg x16 industrial
Contextual Info: iPEM 4.8 Gb SDRAM-DDR2 AS4DDR264M72PBG 64Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm

Contextual Info: iPEM 4.8 Gb SDRAM-DDR2 AS4DDR264M72PBG 64Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm

SDRAM, SMT, 128M X 16

Abstract: AS4DDR264M72PBG
Contextual Info: i PEM 4.8 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR264M72PBG 64Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp

he804

Abstract: ati connector HE809 smd diode ED MMSD32032602S-C-xx Microspire MB he807 eurofarad TCN30 MMEE08510804S-C-xx mmfl16016604s-c mmfl16016604s-d
Contextual Info: Edition 1.2. Space- & Military Level Components 2008/08 2 Introduction and Table of Contents If you are working on a program for military, industrial and/or space equipments & need product with extended temperature performance, MSA Components can help. To support the customer needs

Contextual Info: i PEM 2.1 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp

AS4DDR232M64PBG

Contextual Info: iPEM 2.1 Gb SDRAM-DDR2 AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm

AS4DDR232M64PBG

Contextual Info: i PEM 2.1 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp

AS4DDR232M64PBG

Contextual Info: i PEM 2.1 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp

pj42

Abstract: schematic diagram lcd monitor chimei 1TP1-6 S3V16 MDC56S-I DIODE S3V 81 DIODE S3V 43 PTC SY 16P BG54S MITAC MPU
Contextual Info: SERVICE MANUAL FOR 8677 BY: Spark Pei TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Dec . 2002 8677 N/B MAINTENANCE Contents 1. Hardware Engineering Specification - 3

ar8151

Abstract: amd radeon 16p SMD P96 m9-CSP64 q540s pin diagram AMD RADEON hd 6750 amd radeon hd pin diagram samsung R740 mother board components ATI RAGE mobility m1 ncc cap
Contextual Info: SERVICE MANUAL FOR 8355 BY: Rain Li Repair Technology Research Department /EDVD Nov.2003 8355 N/B MAINTENANCE Contents 1. Hardware Engineering Specification ………………………………………………………………… 4 1.1 Introduction …………………………………………………………………………………………………………. 4

VT8372

Abstract: schematic diagram lcd monitor chimei AMD AM2 motherboard schematic diagram intel g31 motherboard repair gigabyte g31 MOTHERBOARD SERVICE MANUAL ck 66 ul94v-0 lcd MHT2040T kingmax micro SD Card Mitsumi D353FUE g31 motherboard repair
Contextual Info: SERVICE MANUAL FOR 8381 BY: Valley.Hu Repair Technology Research Department /EDVD Jul.2003 8381 N/B Maintenance Contents 1. Hardware Engineering Specification - 3 1.1 Introduction - 3

WV3HG32M72EEU403PD4GG

Abstract: 0xE0000034 MT48LC16M16A2TG-6A MPC8360E user manual marvel phy 88e1111 reference design 10-pin rj45 connector F8018000 88E1111 PHY registers map marvel 88e1111 MPC83xx
Contextual Info: MPC8360EA MDS Processor Board User Manual Rev. 0.1 12/2006 MPC8360EA MDS Processor Board, Rev. 0.1 ii Freescale Semiconductor Contents Chapter 1 General Information 1.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .