SCOKET Search Results

Contextual Info: 2244 SERIES □upi in P.C.B. SCOKET 1.37mmX2.54mm 0.050"X0.100" Material: Housing: High te m p e r a tu r e housing w ithstands IR and VPR soldering m ethods. Contacts: P hospho r Bronze. Plating: Gold plated: 5 j l over 5 0/1' nickel. Tin plated: 1 5 0 / / over 7 0 / /

Contextual Info: 2244 SERIES □upi in P.C.B. SCOKET 1.27mmX2.54mm 0.050"X0.100" Material: Housing: High te m p e ra tu re housing w ithstands IR and VPR soldering m ethods. Contacts: Phosphor Bronze. Plating: Gold plated: 5 fl' over 5 0 j l nickel. Tin plated: 150/ i over

FTA0102AA

Abstract: SK-1015
Contextual Info: US FTA 380 x 123 x 43 MM SERIES • DIMENSIONS DRAWING 380.0 105.0 155.0 105.0 122.9 105.0 38.0 42.7 TOP VIEW FRONT VIEW 0.64 160.0 PART NO. FTA0102AA REV. 16.0 12.0 * AC POWER INPUT : FTA0102AA PIN ASSIGNMENT BACK VIEW 1800 RPM PIN 3 BACKPLANE SCOKET C14 SK-1015

Contextual Info: 2246 SERIES □upi in P.C.B. SCOKET 1.27mmX2.54mm 0.050', X0.100" M aterial: Housing: High te m p e ra tu re housing withstands IR and VPR soldering m ethods. Contacts: P hosphor Bronze. Plating: Gold plated: 5 / / over 5 0 / / nickel. Tin plated: 1 5 0 / / over 70/1' nickel.

2244-1

Abstract: scoket
Contextual Info: 2244 SERIES □upi in P.C.B. SCOKET 1 .3 7 m m X 2 .5 4 m m 0 .0 5 0 "X 0 .1 0 0 " M aterial: H ousing: High te m p e ra tu re housing w ithstands IR and VPR soldering m ethods. C o n ta cts: P hospho r Bronze. P lating: Gold plated: 5 ¡ ' over 5 / ' nickel.

Contextual Info: REVISIONS PART NO. JR9101-2M-ROHS ECN # REV DESCRIPTION - A RELEASED DRAWN DATE Ramya 20/05/09 CHECKD DATE APPRVD DATE Shalini 20/05/09 Farnell 03/06/09 Dimensions : Millimetres Part Number Table Description Part Number Lead, XLR Scoket - Plug, 2m JR9101-2M-ROHS

GP129

Abstract: tl 8709 p 10KMA CP2211 jl audio 500 1 schematics s3 via Twister IC FP014 FP020 s3 twister K rosan
Contextual Info: MODEL: 7170 Revision OA Contexts Title Page Cover Sheet 1 System Block Diagram 2 Power Block Diagram 3 Central Processor Unit 4 CPU Decoupling Capacitor & VTT Termination Resistor 5 North Bridge VIA TW ISTER Partial 1 6 North Bridge (VIA TWISTER ).PartiaI II

Bluetooth Energy Meter ckt diagram

Abstract: 94vo r29 Batteries Varta 500 rst 124 Touch pad synaptics Realistic sa-150 rotary encoder EC11 VT82C694X UB133X01 ALC200 humidity temperature sensor sh11
Contextual Info: SERVICE MANUAL & TROUBLESHOOTING GUIDE FOR 7170 BY： Richard Wang TESTING TECHNOLOGY DEPARTMENT / TSSC JUL. 2001 7170 N/B MAINTENANCE CONTENTS 1. Hardware Engineering Specification- 3

pu2211

Abstract: 4835D SiS 961 tp51112 MITAC MPU mitac 8 PU516 SiS961 SERVICE MANUAL tv hyundai w220 foxconn
Contextual Info: SERVICE MANUAL FOR 8575A 8 5 7 5 A BY: Sissel Diao TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Aug . 2002 8575A N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………

diagram HANNSTAR k mv

Abstract: diagram HANNSTAR k mv 4 diagram motherboard hannStar K MV intel g31 motherboard repair 301LV ics1883 intel chipset g31 motherboard repair 8X8 DOT MATRIX DISPLAY COMMON ANODE g31 motherboard repair ICS1883AF
Contextual Info: SERVICE MANUAL FOR 8599 BY: Star Meng Repair Technology Research Department /EDVD Jun.2004 8599 N/B Maintenance Contents 1. Hardware Engineering Specification ……………………………………………………………………… 4 1.1 Introduction ………………………………………………………………………………………………………………. 4

Contextual Info: FTA 380 x 123 x 43 MM SERIES • DIMENSIONS DRAWING 380.0 105.0 155.0 105.0 122.9 105.0 38.0 42.7 TOP VIEW FRONT VIEW mm INCH 0.64 160.0 16.0 12.0 3800 RPM * AC POWER INPUT : FTA0102AA PIN ASSIGNMENT BACK VIEW 1800 RPM PIN 3 8.0 0.32 80.0 0.48 & Q CURVE (AT RATED VOLTAGE)

W86L488

Contextual Info: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge W86L488 REVISION HISTORY VERSION DATE 0.50 08/2002 First published. 0.60 12/2002 Add QFN package. 0.70 03/2003 PAGE P6, P11, P26, P43, P46 P8, P24, P41, P44, DESCRIPTION P10, P25, P42, P45, 1. Modify pin function of CLK, ACLK, BCLK,

Contextual Info: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge W86L488 REVISION HISTORY VERSION DATE 0.50 08/2002 First published. 0.60 12/2002 Add QFN package. 0.70 03/2003 PAGE P6, P11, P26, P43, P46 P8, P24, P41, P44, DESCRIPTION P10, P25, P42, P45, 1. Modify pin function of CLK, ACLK, BCLK,

marking po3

Abstract: 48-PIN NDS352P W86L387D
Contextual Info: W86L387D Winbond Host Interface Memory StickTM Bridge W86L387D Data Sheet Revision History Pages Dates Version Version Main Contents on Web 1 07/2001 0.50 2 08/2002 0.60 First published. 3 4 5 6 7 8 9 10 Please note that all data and specifications are subject to change without notice. All the trademarks of

Contextual Info: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge -I- Publication Release Date: April 14, 2005 Revision 1.0 Preliminary W86L488 Table of Content: 1. GENERAL DESCRIPTION . 1

E678-32B

Abstract: E5996 internal structure of ic 741 OF IC 741 internal diagram of 741 IC R5900U
Contextual Info: PHOTOMULTIPLIER TUBES R5900U FEATURES ●High Speed Response ●Wide Dynamic Range ●Compact GENERAL Parameter Spectral Response Peak Wavelength Photocathode Material Minimum Effective Area Window Material Dynode Structure Number of Stages Weight Suitable Socket

PXA27

Abstract: W86L488AY W86L488Y
Contextual Info: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge W86L488 REVISION HISTORY VERSION DATE 0.50 08/2002 First published. 0.60 12/2002 Add QFN package. 0.70 03/2003 PAGE P6, P11, P26, P43, P46 P8, P24, P41, P44, DESCRIPTION P10, P25, P42, P45, 1. Modify pin function of CLK, ACLK, BCLK,

Contextual Info: W86L388D Data Sheet W86L388D Winbond Host Interface SD/MMC Memory Card Bridge -i- Publication Release Date: May 17, 2005 Revision 1.0 W86L388D Table of Content1. GENERAL DESCRIPTION . 1

8 pin ic sdc 3733

Abstract: MITAC 8640 PU516 windows china tv kit STR power supply ps2 mouse diagram li-ion battery pack 14.8V RJ 49 CONNECTORS toshiba c850 PU515 SIEMENS BST h45 100
Contextual Info: SERVICE MANUAL FOR 8640 8640 BY: Dragon Jiang TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Nov .2002 8640 N/B Maintenance Contents 1. Hardware Engineering Specification -1.1 Introduction -1.2 System Overview -1.3 System Hardware -1.4 Electrical Characteristic -

SK-1015

Abstract: FTA0302AA
Contextual Info: US FTA 484 x 49 x 130 MM SERIES • DIMENSIONS DRAWING 57.2±0.5 484.0±1.0 49.0 MAX 129.4±0.5 465.1±1.0 380.0±1.0 MODEL PART NO. FTA0302AA REV. 0.64 160.0 16.0 0.48 120.0 12.0 & Q CURVE (AT RATED VOLTAGE) 3800 RPM * AC POWER INPUT : FTA0302AA PIN ASSIGNMENT

MCP3208 ADC

Abstract: MCP3208 strip Led driver schematic DS51220 MCP3002 application note
Contextual Info: MCP3XXX A/D CONVERTER EVALUATION KIT USER’S GUIDE Supports both the Single/Dual Evaluation Kit: • • • Supports both the Quad/Octal Evaluation Kit: • • • MCP3001, MCP3002, MCP3201, MCP3202, MCP3301 MCP3004, MCP3008, MCP3204, MCP3208, MCP3302, MCP3304

LF-H72P

Abstract: intel 945 motherboard repair diagram str 50113 intel chipset 945 motherboard repair 2310 dhi motherboard hannstar 9172-24 d506 intel chipset 845 motherboard repair circuit Hannstar motherboard HANNSTAR
Contextual Info: SERVICE MANUAL FOR 8175 BY: Jacey Liu TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Mar . 2002 8175 N/B MAINTENANCE CONTENTS 1. Hardware Engineering

1.85mm

Abstract: 1.85mm connector
Contextual Info: . A Vital Part of Connection World CMPTER 1.85mm Connector Applycation Receptacles With Accepts Pin 1.85MM CONNECTORS COPYRIGHT CMPTER ELECTRONICS 2010 CMPTER 1.85mm Precision Connectors DESCRIPTION The 1.85mm connector are 50 ohm precision connector developed in the mid-1980s by Hewlett Packard.

MMC socket

Abstract: 325 MMC capacitor SD Card and MMC Reader mmc sd 93C46 dip usb to sd card mmc sd 2001 MMC 325 118GA-01ASA 93C46 PI
Contextual Info: W81386D W81386D Winbond USB Interface MS/SD/MMC Reader -1- Publication Release Date: May 26, 2005 Revision A1 W81386D Table of Contents1. GENERAL DESCRIPTION . 3