SAMTEC CROSS REFERENCE Search Results

MSM 7225

Abstract: MOLEX 10PIN SD CARD TT 2146 female PCB connector 9pin d-sub 15PIN D-SUB CONNECTORS 68pin TO 50 PIN SCSI connector 50 pin (2x25), 2mm pitch header connectors 50PIN D-SUB CONNECTORS jst phr-6 68pin SCSI connector
Contextual Info: AUK Complete Cross Reference Competitor Part No. SLM-132-01-G-S SAMTEC SLM-140-01-G-S SAMTEC SLM-150-01-G-S SAMTEC SLM-103-01-G-S SAMTEC SLM-104-01-G-S SAMTEC SLM-106-01-G-S SAMTEC SLM-122-01-G-S SAMTEC SLM-104-01-G-D SAMTEC SLM-105-01-G-D SAMTEC SLM-106-01-G-D SAMTEC

header samtec

Abstract: Samtec Cross reference Oupiin Oupiin 2044 samtec catalogue SMD CATALOGUE Oupiin 3012 A240 Header samtec socket
Contextual Info: Cross reference to Samtec Catalogue F-201 May 2001 Samtec Series Oupiin Seríes Samtec Series Oupiin Series Description 1.00mmX1.00mm Description 2.54mmX2.54mm FTMH 2411 Header MNT 2006 Shunt Block CLM 2441 PCB Header SNT 2006 Shunt BHT-RA 2011 Header MTSW

Header

Abstract: oupiin BOX HEADER samtec ZST Samtec Cross reference Oupiin 2044 Oupiin 2011
Contextual Info: Cross reference to Samted* Catalogue Samtec Series Oupiin Series Description Samtec Series Oupiin Series C .80mm Header FTE 2081 CLE Header 2082 PCB Socket 1.00mmX1.00mm Description 2.54mmX2.54mm MNT 2006 Shunt Block SNT 2006 Shunt BHT-RA 2011 Header FTMH

Contextual Info: Standard Products- Series Technical Specifications - IPBT Page 1 of 2 Contact Us About Us News Jobs Help Call Back Home Part Product Cross Board | Series | Pitch | | Number | Picture | Description Reference Stacking Samtec Competitors' Industry Data Rise Brand Name | Brand Name | Standard | Industry | Rate | Frequency | Time

XL4005

Abstract: M3328 UPD71641 scx6B31 upd65022 UPD72120 SCX6B120 TMC3201 UPD65081 SCX6218
Contextual Info: MHAS MPAS DEVICE-TO-PGA SOCKET CROSS ANALOG DEVICES DEVICE PART NO. SAMTEC CONNECTOR ADSP-1009A ADSP-1010A ADSP-1012A ADSP-1016A ADSP-1024A ADSP-1101 ADSP-3201 ADSP-3202 ADSP-3210 ADSP-3211 ADSP-3220 ADSP-3221 MPAS-068-XXXX-11 MPAS-068-XXXX-11 MPAS-068-XXXX-11

XL4005

Abstract: SCX6206 UPD65006 UPD65012 UPD65022 UPD65031 UPD65042 UPD65070 SCX6218 SCX6225
Contextual Info: FACTSHEET F-196 MVAS REFERENCE NS32381-15 NS32382 NS32532 NS32580 NS32GX32 SCX6206 SCX6212 SCX6218 SCX6218 SCX6225 SCX6225 SCX6225 SCX6232 SCX6232 SCX6244 SCX6244 SCX6244 SCX6264 SCX6287 SCX6B120 SCX6B120 SCX6B120 SCX6B150 SCX6B150 SCX6B21 SCX6B31 SCX6B48

Contextual Info: F-204 DIFFERENTIAL RESULTS ,- Impedance^ C o n n e c to r / 3.56E-08 3.56E-08 3.57E-08 T im e s | Diff Z (FullBW) Signal Rise Time Z Max Z Min H Diff Z (1 OOps) Diff Z (500ps) 30 ps 100 ps 500 ps 113.2 52 100.0 Q 102.3 Q 100.0 Q 100.7 Q

Contextual Info: REVISION C C1 .040 1.03 TYP C2 (NO OF POS x .0315[.800] + .0492[1.25] PIN 2 (PIN 1 ON OPPOSITE SIDE 'A' C3 SINGNAL .062±.006 1.57±0.152 MEASURED OVER FINISH HSF8-0XX-XX.00-XX No OF POSITIONS -020, -030 (SEE FIG. 1) -050 (SEE FIG. 2) * SIGNAL -SE: SINGLE ENDED

Contextual Info: REVISION P HFHM2-XXX-T-XX.XX-DP-XXX PRODUCT MANUFACTURED Pb THIS WITH LEAD-FREE PROCESSING No OF POSITIONS -020, -040, -060 PER ROW "A" REF (SEE TABLE 1) DO NOT SCALE FROM THIS PRINT CL TRANSFER END (MALE-FEMALE) C L "B" (SEE TABLE 1) OPTION -MH: MOUNTING HOLES

Contextual Info: REVISION M HFHM2-XXX-T-XX.XX-DP-XXX PRODUCT MANUFACTURED Pb THIS WITH LEAD-FREE PROCESSING No OF POSITIONS -020, -040, -060 PER ROW "A" REF (SEE TABLE 1) CL OPTION -MH: MOUNTING HOLES (SEE FIG. 2, SHEET 2) -RT1: RETENTION FEATURE (SEE FIG. 3, SHEET3) (LEAVE BLANK FOR

Contextual Info: REVISION M HFEM2-XXX-T-XX.XX-SE-XXX No OF POSITIONS -020, -040, -060 PER ROW DO NOT SCALE FROM THIS PRINT OPTION -MH: MOUNTING HOLES (SEE FIG. 2, SHEET 2) -RT1: RETENTION FEATURE (SEE FIG. 3, SHEET 3) (LEAVE BLANK FOR STANDARD) TRANSFER END (MALE-FEMALE)

Contextual Info: REVISION K HFEM2-XXX-T-XX.XX-SE-XXX No OF POSITIONS -020, -040, -060 PER ROW OPTION -MH: MOUNTING HOLES (SEE FIG. 2, SHEET 2) -RT1: RETENTION FEATURE (SEE FIG. 3, SHEET 3) (LEAVE BLANK FOR STANDARD) TRANSFER END (MALE-FEMALE) "A" REF (SEE TABLE 1) CL -SE: SINGLE ENDED

Contextual Info: fe e |iq FTE-136-01-G -D V FTE-150-01-G -D V FTE-120-01-G -D V ,8 I SPECIFICATIONS 'mm] | . C >3115" HEADER S e r ie s Low profile 1,70mm .067" Choice of post heights Mates with: CLE For complete specifications see www.samtec.com?FTE Insulator Material:

Contextual Info: < 111 SMT a0311 5" H m m SPECIFICATIONS D E Hn Choice of post heights Mates with: CLE FTE SERIES Low profile 1,70mm) .067" For complete specifications see www.samtec.com?FTE Insulator Material: Black Liquid Crystal Polymer T O P OPTION Terminal Material:

Contextual Info: F-203 Surface SMT Mount 0,80 mm .0315" HEADER SPECIFICATIONS FTE SERIES Mates with: CLE For complete specifications see www.samtec.com?FTE OPTIONS Insulator Material: Black Liquid Crystal Polymer Terminal Material: Phosphor Bronze Current Rating: .75A @ 80°C ambient

Contextual Info: FACTSHEET F-202-1 FTE–136–01–G–DV FTE–150–01–G–DV FTE–120–01–G–DV Surface SMT Mount 0,80 mm .0315" HEADER FTE SERIES Choice of post heights Low profile (1,70mm) .067" SPECIFICATIONS Mates with: CLE For complete specifications see www.samtec.com?FTE

Contextual Info: Product Sc— 1— • By picture • By word description • By part number • By series • By board stacking • By cross reference Build-a-Part Number • Order samples on-line • Automatically validate part numbers • Sample Shopping Cart now available

str w 6554 a

Abstract: str 6554 STR 6456 str w 6554 str f 6456 str x 6456 BK2425-1320ALF str f 6554 NSH-03SB-S1-TG 12697
Contextual Info: Central Component Manufacturing - Cross Reference CCM PART # GCTJ-08-2-H-A1-BK-8-P1-S 22-11-2032 22-11-2042 22-11-2062 22-12-2024 22-12-2034 22-12-2034 22-12-2044 22-12-2104 30190 382811-5 39-30-1241 39-30-1241 41A-9-750 43045-0602 43045-0612 43045-0614 43045-0802

Contextual Info: -MH: MOUNTING HOLES SEE FIG. 2, SHEET 2 -RT1: RETENTION FEATURE (SEE FIG 5, SHEET 3) (LEAVE BLANKFOR STANDARD) (MALE-FEMALE) -DP: DIFFERENTIAL PAIRS LENGTH -03.00:3.00(76.2] INCHES -05.00: 5.00(127.0] INCHES -10.00: 10.00(254.0] INCHES "B"+/- .010" (SEETABLE 1)

resistor cross reference

Abstract: DFB laser drivers 142-0711-821 capacitor cross reference SY88932L Mod Jp1 capacitor tantalium datasheet vishay CRCW040249R9F ECSH0GY106R SY88782L
Contextual Info: 2.5Gbps FP/DFB Laser Drivers SY88982L Evaluation Board General Description Features The SY88982L evaluation board is designed for fast evaluation of the SY88982L, SY88782L, and SY88932L laser drivers. A picture of the board loaded with SY88982L is shown below.

Tda 1026

Abstract: TDA 1031 vertical Picoprobe VH-5910 TST02 TST-03 PCB10042 J15-17 HSEC8-150-01-SM-DV-A TDA 15001
Contextual Info: High Speed Characterization Report HSEC8-150-01-SM-DV-A Mated With EC8 Microprobe Edge Card Launch Description: Hi-Speed Edge Card Interface, Vertical Surface Mount, 0.8mm .031” Pitch Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA Samtec, Inc. 2005

Daughter Cards

Abstract: hsmc spec QSH-090-01-L-D-A hsmc connector footprint samtec connector QSH ASP-122953-01 samtec connector QTH HDR-128291-XX CX4 connector pinout ASP-122952-01
Contextual Info: High Speed Mezzanine Card HSMC Specification 101 Innovation Drive San Jose, CA 95134 www.altera.com Document Version: Document Date: 1.7 June 2009 Copyright 2009 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and

8120-4948

Abstract: macom 54120A
Contextual Info: SEPTEMBER 13, 1999 TEST REPORT #99483 RF CHARACTERIZATION SAMTEC PART NUMBERS SET #I : QST-120-02-S-5/QTT-~2o-o1-s-5 SET #2 : QST-120-04-S-5/QTT-~2o-o4-s-5 Centech Research CERTIFICATION This is to certify that the evaluation described herein was designed and executed by personnel of Contech Research, Inc.

datasheet of BGA Staggered pins

Abstract: of BGA Staggered pins Samtec Connector Reliability Samtec Cross reference
Contextual Info: HIGH SPEED CONNECTOR OPTIMIZES BANDWIDTH PER SQUARE INCH System allows 1 Terabit of data or 4 GHz per Differential Pair solder joint reliability. This technology is superior to standard BGA/solder ball attachment in that the connectors will only be subjected to extreme heat once - during