SAMSUNG EMMC USER GUIDE Search Results

marvell armada 310

Abstract: Toshiba emmc
Contextual Info: Cover Marvell ARMADA 16x Applications Processor Family Version 3.2.x Boot ROM Reference Manual Doc. No. MV-S301208-00, Rev. November 2010 PUBLIC RELEASE Marvell. Moving Forward Faster Marvell® ARMADA 16x Applications Processor Family Version 3.2.x Boot ROM Reference Manual

Samsung eMMC 4.51

Abstract: samsung eMMC 4.5
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

samsung eMMC 4.5

Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
Contextual Info: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

samsung eMMC 4.5

Abstract: emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 4, 1/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

OV5642

Abstract: sony IMX 322 cmos DA9053 Atheros AR6003 AR6003 SII9022 ov5642 omnivision HSD100PXN1-A00-C11 SiI9022 HDMI transmitter wi-fi schematic miniPCIe
Contextual Info: MCIMX53SMD Board Hardware User’s Guide IMX53SMDHUG Rev. 0 9/2011 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road

KLM8G2FEJA-A001

Abstract: KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMXGXFEJA-X001 KLMCGAFEJA-B001
Contextual Info: Hello All, 8/16/32GB 27nm eMMC parts are now available to sample CS type ! Please input sample requests for all customers using old generations of moviNAND now. We'll expedite for ASAP delivery. SEC will ramp 27nm production quickly so it is imperative that all customers get qualified ASAP.

Samsung eMMC 4.41

Abstract: ARM Cortex A9 samsung VFPv3 emmc jedec standard MCIMX50 samsung eMMC 4.5 153 ball eMMC memory
Contextual Info: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 0, 7/2011 MCIMX50 Package Information Plastic Package Case MAPBGA 13 x 13 mm, 0.5 mm pitch 416 pin PBGA i.MX50 Applications Processors for Consumer Products 1 Introduction

toshiba emmc 4.4

Abstract: toshiba 8GB Nand flash emmc toshiba emmc toshiba 16GB Nand flash emmc TCM9000MD TCM9200MD TOSHIBA eMMC CATALOG TC35893XBG RGB to MIPI DSI LCD toshiba 8GB Nand flash bga
Contextual Info: 2008-9 SYSTEM CATALOG Mobile Solutions s e m i c o n d u c t o r h t t p : / / w w w. s e m i c o n . t o s h i b a . c o. j p / e n g Toshiba Semiconductor Devices for Mobile Applications Mobile communications via cellular phones and PDAs are changing the way we live.

R/marvell ethernet switch mi

Abstract: marvell alaska program interface Marvell PXA168
Contextual Info: Specification Update Marvell ARMADA 16x Applications Processor Family ARMADA 160, 162, 166 and 168 Products 1. Introduction This document contains updates to the specifications for the Marvell® ARMADA 16x Applications Processor Family. This document is a compilation of device and documentation errata, specification clarifications, and specification changes. It is

sony IMX 136

Abstract: IMX6DQ6SDLSRM sony sensor imx 136 sony CMOS sensor imx 136 Sony imx 134 cmos sensor sony IMX 138 sony cmos sensor imx 123 sony cmos sensor imx 174 sony CMOS sensor imx 135 sony IMX 260
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.2, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.1, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

SCIMX538DZK1C

Abstract: samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

MCIMX535

Abstract: MCIMX535DVV1C MCIMX535DVV IMX53CEC mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4, 11/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

eMMC "thermal impedance"

Abstract: PCIMX535DVV1C emmc Card connector 062N n78c 4.712 eMMC PoP emmc pcb layout 100KPD diode 4.7-16
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 2, 5/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm

SCIMX

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

MCIMX535

Abstract: emmc DDR3 pcb layout samsung eMMC 4.5 eMMC 4.4 eMMC rja rjc emmc Pin assignment samsung NAND Flash DIE i.mx53 samsung eMMC 5.0 SCIMX
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53CEC Rev. 6, 03/2013 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

pin vga CRT pinout

Abstract: samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 3, 7/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm

samsung EMMC user guide

Abstract: eMMC 4.4 Jedec lpddr2 emmc 4.4 standard jedec ARM cortex A9 neon SIMD imx53 Freescale i.MX53 Quick Start Board H.264 encoder cortex a8 schema tv sony SAMSUNG NAND FLASH TRANSLATION LAYER SOFTWARE
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53IEC Rev. 6, 03/2013 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1 Ordering Information

SONY VTR M15 DIAGRAM

Abstract: SAHA Freescale i.MX53 Quick Start Board "eMMC" Thermal Impedance sahara lcd monitor circuit diagram free samsung lpddr2 imx53 MCIMX537CVV8C emmc operation ver 4.41 samsung eMMC 4.5
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53IEC Rev. 4, 11/2011 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information

Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53IEC Rev. 4, 11/2011 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information

HMI 14 PIN CONNECTOR CONFIGURATION

Abstract: emmc jedec mechanical standard emmc bga 162 "thermal switch" t175
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 2, 5/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information