S3232 Search Results

Contextual Info: 1 Megabit CMOS SRAM D EN SE-PA C S3232V M I C R O S Y S Ï li M S DESCRIPTION: The S3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs are

P3420

Abstract: DASL
Contextual Info: In developing the architecture of this IS D N chip set, Nation­ al's major objective has been to create a flexible set of building blocks which provide elegant and cost-effective so ­ lutions for a wide range of applications. With just a few high­ ly integrated devices, a broad spectrum of IS D N equipment

twilight

Contextual Info: □PM Dense-Pac Microsystems, Inc. S3232V 32K X 32 CMOS SRAM VERSAPAC MODULE O DESCRIPTION: The S3232V is a 66-pin Pin Grid Array PGA consisting of four 3 2 K X8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceram ic substrate w ith m atching thermal

Contextual Info: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS S3232V DESCRIPTION: The S3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchi ng thermal coeffi cients. The LCCs

hollingsworth h270

Abstract: TL3080 MIL-T-7928/1 R3454B XR5109N R4271S TL3061 MS25036 XR1858SN tl3062
Contextual Info: How to use your catalog This catalog is organized for your convenience in specifying and ordering Hollingsworth Solderless Terminals. The table of Contents lists major sections and highlights the content of each. Each section is preceded by an explanation of the

Contextual Info: 1 Megabit CMOS SRAM D EN SEFAC M I C R O S Y S ï If MS S3232V-35I-TI DESCRIPTION: The S3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs

Contextual Info: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS S3232V D E SC R IP T IO N : The S3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs

DPS3232V

Contextual Info: 1 Megabit CM O S SRAM D EN SE-PA C M ÍC R O S Y SÏ \r, MS S3232V-35I-TI DESCRIPTION: The S3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchingthermal coefficients. The LCCs

Contextual Info: 1 Megabit CMOS SRAM DENSE-PAC S3232V-35I-TI MÍCRü S Y ST hMS DESCRIPTION: The S3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchingthermal coefficients. The LCCs

Contextual Info: 1 Megabit CMOS SRAM PENSE-PAC MICROSYSTEMS S3232V D E SC R IP TIO N : The D S3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic L C C packages surface mounted on a co-fired ceramic substratewith matching thermal coefficients. The LCCs