RST-5 XB Search Results

DS1620S

Abstract: AN105 DS1620
Contextual Info: DS1620 DALLAS s e m ic o n d u c to r DS1620 Digital Thermometer and Thermostat FEATURES PIN ASSIGNMENT • Requires no external com ponents • S upply voltage range covers from 2.7V to 5.5V DQ QE 3D C LK/CONV QE QE 3D 3D t lo w gndGE 3D Tcom RST • M easures tem peratures from -5 5 ° C to +125°C in

79015P

Abstract: 74HC14T ria PD6 sf hd62 xo 403 me 4Z701 KC332 R36118 ad 0803 pc dio-48
Contextual Info: Mainboard 1 of 33 HA#[3.31] 3,5 24 24 ST PCLK# SLP# INT R NMI 5 8,10 10 T CK T DO T DI T MS T RST # T PREQ# T PRDY# RS#[0.2] 24 A20M# CPU_FERR# 24 IGNNE# PW RGOOD 10 SMI# HT RDY# HIT # HITM# DEFER# 3,5 3,5 3,5 3,5 BREQ0# BPRI# BNR# HLOCK# ADS# V_CPU R579

Si530EB121M109DG

Contextual Info: Si5324 A NY - F R E QUE N C Y P RECISION C LOCK M ULTIPLIER / J I T T E R A TTENUATOR Features See page 64. Description CKOUT1– CKOUT1+ NC GND NC 36 35 34 33 32 31 30 29 28 RST 1 27 SDI NC 2 26 A2_SS INT_C1B 3 C2B 4 VDD 5 XA 6 XB 7 GND 8 20 GND NC 9 19 GND

SN74HC573DW

Abstract: DS1687-5 SN74HC04D AN509 DS1216C DS1216E DS1243Y DS1244Y DS2250 SN74ALS32D
Contextual Info: Application Note 509 Using the SmartWatch/Phantom Clocks with a Microcontroller www.maxim-ic.com PIN ASSIGNMENT RST 1 28 V CC 2 3 27 WE 26 V CCB 4 25 5 6 24 23 7 22 [A2] 8 21 9 20 [A0] 10 19 DQ0 11 18 12 13 17 16 GND 14 15 OE CE DS1216B/C/D/E 28-Pin Intelligent Socket

Si5326

Abstract: Si53xx GR-253-CORE JESD78 OC48
Contextual Info: Si5326 A NY F R E Q U E N C Y P R E C I S I O N C L O C K M U LT IP L IE R / J ITTE R ATTENUATOR Features Description CKOUT1– CKOUT1+ NC 36 35 34 33 32 31 30 29 28 RST 1 27 SDI NC 2 26 A2_SS INT_C1B 3 25 A1 C2B 4 VDD 5 XA 6 XB 7 GND 8 20 INC NC 9 19 DEC

Si53xx

Abstract: XARI 0C2B
Contextual Info: Si5326 A N Y F R E Q UE N C Y P R E C I S I O N C L O C K M U L T I P L I E R / J I T T E R ATTENUATOR Features Description CKOUT1– CKOUT1+ NC 36 35 34 33 32 31 30 29 28 RST 1 27 SDI NC 2 26 A2_SS INT_C1B 3 25 A1 C2B 4 VDD 5 XA 6 XB 7 GND 8 20 INC NC 9 19 DEC

63C159

Abstract: 74HC14T P14DB se216 4HC14 bt 338 29C322 ti122 TC1628 CA20B
Contextual Info: 3 CPU RST # HD#[0.63] VCCT R64 5 56 .2 _1% B PR I# RS#0 HD#0 HD#1 HD#2 HD#3 HD#4 HD#5 HD#6 HD#7 HD# 8 HD#9 HD#10 HD#11 HD#12 HD#13 HD#14 HD#15 HD#16 HD#17 HD#18 HD#19 HD#20 HD#21 HD#22 HD#23 HD#24 HD#25 HD#26 HD#27 HD#28 HD#29 HD#30 HD#31 HD#32 HD#33 HD#34

md 5406

Abstract: pin out md 5406 Si5341
Contextual Info: S i 5 3 4 1/40 L O W - J I T T E R, 1 0 - O U T P U T , A NY -F R E Q U E N C Y, A NY -O U T P U T CLOCK GENERATOR Features RSVD OUT8 OUT8 VDDO8 OUT7 OUT7 VDDO7 54 53 52 51 50 49 OUT9 VDDO9 OUT9 58 55 VDD 59 RSVD FB_IN 60 56 FB_IN 61 OUT6 44 OUT6 RST 6 43

AS7C36432-7QC

Abstract: 2227S
Contextual Info: Features 1 A sy n c h ro n o u s o u tp u t e n a b le c o n tro l • O rg a n iz a tio n : 6 5 ,5 3 6 w o r d s x 32 b its ADSP, ADSC, ADV, M O DE b u rst c o n tro l p in s • Fully s y n c h ro n o u s p ip e lin e d o p e ra tio n • F lo w -th ro u g h o p tio n

FD31

Abstract: WEDPNF8M721V-XBX
Contextual Info: WEDPNF8M721V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* • 3.3 Volt for Read and Write Operations FEATURES ■ 1,000,000 Erase/Program Cycles ■ Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

FD19

Abstract: BY12 FA147
Contextual Info: WEDPNF8M722V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* • 3.3 Volt for Read and Write Operations FEATURES ■ 1,000,000 Erase/Program Cycles ■ Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

Contextual Info: WEDPNF8M722V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* • 3.3 Volt for Read and Write Operations FEATURES ■ 1,000,000 Erase/Program Cycles ■ Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

FD19

Abstract: FD31 FD23 WEDPNF8M722V-XBX
Contextual Info: WEDPNF8M722V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* • 3.3 Volt for Read and Write Operations FEATURES ■ 1,000,000 Erase/Program Cycles ■ Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

Contextual Info: White Electronic Designs WEDPNF8M722V-XBX 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n Sector Architecture •One 16KByte, two 8KBytes, one 32KByte, and fifteen 64KBytes in byte mode Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

WEDPNF8M722V-XBX

Contextual Info: White Electronic Designs WEDPNF8M722V-XBX 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n Sector Architecture •One 16KByte, two 8KBytes, one 32KByte, and fifteen 64KBytes in byte mode Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

Contextual Info: WEDPNF8M721V-XBX 8Mx72 Synchronous DR AM + 8Mb Flash Mix ed Module DRAM Mixed MultiChip PPackage ackage ADVANCED* Multi-Chip n FEATURES n • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

WEDPNF8M721V-XBX

Abstract: WEDPNF8M722V-XBX
Contextual Info: White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

Phoenix/MPC8260 SDRAM Timing Diagram

Contextual Info: White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode Package: • 275 Plastic Ball Grid Array PBGA , 32mm x 25mm

PMS430E325

Abstract: MSP430C323 MSP430C325 MSP430P325 tms 8 Bit Microcontroller 64 PLCC MSP430C325IPG MSP430P325PM TP04 delta TP04 msp430p
Contextual Info: MSP430x32x MIXED SIGNAL MICROCONTROLLER SLAS164 – FEBRUARY 1998 D D D D D D D D D D D PG Package TOP VIEW DVSS AVSS A1 A0 XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI COM3 COM2 COM1 D Low Supply Voltage Range, 2.5 V – 5.5 V Low Operation Current, 400 mA at 1 MHz,

MSP430C323

Abstract: MSP430C325 MSP430P325A qfp-68 PMS430E325
Contextual Info: MSP430C32x, MSP430P325A MIXED SIGNAL MICROCONTROLLER SLAS219 – MARCH 1999 D D D D D D D D D D D PG Package TOP VIEW DVSS AVSS A1 A0 XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI COM3 COM2 COM1 D Low Supply Voltage Range, 2.5 V – 5.5 V Low Operation Current, 400 mA at 1 MHz,

PMS430E325

Abstract: MSP430C323 MSP430C325 MSP430P325 tms430p32x delta TP04 kb 72 seven segment
Contextual Info: MSP430x32x MIXED SIGNAL MICROCONTROLLER SLAS164 – FEBRUARY 1998 D D D D D D D D D D D PG Package TOP VIEW DVSS AVSS A1 A0 XBUF RST/NMI TCK TMS TDI/VPP TDO/TDI COM3 COM2 COM1 D Low Supply Voltage Range, 2.5 V – 5.5 V Low Operation Current, 400 mA at 1 MHz,

i8085

Abstract: Nec AC 160
Contextual Info: D A TA S H E E T NEC MOS INTEGRATED CIRCUIT jiPD4516421, 4516821, 4516161 16M-bit Synchronous DRAM Description T h e //PD4516421, 4516821, 4516161 are high-speed 16,777,216-bit sy n c h ro n o u s d y n a m ic ra n d o m -a cce ss m e m o rie s, o rg an ized as 2 ,0 9 7 ,1 5 2 x4 x2 , 1,048,576x8x2 and 5 2 4,28 8x1 6x2 w o rd xb itx b a n k , re sp e ctiv e ly .

vhdl code for traffic light control

Abstract: vhdl code for dice game vhdl code for TRAFFIC LIGHT CONTROLLER SINGLE WAY traffic light controller vhdl coding blackjack vhdl code structural vhdl code for ripple counter 4 BIT ALU design with vhdl code using structural vhdl code of floating point adder vhdl code for complex multiplication and addition four way traffic light controller vhdl coding
Contextual Info: Metamor User's Guide - Contents software version 2.3 1 - About This Guide 10 - Logic and Metalogic 2 - PLD Programming Using VHDL 11 - XBLOX and LPM 3 - Introduction to VHDL 12 - Synthesis Attributes 4 - Programming Combinational Logic 13 - Synthesis Coding Issues

XCSL

Abstract: C6000 GAL22LV10 SN74CBTLV3245 TMS320C6000 XARB
Contextual Info: Application Report SPRA632A - August 2001 TMS320C6000 DSP Expansion Bus: Multiple DSP Connection Using Asynchronous Host Mode Kyle Castille DSP Applications ABSTRACT You can easily interface multiple TMS320C6000 C6000 DSP devices to each other by way of a direct connection of the expansion bus (XBus). Each device’s XBus I/O port masters