BGA and QFP Altera Package mounting profile
Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
Contextual Info: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine
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bga and qfp altera package mounting profilebga profilingjep113-binfrared heating gun+6guidelinesjep113reliability data plastic packages qfpj-std-020aj-std-033guidelines for handling moisture sensitive device
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bga socket
Abstract: BGA and QFP Package Reliability Data Plastic Packages QFP testing of diode J-Lead, QFP TQFP 80 socket
Contextual Info: Packaging Contents March 2000 Application Notes AN 71 Guidelines for Handling J-Lead & QFP Devices AN 80 Selecting Sockets for Altera Devices AN 81 Reflow Soldering Guidelines for Surface-Mount Devices AN 90 SameFrame Pin-Out Designs for FineLine BGA Packages
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7000sbga socketbga and qfp packagereliability data plastic packages qfp+3testing of diodej-lead, qfptqfp 80 socket
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IPC-SM-780
Contextual Info: Reflow Soldering Guidelines January 1998, ver. 2 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid
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823B
Abstract: DL201 motorola handbook 84 pin plcc ic base Reliability and quality handbook
Contextual Info: MOTOROLA SEMICONDUCTOR GENERAL INFORMATION Packaging & Case Information 84-Pin PLCC CASE 780A-01 ISSUE A FN SUFFIX 181-Pin PGA CASE 795A–02 ISSUE A HI SUFFIX 128-Pin QFP CASE 862A-02 ISSUE B DD SUFFIX 208-Pin QFP CASE 872A-01 ISSUE TBD DK SUFFIX 160-Pin QFP
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84-pin80a-01181-pin128-pin+1162a-02208-pin72a-01160-pin64a-03224-pin823bdl201motorola handbook84 pin plcc ic basereliability and quality handbook
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IPC-SM-780
Abstract: IPC-SM-780 solder paste OVEN RQFP IPC-SM-786
Contextual Info: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.
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varyini/ipc-sm-786ipc-tm-650jesd22-a112ipc-sm-780+4ipc-sm-780 solder pasteovenrqfpipc-sm-786
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IPC-SM-780
Abstract: IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life
Contextual Info: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.
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oc-sm-786ipc-tm-650jesd22-a112ipc-sm-780+6ipc-sm-786ipc-sm-786aguidelines for handling moisture sensitive devicemoisture sensitive handling and packagingbga and qfp altera package mountingsolder paste floor life
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amkor
Abstract: amkor exposed pad
Contextual Info: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a
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amkor exposed pad
Abstract: exposed QFP 128 amkor exposed QFP 144
Contextual Info: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small
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MS-026 lqfp 80
Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Contextual Info: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging
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ms-026 lqfp 80ds170gms-026jedec matrix tray outlines+2lqfppowerquad2cs-007
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NATIONAL SEMICONDUCTOR MARKING TYPE
Abstract: SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY national semiconductor packaging QFP PACKAGE thermal resistance Thermal Considerations for Surface Mount Packages national semiconductor databook
Contextual Info: Introduction Thank you for selecting National Semiconductor products. National Semiconductor’s products find wide use in applications ranging from the latest personal computers to lightweight portable consumer products. As next generation electronic systems require higher levels of performance, device
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national semiconductor marking typesemiconductor packaging assembly technologynational semiconductor packagingqfp package thermal resistance+2thermal considerations for surface mount packagesnational semiconductor databook
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M02142
Abstract: CSOP-48 BGA672 CS36 J-STD-020A ultrasonic full bridge cleaning S02-1 FD-FBGA-60 FBGA-304 tsop-48 flash
Contextual Info: Package Mounting Methods Mounting Methods/Reliability/Storage 1. Mounting Methods 2. Surface Mounted Plastic Package Reliability 3. Storage DB81-10004-2E 1 Package Mounting Methods (Mounting Methods/Reliability/Storage) 1. Mounting Methods PACKAGE 1. Mounting Methods
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EIAJ-IC-121
Abstract: EIAJ-IC-121 Method 20 EIAJ-IC-121-18 EIAJIC-121 MIL-STD-202E-101D MIL-STD-202E 101D
Contextual Info: QUALITY ASSURANCE 2. QUALITY ASSURANCE S-M O S Systems, Inc., supported by the foundation of results acquired through experience in the adoption of low-pow er CMOS LSI for SEIKO quartz watches, has been providing highly reliable products that have set new
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MAX6809
Abstract: ST 9727 st 9635 st 9548 12x12 bga thermal resistance MAX232CWE 9846B MAX232 integrated chips 9836 maxim iso 9717
Contextual Info: November 1999 Surface-Mount Devices Reliability Report This report presents reliability data for Maxim’s surface-mount devices, including the results of extensive reliability stress tests performed solely on epoxy surface-mount packages since 1995. Maxim’s surface-mount packages are subjected to standard
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2088AB* led matrix
Abstract: led matrix 2088ab 2088AB led matrix led matrix 8x8 mini circuits 2088AB matrix 2088ab Ultrasonic humidifier circuit torque settings for metric cap head screws TRANSISTOR C 6090 EQUIVALENT CV 7311
Contextual Info: Soldering and Mounting Techniques Reference Manual SOLDERRM/D Rev. 3, May−2006 SCILLC, 2006 “All Rights Reserved” SOLDERRM FULLPAK, ICePAK, MicroIntegration, MicroLeadless, MOSORB, MiniMOSORB, and POWERTAP are trademarks of Semiconductor Components Industries, LLC SCILLC . Cho−Therm is a registered trademark of Chromerics, Inc. Grafoil is a registered trademark of
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may-20062088ab* led matrixled matrix 2088ab2088ab led matrix+7led matrix 8x8 mini circuits2088abmatrix 2088abultrasonic humidifier circuittorque settings for metric cap head screwstransistor c 6090 equivalentcv 7311
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Ablebond 71-1
Abstract: Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board
Contextual Info: CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages DC resistance R of leads or pins Capacitance (C) including lead-to-lead and loading capacitances Inductance (L) including only self-inductance values for pins traces and wires (PGA) or
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93-wa-eep-691-wa-eep-2791-wa-eep-31pp1059-1070+11pp357-366ablebond 71-1nittobimetalablebond 84-1fr4 epoxy dielectric constant 4.4thermal analysis on pcbtungsten slug glass diodeablebond 71ic packagescpu fan pin data circuit in mother board
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matrix 2088ab
Abstract: 2088AB led matrix torque settings chart for metric stainless bolts led matrix 2088ab 2088AB* led matrix PHASE CONTROL THYRISTOR MODULE TT 56 N SIL-PAD to-247 Ultrasonic humidifier circuit full wave BRIDGE RECTIFIER 1044 2088AB
Contextual Info: Soldering and Mounting Techniques Reference Manual SOLDERRM/D Rev. 5, January−2007 SCILLC, 2007 “All Rights Reserved” SOLDERRM FULLPAK, ICePAK, MicroIntegration, MicroLeadless, MOSORB, MiniMOSORB, and POWERTAP are trademarks of Semiconductor Components Industries, LLC SCILLC . Cho−Therm is a registered trademark of Chromerics, Inc. Grafoil is a registered trademark of
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january-2007matrix 2088ab2088ab led matrixtorque settings chart for metric stainless bolts+7led matrix 2088ab2088ab* led matrixphase control thyristor module tt 56 nsil-pad to-247ultrasonic humidifier circuitfull wave bridge rectifier 10442088ab
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TSMC 0.35um
Abstract: ED-4701-3-B122A tsmc 0.35 um CMOS gate area PBGA 256 reflow profile Volt, SPDM, CMOS ED-4701-1-C111A ISO-9000 PI7C7300 PI7C8150-33 PI7C8152
Contextual Info: Reliability Summary Report PCI Bridge Products March 20, 2003 Updated Total Life Test Hours Reliability by Design Page 1 of 16 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:
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SPARTAN XC2S50
Abstract: XCS10 vq100 FG456 XC2S50 xilinx CS144 CSP144 CS144 xc2s30 pq208 XCS30 PQ208 XC2S15
Contextual Info: High volume package solutions guide partanTM families provide the low-cost, high-volume ASIC packages for applications that need low power, small form factors and high reliability. The Chip Scale Package CSP and the Fine Pitch BGA package (FG) provide higher
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LGA 1155 Socket PIN diagram
Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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lga 1155 socket pin diagrammarking code smd fujitsuyamaichi ic354marking code smd semiconductor fujitsu+6pitch 0.4 qfp 256psmd transistor m05yamaichi ic234smd code 38pfpq-144-0.5-03smd p08
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kic 125
Abstract: ic KA 2645 C 6090 Side Brazed Ceramic Dual-In-Line Packages thermal analysis on pcb Coffin-Manson Equation AL Cu tungsten slug glass diode Braze Dual-In-Line 16 Packages cte table for epoxy adhesive and substrate PERFORMANCE CHARACTERISTICS OF IC PACKAGES
Contextual Info: 2 4 Performance Characteristics of IC Packages 1/22/97 10:05 AM CH04WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES 4.1. IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages:
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ch04wipkic 125ic ka 2645c 6090+7side brazed ceramic dual-in-line packagesthermal analysis on pcbcoffin-manson equation al cutungsten slug glass diodebraze dual-in-line 16 packagescte table for epoxy adhesive and substrateperformance characteristics of ic packages
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LGA 1156 PIN OUT diagram
Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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lga 1156 pin out diagramqfp11t144-002lga 1156 socket diagram216-lqfp+6wells-cti 36 lead flat packsmd aaaswells-cti lcc socketwells-cti 880 020bga136enplas drawings
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Ablebond 84-1*SR4
Abstract: z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4
Contextual Info: Reliability Summary Report PI6CV857A August 28, 2002 Reliability by Design Page 1 of 20 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:
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pi6cv857aablebond 84-1*sr4z9925eiaj ed-4701+7mark a48857ltsmc 0.35umvolt, spdm, cmos98068a0.6 um cmos processablebond 84-1lmisr4
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SMD MARKING CODE 071 A01
Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods
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PCB design for very fine pitch csp package
Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
Contextual Info: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue
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