RDBS Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint for reflow soldering of RDBS27P package 2 SOT878-1 1 27 1 2.54 26 hole diameter min. 0.92 2 ∅ 0.08 M Dimensions in mm SOT878-1_fr PDF sot878-1_fr Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Contextual Info: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads non-concave SOT462-2 Dh x D Eh view B: mounting base side A2 d B j E Q A L c 1 e2 13 e1 Z bp e L1 w M 5 v M 10 mm scale DIMENSIONS (mm are the original dimensions)

sot462

Contextual Info: PDF: 1999 Dec 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e v M L1 w M bp 5 10 mm scale

RDBS17P

Abstract: sot668
Contextual Info: PDF: 2001 Jan 05 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL reverse bent power package; 17 leads (row spacing 2.54 mm) SOT668-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A Q L c 17 1 e1 Z w M bp e L1

RDBS17P

Abstract: sot577
Contextual Info: PDF: 2001 Jan 05 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads row spacing 2.54 mm SOT577-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L 1 e2 17 e1 Z w M bp e c v M 5 Q L1 10 mm

Contextual Info: Package outline RDBS23P: plastic rectangular-DIL-bent-SIL reverse bent power package; 23 leads (row spacing 2.54 mm) SOT889-1 non-concave D Dh x Eh view B: mounting base side d A2 β A5 A4 B j E E1 A L 1 c 23 e2 Q e1 Z w M bp e v M L1 5 10 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E Q A L c 1 e2 13 e1 Z e L1 w M bp 5 v M 10 mm scale

Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions

Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e v M L1 w M bp 5 10 mm scale

SOT889-1

Abstract: RDBS23P sot889
Contextual Info: Package outline Philips Semiconductors RDBS23P: plastic rectangular-DIL-bent-SIL reverse bent power package; 23 leads (row spacing 2.54 mm) SOT889-1 non-concave D Dh x Eh view B: mounting base side d A2 β A5 A4 B j E E1 A L 1 c 23 e2 Q e1 Z w M bp e v M

Contextual Info: PDF: 2000 Mar 16 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e v M L1 w M bp 5 10 mm scale

SOT462-2

Abstract: sot462
Contextual Info: PDF: 2000 Oct 19 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e L1 w M bp 5 v M 10 mm scale

LC7074M

Abstract: DIP18 LA2230 LC7074
Contextual Info: Ordering number:ENN4789 CMOS IC LC7074, 7074M Synchronous Error Correction IC for RDS Applications Overview Package Dimensions The LC7074 and the LC7074M are ICs for the RDS radio data system implemented by the EBU (European Broadcasting Union) and the RDBS (radio broadcast data system) implemented by the NRSC (National Radio System

Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-1 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 Q c 13 1 e1 Z e v M w M bp 5 L1 10 mm scale DIMENSIONS mm are the original dimensions

Contextual Info: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-1 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 Q c 13 1 e1 Z e v M w M bp 5 L1 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A2

Contextual Info: Package outline RDBS17P: plastic rectangular-DIL-bent-SIL reverse bent power package; 17 leads (row spacing 2.54 mm) non-concave SOT668-2 Dh x D Eh view B: mounting base side A2 d B j E A Q L c 17 1 e1 Z w M bp e L1 5 e2 v M 10 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A2

RDBS17P

Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads row spacing 2.54 mm SOT577-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L 1 e1 Z w M bp e c e2 17 v M 5 Q L1 10 mm

RDBS17P

Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL reverse bent power package; 17 leads (row spacing 2.54 mm) SOT668-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A Q L c 17 1 e1 Z w M bp e L1

RDBS27P

Abstract: SOT-878 sot878
Contextual Info: Package outline Philips Semiconductors RDBS27P: plastic rectangular-DIL-bent-SIL reverse bent power package; 27 leads (row spacing 2.54 mm) SOT878-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L 1 27 c e1 Z e2 Q e w bp v L1 M 10 M 20 mm

Contextual Info: Package outline RDBS27P: plastic rectangular-DIL-bent-SIL reverse bent power package; 27 leads (row spacing 2.54 mm) SOT920-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L 1 27 c e1 Z e2 Q e w bp v L1 M 10 M 20 mm scale DIMENSIONS (mm are the original dimensions)

Contextual Info: Package outline RDBS27P: plastic rectangular-DIL-bent-SIL reverse bent power package; 27 leads (row spacing 2.54 mm) SOT878-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A 1 L 27 c e1 Z e2 Q e w bp v L1 M 10 M 20 mm scale Dimensions (mm are the original dimensions)

Contextual Info: Package outline RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads row spacing 2.54 mm SOT577-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L 1 e1 Z w M bp e c e2 17 v M 5 Q L1 10 mm scale DIMENSIONS (mm are the original dimensions)

SOT577-1

Abstract: RDBS17P sot577
Contextual Info: PDF: 2000 Mar 16 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads row pitch 2.54 mm SOT577-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L 1 e2 17 e1 Z w M bp e Q c v M L1 5 10 mm