QFP2 Search Results

Contextual Info: MN103004K , MN103016K Type MN103004K MN103016K Command ROM x× 64-bit 256 K-byte 256 K-byte Data RAM (×× 32-bit) Package (Conventional Package) 10 K-byte *Lead-free QFP208-P-2828F (QFP208-P-2828A) 10 K-byte , FLGA239-C-1313 Minimum Instruction Execution Time

QFP256

Abstract: QFP256-G-2840-0
Contextual Info: QFP256-G-2840-0.50 Uniti nn 42. 6 t0 . 2 39. 2±0. 4 204 Q_ >in oo- 205 u 129 128 3101310131013101310131010201 o +i OJ r< OJ o +i sD O CO o 77 256

QFP256

Abstract: QFP256-P-2828-0
Contextual Info: QFP256-P-2828-0.40 Uniti m 01230102018000010001230102010201000102012

Contextual Info: MN103004K , MN103016K Type MN103004K MN103016K Command ROM x× 64-bit 256 K-byte 256 K-byte Data RAM (×× 32-bit) Package (Conventional Package) 10 K-byte *Lead-free QFP208-P-2828F (QFP208-P-2828A) 10 K-byte , FLGA239-C-1313 Minimum Instruction Execution Time

intel 486dx4

Abstract: MSM486DX amd 5x86 amd 5x86 133mhz SK099 486DX4 486dx4 wb amd 486dx4 wb 5x86 QFP208
Contextual Info: APPLICATION NOTE 056 AMD 5x86 133MHz with Cache WB on MSM486DX From: FK Product: MSM486DX To: Customer/Support Version: V4.0 Date: 10.97 BIOS: V? _ Nordstrasse 4F / CH - 4542 Luterbach General: The MSM486DX is assembled today with the INTEL 486DX4 QFP208 CPU

QFP256

Abstract: QFP256-P-2828-0
Contextual Info: QFP256-P-2828-0.40 Uniti nn 30, 6±0, 2 28, 0±0, 2 192 129 Q. 193 128 O O o +i o co OJ o +i o co o >65 256« 64 0, 18±0. 035 1, 4TYP JOIO, 105CMX QD]

FP-208V

Abstract: PRQP0208KD-A
Contextual Info: JEITA Package Code P-QFP208-28x28-0.50 RENESAS Code PRQP0208KD-A Previous Code FP-208/FP-208V MASS[Typ.] 5.2g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 156 105 157 104 bp c c1 HE Reference

QFP240-G-3232-0

Contextual Info: 240K6X-A Glass seal 240pin 32✕32mm CERQUAD EIAJ Package Code QFP240-G-3232-0.50 Weight g MD e JEDEC Code – 181 1 b2 240 ME HD D 180 I2 Symbol HE E Recommended Mount Pad 121 60 61 120 F L1 A b y A1 c A2 e A A1 A2 b c D E e HD HE L L1 y L Detail F b2 I2

MN103004K

Abstract: MN103016K QFP208-P-2828A QFP208-P-2828F
Contextual Info: MN103004K , MN103016K Type MN103004K MN103016K Command ROM x× 64-bit 256 K-byte 256 K-byte 10 K-byte 10 K-byte Data RAM (×× 32-bit) Package (Old Package) QFP208-P-2828F *Pb free , FLGA239-C-1313 (QFP208-P-2828A) Minimum Instruction Execution Time FLGA239-C-1313

QFP240-P-3232-0

Contextual Info: QFP240-P-3232-0.50 Uniti m <?!?!?!?!?!?!?!?!?!?!?!"!?!?!"!?!?!" ?!?!?!?!?!?!?!?!?! !?!?!?!"!?!?!?!? ?!?!?!?!?!?!?!?!?! !?!?!?!"!?!?!?!? Jan.2007

C5C5

Contextual Info: G-QFP240-3232-0.50 Uniti nn 34. 6±0. 2 31, 2±0, 4 121 180 181 120

PQFP256

Contextual Info: P-QFP256-2840-0.50

QFP240-P-3232-0

Contextual Info: QFP240—P—3232—0.50B

QFP272-P-3636-0

Contextual Info: QFP272-P-3636-0.50-BK4 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

PQFP208

Abstract: P-QFP208-28x28-0 PRQP0208KC-A
Contextual Info: JEITA Package Code P-QFP208-28x28-0.50 RENESAS Code PRQP0208KC-A Previous Code 208P6Y-E MASS[Typ.] 5.5g HD *1 156 D 105 157 104 HE *2 E NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. ZE Reference

QFP208-P-2828-0

Contextual Info: QFP208-P-2828-0.50-CK4 Built-in heat spreader Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 6.70 TYP. 4/Nov. 28, 1996

QFP208-P-2828-0

Abstract: QFP208-P
Contextual Info: QFP208-P-2828-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 5.65 TYP. 2/Nov. 28, 1996

QFP256 Package

Abstract: P-QFP256-28x28-0 QFP256 PRQP0256LA-A
Contextual Info: JEITA Package Code P-QFP256-28x28-0.40 RENESAS Code PRQP0256LA-A Previous Code FP-256F/FP-256FV MASS[Typ.] 5.4g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 192 129 193 128 HE b1 Reference Symbol

QFP256

Abstract: SO 42 P PQFP-256 PQFP256 P-QFP256-2840-0
Contextual Info: P-QFP256-2840-0.50 Unit« nn 42. 6±0. 2 40. 0±0. 2 204 129 >- • in O J_ 205 !?!?!?!?!?!?!W!?!?!?!?!?!?!?!? 128 !?!?!?!?!?!?!W!?!?!?!?!?!?!?!? o o +i o 00 +1

Contextual Info: QFP296—P—32 32 —0,40 Unii;! nn Jan,2007

Contextual Info: MN103004J , MN103004K , MN103016K Type MN103004J MN103004K MN103016K Command ROM x× 64-bit 192 K-byte 256 K-byte 256 K-byte 4 K-byte 10 K-byte 10 K-byte QFP208-P-2828F *Pb free (QFP208-P-2828A) QFP208-P-2828F *Pb free FLGA239-C-1313 (QFP208-P-2828A) FLGA239-C-1313

QFP272

Contextual Info: QFP272-P-3636-0.50-BK4 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Cu アロイ 半田メッキ (≥5µm) 9.96 TYP. 2 版/96.11.28

QFP208-P-2828-0

Abstract: QFP208-P
Contextual Info: QFP208-P-2828-0.50-BK4 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Cu アロイ 半田メッキ(≥5µm) 5.65 TYP. 2 版/96.11.28

Contextual Info: Uniti m G-QFP208-2828-0.50 Feb.2003