QFE44SE Search Results

CA-QFE44SE-L-Z-T-01

Abstract: SF-QFE44SE-L-01
Contextual Info: 0.100 Typ. 2.000 Top View 2.500 3 1.2" assembled 1 2 See SF-QFE44SE-L-01 1 Side View 2 3 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact materialBeCu; finish 10µ" Au over 100µ" Ni (min.)

Contextual Info: 22.15mm [0.872"] 22.15mm [0.872"] Orientations: Top Views Top View PLCC QFP 12.7mm [0.500"] 1 3 7.1mm [0.280"] assembled 2 Side View 0.8 mm pitch Typ. 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2 oz.] Cu clad. SnPb plating.

R50-E2Y2-24

Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
Contextual Info: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.

Contextual Info: 35.56mm [1.400"] Orientations: Top Views PLCC QFP 35.56mm [1.400"] 2.54mm [0.100"] pitch typ. Top View 4 17.16mm [0.676"] 1 19.08mm [0.751"] assembled 3 6.35mm [0.250"] 0.8mm [0.031"] pitch typ. 2 0.46mm [0.018"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

QFJ-144

Contextual Info: Ironwood Electronics Appendix Pages AP-C.1 APPENDIX C • QFP Chip Package Specifications – Metric . . .page AP-C.2 thru AP-C.5 • QFP Chip Package Specifications – English . . . . . . . . . . . . .page AP-C.6 PO Box 21151, St Paul, MN 55121 • USA • Tel: 800 404-0204 • (651) 452-8100 • Fax:(651) 452-8400