sol 4011 be
Contextual Info: A fa Preliminary Specification High Reliability Semiconductor Attenuator PIN Diode Chip_ MA47406 M aann A M P co m pany V1.00 Features • • • • • Package Outline Glass Passivation Thermocompression bondable Thermosonically bondable
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HA 4016
Abstract: nia4
Contextual Info: ML46580S-992 I M/A-COM Preliminary Specifications High Reliability Semiconductor - Beam Lead Gallium Arsenide Tuning Varactor Diode Features • • • • • M n r - & Microwave Products Package Outline Constant Gamma o f 1.25 Strong Beam Construction Low Parasitic Capacitance
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ml46580s-992l46580s-992ma46580-46584ma46585-46589+2ha 4016nia4
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DNA-H-93-140
Abstract: DNA-H-95-61 e1309 JEP133 transistor 2N2222 F1262 FOTP-64 MOSFET DOSIMETER sensor 3414 cobalt-60
Contextual Info: N RADIATION OWNER’S MANUAL – RHA-Related Documents Military Performance Specifications 19500 – General Specification for Semiconductor Devices 38534 – Performance Specifications for Hybrid Microcircuits 38535 – General Specification for Intregrated Circuits Microcircuits Manufacturing
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p1156pss-01-609heisen9929dna-h-93-140+9dna-h-95-61e1309jep133transistor 2n2222f1262fotp-64mosfet dosimetersensor 3414cobalt-60
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INCOMING RAW MATERIAL INSPECTION chart
Abstract: INCOMING RAW MATERIAL INSPECTION Sample form for INCOMING Inspection of RAW MATERIAL SMD MARKING CODE l6 MATRA MHS INCOMING RAW MATERIAL INSPECTION method smd CODE L4 INCOMING MATERIAL FLOW PROCESS
Contextual Info: Quality Flows Digital ICs Products This document presents the flows used in manufacturing and screening of TEMIC Digital ICs Microcontrollers, Memories, ASICs and ASSPs . Process Control As shown in the following tables, each device is constructed by manufacturing processes which are under
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168h/125240h/125incoming raw material inspection chartincoming raw material inspection+6sample form for incoming inspection of raw materialsmd marking code l6matra mhsincoming raw material inspection methodsmd code l4incoming material flow process
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tk 19 209
Abstract: atmel 0635 IC MC 14017 B
Contextual Info: jflmëE W IR E L E S S * i/C Packaging and Packing Information Atmel Wireless & Microcontrollers Standard Bar-Code Labels The Atmel Wireless & Microcontrollers standard bar-code labels are printed at final packing areas. The labels are on each packing unit and contain Atmel Wireless & Microcontrollers’ specific data.
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u60432800pcs19v20010129528448ob-2l1ic284480b-2l+3tk 19 209atmel 0635ic mc 14017 b
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CD 4016 ic testing method
Abstract: MA46589
Contextual Info: ML46580S-992 M/A-COM Preliminary Specifications High Reliability Semiconductor - Beam Lead Gallium Arsenide Tuning Varactor Diode Features • • • • • Package Outline Constant Gamma of 1.25 Strong Beam Construction Low Parasitic Capacitance High Q
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ml46580s-992ma46580-46584ma46585-46589cd 4016 ic testing method+1ma46589
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sol 4011 be
Contextual Info: 1_ Preliminary Specification High Reliability Semiconductor Attenuator PIN Diode Chip MA47406 V1.00 Features • • • • • Package Outline Glass Passivation Therm ocom pression bondable Thermosonically bondable Gold metallisation
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PSS016
Abstract: TK S014 S020
Contextual Info: M ä. W I R E L E S S & fiC New Atmel Wireless & Microcontrollers Standard Type Suffix for ICs I £]□□□□□□□□□□□□□ □ Atmel Wireless & Microcontrollers identifier: 1 digit Conditioning: 1 digits Device type: up to 11 digits Package:
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dip14dip18dip22dip40+9sdip28sdip30sdip40s016lss016ss020pss016tk s014s020
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LTPD
Abstract: JTS68020 127C256 UA7805 JTS68564 i27C64 UA7805 thomson IUA741 TS68882
Contextual Info: THOMSON MIL ET SPATIAUX ETE D • iD2bö?5 DGDDGMT S ■ THOMSON COMPOSANTS MILITAIRES ET SPATIAUX is offering a large range of linears, microprocessors, ASICs and CCDs products in die form. These dice are available in a variety of quality classes. OPERATIONAL AMPLIFIERS
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jlf155jlf156jlf157jlm108+15jlm108ajlm124jlm146ilm148jlm1581lm1b58ltpdjts68020127c256ua7805jts68564i27c64ua7805 thomsoniua741ts68882
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construction of varactor diode
Abstract: varactor diode q factor measurement ML46580S-992 varactor diode capacitance measurement testing of varactor diode MP3021-001 MA46589 5010 varactor symbol of varactor diode and equivalent circuit varactor high power
Contextual Info: Beam Lead Gallium Arsenide Tuning Varactor Diode ML46580S-992 ML46580S-992 Preliminary Specifications High Reliability Semiconductor – Beam Lead Gallium Arsenide Tuning Varactor Diode Features • • • • • Package Outline Constant Gamma of 1.25 Strong Beam Construction
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ml46580s-992ma46585ma46580ma46580-46584+10ma46585-46589construction of varactor diodevaractor diode q factor measurementvaractor diode capacitance measurementtesting of varactor diodemp3021-001ma465895010 varactorsymbol of varactor diode and equivalent circuitvaractor high power
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PIN Diode chip
Contextual Info: Attenuator PIN Diode Chip ML47406-S-132 ML47406-S-132 Preliminary Specifications High Reliability Semiconductor Attenuator PIN Diode Chip Features • • • • • Package Outline Glass Passivation Thermocompression bondable Thermosonically bondable Gold metallisation
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ml47406-s-132ml47406-132pss-01-608ml47406+4ma474066091a100mapin diode chip
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TBA 261
Abstract: DIP40 weight TBA 480 silver epoxy MLF48 MLF-28 copper bond wire ti 980
Contextual Info: ¿ M M el M « W I R E L E S S S f iC Contents o f an IC in Plastic Package DIP DIP 300 mil Figure 1. DIPI 6 case Component M old Content / CAS-No. Content 7631-86-9 E - 132-0000 1309-64-4 7726-95-6 S i0 2 Epoxy resin Sb (as antimony trioxide) *> Br (no TBA) *»
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tba 261dip40 weighttba 480silver epoxy+4mlf48mlf-28copper bond wireti 980
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