PSC4000 Search Results

Contextual Info: PSC Vishay Electro-Films RF Spiral Inductor for Wire Bonded Assemblies FEATURES • Wire bond assembly • Small size: 45 mils x 45 mils x 10 mils • Low DCR, high Q • Low parasitic capacitance, high SRF APPLICATIONS • RF choking for DC biasing • RF tuning circuits

Contextual Info: PSC Vishay Electro-Films RF Spiral Inductor for Wire Bonded Assemblies FEATURES • Wire bond assembly • Small size: 45 mils x 45 mils x 10 mils • Low DCR, high Q • Low parasitic capacitance, high SRF APPLICATIONS • RF choking for DC biasing • RF tuning circuits

Contextual Info: PSC Vishay Electro-Films RF Spiral Inductor for Wire Bonded Assemblies FEATURES • Wire bond assembly • Small size: 45 mils x 45 mils x 10 mils • Low DCR, high Q • Low parasitic capacitance, high SRF APPLICATIONS • RF choking for DC biasing • RF tuning circuits

power inductor markings

Contextual Info: PSC Vishay Electro-Films RF Spiral Inductor for Wire Bonded Assemblies FEATURES • Wire bond assembly • Small size: 45 mils x 45 mils x 10 mils • Low DCR, high Q • Low parasitic capacitance, high SRF APPLICATIONS • RF choking for DC biasing • RF tuning circuits

Contextual Info: PSC www.vishay.com Vishay Electro-Films High Frequency RF Spiral Inductor for Wire Bonded Assemblies FEATURES • Wire bond assembly • Small size: 45 mils x 45 mils x 10 mils • Low DCR, high Q • Low parasitic capacitance, high SRF APPLICATIONS • RF choking for DC biasing

RT 2070 L

Abstract: ansi y14.5m-1982 decimal 2097b MS-001 72741
Contextual Info: PACKAGE DIAGRAM OUTLINES PLASTIC DIP R E V ISIO N S DCN REV DESCRIPTION DATE 27853 06 REDRAW TO JEDEC FORMAT 03/15/95 APPROVED A A A — I— - E - - .0S0/.070 A I * 1 .01 0 I H lAdXBSX 1 1 - j- GlAUL HLANL It bad l-A -l SEATING PIANE