PS256X32 Search Results

Contextual Info: 8 Megabit CMOS SRAM DENSE PAC D PS256X32 L/DPS2 56X32W/D PS2 56X32W A MiCROSYSTEM S DESCRIPTION: The D PS2 5 6 X 3 2 L/D PS2 5 6 X 3 2 W /D PS2 5 6 X 3 2 W A is a 256K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance

Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS SRAM PS256X32V3 DESCRIPTION: The D PS256X32V 3 "V E R S A -ST A C K ” module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO mounted on a co-fired ceramic substrate. It offers 8

Contextual Info: DENSE-PAC 8 Megabit CMOS SRAM MICROSYSTEMS PS256X32L/PS256X32W D ES C R IP T IO N : T he D PS256X32L/PS256X32W is a 256K x 32 high density, high-speed Static Random Access Memory SRAM m odule, intended for high performance computers and digital signal processing applications.

Contextual Info: DENSE-PAC 8 Megabit High Speed CMOS SRAM M ICRO S YSTEM S PS256X32CV3/D PS256X32BV3 DESCRIPTION: The PS256X32CV3/PS256X32BV3 "VER SA-STAC K” module is a revolutionary new high speed m em ory subsystem using Dense-Pac Microsystems’ ceramic Stackable Lead less Chip Carriers SLCC mounted

Contextual Info: □PM PS256X32V3 Dense-Pac Microsystems, Inc. O C E R A M IC 256K X 32 C M O S S R A M VERSA-STACK PRELIMINARY DESCRIPTION: The D PS256X32V3 "VER SA -STA C K " module is a re v o lu tio n a ry n ew m em o ry sub system using Dense-Pac Microsystems' ceramic Stackable Leadless

180x32

Contextual Info: DENSE-PAC 8 Megabit CMOS SRAM M ICROSYST E M S PS256X32V3 DESCRIPTION: The D PS256X32V3 "V E R S A -S T A C K ” m odule is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 8

A1048

Abstract: 1431 T WE 251
Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS SRAM DPS256 X 3 2 L/DPS256 X 32 W D ESC RIPTIO N : The D PS256X32L/D PS256X32W is a 256K x 32 high density, high-speed Static Random Access M em ory SRAM module, intended for high performance computers and digital signal

A16E

Contextual Info: PS256X32V3 □PM Dense-Pac Microsystems, Inc. CERAMIC 256K X 32 CM O S SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The D PS256X32V3 "VERSA-STACK" m od ule is a re v o lu tio n a r y n e w m e m o ry s u b s y s te m u s in g Dense-Pac M icrosystem s' ceram ic Stackable Leadless

jedec 64-pin simm

Abstract: Dense pac
Contextual Info: 8 Megabit CMOS SRAM DENSE PAC D PS256X32 L/DPS2 56X32W/D PS2 56X32W A MiCROSYSTEM S DESCRIPTION: The D PS2 5 6 X 3 2 L/D PS2 5 6 X 3 2 W /D PS2 5 6 X 3 2 W A is a 256K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance

PS1M

Abstract: 36PIN 32 PIN
Contextual Info: R E F E R E N C E SIZE SHAM PART N U M B E R 4 Megabit 6 Megabit 8 Megabit 9 Megabit SIZE \ I O R G A N IZ A T IO N SPEED ns 256Kx8 25, 35, 45, 55, 70 32-Pin DIP 47 32-Pin 32-Pin 36-Pin 36-Pin SOJ SOL SOJ SOL 53 PACKAG E PAGE I I' K ( ) I ) 11 ( I DPS256S8AP