4000H-7FFFH
Abstract: ST16F48 ISO7816-3 T1
Contextual Info: ST72411 HOW TO USE THE ST72411 DEMOBOARD 1 THE ST72411R1 MICROCONTROLLER The ST72411R1 is an 8-bit flash microcontroller with a Smartcard interface, an LCD driver, an 8-bit timer with 4k program memory, an LVD, 3 power saving modes, 5 I/Os for ISO7816_3 Smartcard interface.
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st72411st72411r1iso7816dl2032+34000h-7fffhst16f48iso7816-3 t1
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SMARTCARD connector
Abstract: ST16F48 dl2032 ISO7816 ST72411R1 proton atr
Contextual Info: APPLICATION NOTE HOW TO USE THE ST72411 DEMOBOARD by Microcontroller Division Applications 1 THE ST72411R1 MICROCONTROLLER The ST72411R1 is an 8-bit flash microcontroller with a Smartcard interface, an LCD driver, an 8-bit timer with 4k program memory, an LVD, 3 power saving modes, 5 I/Os for ISO7816_3
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st72411st72411r1iso7816dl2032+3smartcard connectorst16f48proton atr
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R7600-M64
Abstract: S10362-11-100C circuit diagram of a laser lighter
Contextual Info: NEWS 02 2008 SOLID STATE PRODUCTS PAGE 9 New Si PIN photodiodes S10783 and S10784 SOLID STATE PRODUCTS Red LED for POF Data Communications PAGE 10 ELECTRON TUBE PRODUCTS 75W Xenon Lamp Series PAGE 28 SYSTEMS PRODUCTS Cooled CCD Camera ORCA-R2 PAGE 38 Highlights
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s10783s10784p2211de128228814+3r7600-m64s10362-11-100ccircuit diagram of a laser lighter
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XR2206 application notes
Abstract: XR-2216 fsk modulation and demodulation using Xr2206 XR-2208 XR2206 pin details for function generator xr2206 application XR2240 XR-2206 CIRCUIT IC XR 2240 applications xR-2208
Contextual Info: Introduction This semi-custom IC design brochure contains a complete outline and summary o f Exar’s unique semi-custom IC design, development, and production program and capabilities. This technique, which was pioneered by Exar, offers a unique and effective method o f manufacturing an almost unlimited
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xr2206 application notesxr-2216fsk modulation and demodulation using xr2206xr-2208+6xr2206 pin details for function generatorxr2206 applicationxr2240xr-2206 circuitic xr 2240applications xr-2208
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Power MOSFET TT 2146
Contextual Info: Fusion Family of Mixed-Signal Flash FPGAs Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and
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equivalent of transistor tt 2146
Abstract: mosfet TT 2146 JESD 201 class 1A crystal transistor TT 2146 Power MOSFET TT 2146
Contextual Info: Fusion Family of Mixed-Signal Flash FPGAs Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and
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equivalent of transistor tt 2146mosfet tt 2146jesd 201 class 1a crystaltransistor tt 2146+1power mosfet tt 2146
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flashpro3 schematic
Abstract: TTL XOR2 LVCMOS15 kt 501
Contextual Info: 2 – Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP
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flashpro3 schematicttl xor2lvcmos15kt 501 |
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Power MOSFET TT 2146
Abstract: equivalent of transistor tt 2148 zener diode A39 Libero LVPECL multidrop
Contextual Info: Advanced v0.5 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits – High Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program When Powered-Off
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130-nm32-bitpower mosfet tt 2146equivalent of transistor tt 2148+3zener diode a39liberolvpecl multidrop
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B 834 Y
Abstract: uA 741 NC 2N2222 ADG839 LVCMOS15 RAM51 KT 907 ST 1076
Contextual Info: 2 – Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP
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b 834 yua 741 nc2n2222adg839+4lvcmos15ram51kt 907st 1076
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flashpro3 schematic
Abstract: LVCMOS15
Contextual Info: 2 – Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP
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Transistor Equivalent TT 2142
Abstract: Power MOSFET TT 2146 SCHEMATIC DIAGRAM monitor LG t17 jc 108PIN proton rx 3000 B44 transistor AFS090
Contextual Info: Advanced v0.6 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits – High Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program When Powered-Off
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130-nm32-bittransistor equivalent tt 2142power mosfet tt 2146+5schematic diagram monitor lg t17 jc108pinproton rx 3000b44 transistorafs090
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Contextual Info: Advanced v0.4 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits – High Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program When Powered-Off
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Contextual Info: Advanced v0.7 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits – High Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program When Powered-Off
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Power MOSFET TT 2146
Abstract: equivalent of transistor tt 2148 DIODE 809 a39 zener diode
Contextual Info: Advanced v0.3 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits – High Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program When Powered-Off
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130-nm32-bitpower mosfet tt 2146equivalent of transistor tt 2148+2diode 809a39 zener diode
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F5 DIODE
Abstract: class AB2 push pull power amplifier
Contextual Info: Advanced v0.9 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process
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130-nm32-bit12-bitf5 diode+1class ab2 push pull power amplifier
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equivalent ZO 607
Abstract: JESD 201 class 1A crystal k 1058 mosfet
Contextual Info: Advanced v0.8 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process
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130-nm32-bit12-bitequivalent zo 607+2jesd 201 class 1a crystalk 1058 mosfet
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k 1058 mosfet
Abstract: proton rx 3000 2n3904 h16 yc 428 transistor cx 472
Contextual Info: Advanced v0.8 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process
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actel smart fusion
Contextual Info: Preliminary v0.4 Actel Fusion Mixed-Signal FPGA for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits • Targeted to Advanced Mezzanine Card AdvancedMC Designs • Designed in Partnership with MicroBlade • 8051-Based Module Management Controller (MMC)
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8051-basedactel smart fusion |
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TRANSISTOR KT 838
Abstract: transistor part number 2N2222A 338 2N2222A 2n2222 -331 2n2222 h 331 datasheet
Contextual Info: Revision 0 Actel Extended Temperature Fusion Family of Mixed Signal FPGAs Features and Benefits • Extended Temperature Tested • Each Device Tested from –55°C to 100°C Junction Temperature High-Performance Reprogrammable Flash Technology • • •
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Contextual Info: Advanced v0.1 Actel Fusion Programmable System Chips for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits On-Chip Clocking Support Targeted to Advanced Mezzanine Card AdvancedMC Designs Designed in Partnership with MicroBlade 8051-Based Module Management Controller (MMC)
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Core8051
Abstract: U1AFS600-FG256 FlashPro3 flashpro3 schematic AES-128 FG256 PQ208 gaa 716 kt 501 PUSH PULL MOSFET DRIVER dip
Contextual Info: Preliminary v0.4 Actel Fusion Mixed-Signal FPGA for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits • Targeted to Advanced Mezzanine Card AdvancedMC Designs • Designed in Partnership with MicroBlade • 8051-Based Module Management Controller (MMC)
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8051-based130-nm32ostcore8051+9u1afs600-fg256flashpro3flashpro3 schematicaes-128fg256pq208gaa 716kt 501push pull mosfet driver dip
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TBD 234 V12
Abstract: ACM 944 motor IG 2200 19 X 000 15 R
Contextual Info: Advanced v1.2 Actel Fusion Programmable System Chips Mixed-Signal Family with Optional ARM® Support Features and Benefits Low Power Consumption • • High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process
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zo 103 ma 75 607
Contextual Info: Advanced v1.6 Actel Fusion Mixed-Signal FPGAs ® with Optional ARM® Support Features and Benefits Low Power Consumption • • High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program when Powered Off
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Contextual Info: Revision 2 Extended Temperature Fusion Family of Mixed Signal FPGAs Features and Benefits • Extended Temperature Tested • Each Device Tested from –55°C to 100°C Junction Temperature High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process
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