Part Number
    Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    PROTON ATR Search Results

    PROTON ATR Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    4000H-7FFFH

    Abstract: ST16F48 ISO7816-3 T1
    Contextual Info: ST72411 HOW TO USE THE ST72411 DEMOBOARD 1 THE ST72411R1 MICROCONTROLLER The ST72411R1 is an 8-bit flash microcontroller with a Smartcard interface, an LCD driver, an 8-bit timer with 4k program memory, an LVD, 3 power saving modes, 5 I/Os for ISO7816_3 Smartcard interface.


    Original
    ST72411 ST72411 ST72411R1 ISO7816 DL2032) 4000H-7FFFH ST16F48 ISO7816-3 T1 PDF

    SMARTCARD connector

    Abstract: ST16F48 dl2032 ISO7816 ST72411R1 proton atr
    Contextual Info: APPLICATION NOTE HOW TO USE THE ST72411 DEMOBOARD by Microcontroller Division Applications 1 THE ST72411R1 MICROCONTROLLER The ST72411R1 is an 8-bit flash microcontroller with a Smartcard interface, an LCD driver, an 8-bit timer with 4k program memory, an LVD, 3 power saving modes, 5 I/Os for ISO7816_3


    Original
    ST72411 ST72411R1 ISO7816 DL2032) SMARTCARD connector ST16F48 dl2032 proton atr PDF

    R7600-M64

    Abstract: S10362-11-100C circuit diagram of a laser lighter
    Contextual Info: NEWS 02 2008 SOLID STATE PRODUCTS PAGE 9 New Si PIN photodiodes S10783 and S10784 SOLID STATE PRODUCTS Red LED for POF Data Communications PAGE 10 ELECTRON TUBE PRODUCTS 75W Xenon Lamp Series PAGE 28 SYSTEMS PRODUCTS Cooled CCD Camera ORCA-R2 PAGE 38 Highlights


    Original
    S10783 S10784 P2211 DE128228814 R7600-M64 S10362-11-100C circuit diagram of a laser lighter PDF

    XR2206 application notes

    Abstract: XR-2216 fsk modulation and demodulation using Xr2206 XR-2208 XR2206 pin details for function generator xr2206 application XR2240 XR-2206 CIRCUIT IC XR 2240 applications xR-2208
    Contextual Info: Introduction This semi-custom IC design brochure contains a complete outline and summary o f Exar’s unique semi-custom IC design, development, and production program and capabilities. This technique, which was pioneered by Exar, offers a unique and effective method o f manufacturing an almost unlimited


    OCR Scan
    PDF

    Power MOSFET TT 2146

    Contextual Info: Fusion Family of Mixed-Signal Flash FPGAs Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and


    Original
    PDF

    equivalent of transistor tt 2146

    Abstract: mosfet TT 2146 JESD 201 class 1A crystal transistor TT 2146 Power MOSFET TT 2146
    Contextual Info: Fusion Family of Mixed-Signal Flash FPGAs Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and


    Original
    PDF

    flashpro3 schematic

    Abstract: TTL XOR2 LVCMOS15 kt 501
    Contextual Info: 2 – Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP


    Original
    PDF

    Power MOSFET TT 2146

    Abstract: equivalent of transistor tt 2148 zener diode A39 Libero LVPECL multidrop
    Contextual Info: Advanced v0.5 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits – High Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program When Powered-Off


    Original
    130-nm, 32-Bit Power MOSFET TT 2146 equivalent of transistor tt 2148 zener diode A39 Libero LVPECL multidrop PDF

    B 834 Y

    Abstract: uA 741 NC 2N2222 ADG839 LVCMOS15 RAM51 KT 907 ST 1076
    Contextual Info: 2 – Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP


    Original
    PDF

    flashpro3 schematic

    Abstract: LVCMOS15
    Contextual Info: 2 – Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP


    Original
    PDF

    Transistor Equivalent TT 2142

    Abstract: Power MOSFET TT 2146 SCHEMATIC DIAGRAM monitor LG t17 jc 108PIN proton rx 3000 B44 transistor AFS090
    Contextual Info: Advanced v0.6 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits – High Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program When Powered-Off


    Original
    130-nm, 32-Bit Transistor Equivalent TT 2142 Power MOSFET TT 2146 SCHEMATIC DIAGRAM monitor LG t17 jc 108PIN proton rx 3000 B44 transistor AFS090 PDF

    Contextual Info: Advanced v0.4 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits – High Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program When Powered-Off


    Original
    130-nm, 32-Bit PDF

    Contextual Info: Advanced v0.7 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits – High Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program When Powered-Off


    Original
    130-nm, 32-Bit PDF

    Power MOSFET TT 2146

    Abstract: equivalent of transistor tt 2148 DIODE 809 a39 zener diode
    Contextual Info: Advanced v0.3 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits – High Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program When Powered-Off


    Original
    130-nm, 32-Bit Power MOSFET TT 2146 equivalent of transistor tt 2148 DIODE 809 a39 zener diode PDF

    F5 DIODE

    Abstract: class AB2 push pull power amplifier
    Contextual Info: Advanced v0.9 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process


    Original
    130-nm, 32-Bit 12-Bit F5 DIODE class AB2 push pull power amplifier PDF

    equivalent ZO 607

    Abstract: JESD 201 class 1A crystal k 1058 mosfet
    Contextual Info: Advanced v0.8 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process


    Original
    130-nm, 32-Bit 12-Bit equivalent ZO 607 JESD 201 class 1A crystal k 1058 mosfet PDF

    k 1058 mosfet

    Abstract: proton rx 3000 2n3904 h16 yc 428 transistor cx 472
    Contextual Info: Advanced v0.8 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process


    Original
    130-nm, 32-Bit 12-Bit k 1058 mosfet proton rx 3000 2n3904 h16 yc 428 transistor cx 472 PDF

    actel smart fusion

    Contextual Info: Preliminary v0.4 Actel Fusion Mixed-Signal FPGA for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits • Targeted to Advanced Mezzanine Card AdvancedMC Designs • Designed in Partnership with MicroBlade • 8051-Based Module Management Controller (MMC)


    Original
    8051-Based actel smart fusion PDF

    TRANSISTOR KT 838

    Abstract: transistor part number 2N2222A 338 2N2222A 2n2222 -331 2n2222 h 331 datasheet
    Contextual Info: Revision 0 Actel Extended Temperature Fusion Family of Mixed Signal FPGAs Features and Benefits • Extended Temperature Tested • Each Device Tested from –55°C to 100°C Junction Temperature High-Performance Reprogrammable Flash Technology • • •


    Original
    130-nm, 32-Bit 12-Bit TRANSISTOR KT 838 transistor part number 2N2222A 338 2N2222A 2n2222 -331 2n2222 h 331 datasheet PDF

    Contextual Info: Advanced v0.1 Actel Fusion Programmable System Chips for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits On-Chip Clocking Support Targeted to Advanced Mezzanine Card AdvancedMC Designs Designed in Partnership with MicroBlade 8051-Based Module Management Controller (MMC)


    Original
    8051-Based 130-nm, 32-Bit 12-Bit PDF

    Core8051

    Abstract: U1AFS600-FG256 FlashPro3 flashpro3 schematic AES-128 FG256 PQ208 gaa 716 kt 501 PUSH PULL MOSFET DRIVER dip
    Contextual Info: Preliminary v0.4 Actel Fusion Mixed-Signal FPGA for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits • Targeted to Advanced Mezzanine Card AdvancedMC Designs • Designed in Partnership with MicroBlade • 8051-Based Module Management Controller (MMC)


    Original
    8051-Based 130-nm, 32ost Core8051 U1AFS600-FG256 FlashPro3 flashpro3 schematic AES-128 FG256 PQ208 gaa 716 kt 501 PUSH PULL MOSFET DRIVER dip PDF

    TBD 234 V12

    Abstract: ACM 944 motor IG 2200 19 X 000 15 R
    Contextual Info: Advanced v1.2 Actel Fusion Programmable System Chips Mixed-Signal Family with Optional ARM® Support Features and Benefits Low Power Consumption • • High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process


    Original
    130-nm, 32-Bit 12-Bit TBD 234 V12 ACM 944 motor IG 2200 19 X 000 15 R PDF

    zo 103 ma 75 607

    Contextual Info: Advanced v1.6 Actel Fusion Mixed-Signal FPGAs ® with Optional ARM® Support Features and Benefits Low Power Consumption • • High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program when Powered Off


    Original
    130-nm, 32-Bit 12-Bit zo 103 ma 75 607 PDF

    Contextual Info: Revision 2 Extended Temperature Fusion Family of Mixed Signal FPGAs Features and Benefits • Extended Temperature Tested • Each Device Tested from –55°C to 100°C Junction Temperature High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process


    Original
    130-nm, 32-Bit 12-Bit PDF