PROPERTIES OF USED MATERIALS Search Results

olin 7025

Abstract: Tamac4 TAMAC-4 7025 alloy lead frame CDA 194 sn 8400 eftec eftec-64t C10B4 tamac
Contextual Info: CHAPTER 5 SELECTED PROPERTIES OF IC PACKAGE MATERIALS The following tables list typical values for selected properties of materials used in IC packages Table 5-1 Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Units

pure tin recommended reflow profile

Abstract: J-STD-020B JESD22-A113-D 82602
Contextual Info: VISHAY Vishay Semiconductors Properties of Encapsulant When assembling IrDC transceivers on a printed circuit board PCB , it is useful to have an understanding of the properties of the materials used during manufacturing. While IrDC transceivers use semiconductor dice and

Material density CDA 195

Abstract: eutectic 157 CDA 194 olin 7025 Eftec 64t X10-4 resistivity table sn 8400 MF202 silver
Contextual Info: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-9 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Alumina

olin 7025

Abstract: 7025 alloy lead frame CDA 194 X10-4 eftec-64t Eftec 64t resistivity table sn 8400 PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS
Contextual Info: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-3 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Units

olin 7025

Abstract: eftec MPA 68 Eftec 64t sn 8400 7025 alloy lead frame resistivity table eftec-64t tamac X10-4
Contextual Info: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-3 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Alumina

Contextual Info: VISHAY ▼ Vishay Telefunken Properties of Encapsutant When assembling IrDC transceivers, it is useful to have an understanding of the properties of the materials used in their consruction. It is often not realised that although IrDC transceivers use semiconductor chips there

Plastic Valox 420 SEO

Contextual Info: DETAILED PROPERTIES OF MILL-MAX RAW MATERIALS including RoHS 2002/95/EC requirements PROPERTIES OF METALS USED BY MILL-MAX Copper alloy rod and wire for precision-machined pins, receptacles & solder terminals (Alloys C36000 & C54400 contain 3 to 4% lead to

Contextual Info: DETAILED PROPERTIES OF MILL-MAX RAW MATERIALS including RoHS 2002/95/EC requirements PROPERTIES OF METALS USED BY MILL-MAX Copper alloy rod and wire for precision-machined pins, receptacles & solder terminals (Alloys C36000 & C54400 contain 3 to 4% lead to

Surface Mount Assembly Instruction

Abstract: surface
Contextual Info: Surface Mount Assembly Instruction Vishay Semiconductors Soldering Process When assembling IrDC transceivers on a printed circuit board PCB , it is useful to have an understanding of the properties of the materials used during manufacturing. While IrDC transceivers use semiconductor dice

Properties of used Materials

Contextual Info: Technical Annex Properties of used Materials Material Product Temperature Resistance Short-Term Constant Min. Temp. Temperature Range to Maintain IP Rating Flammability Rating acc. to DIN EN 60695 UL 94 VDE 0471 Polystyrene, flame resistant, impact resistant

OC-106 94V0 C

Abstract: olin 7025 CDA 194 Tamac4 eftec 7025 alloy lead frame sn 8400 Au Sn eutectic thermal conductivity Eftec 64t
Contextual Info: 2 5 Physical Constants of IC Package Materials 1/16/97 3:41 PM CH05WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 5 PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS The Table 5-1 through Table 5-5 list typical values for selected properties of materials used in

5978008001

Abstract: 5978015901 5978014001 5978017501
Contextual Info: 15th Edition 106 Toroids A ring configuration provides the ultimate utilization of the intrinsic ferrite material properties. Toroidal cores are used in a wide variety of applications such as power input filters, ground-fault interrupters, common-mode filters

AE 920 B

Abstract: 5961000211
Contextual Info: A ring configuration provides the ultimate utilization of the intrinsic ferrite material properties. Toroidal cores are used in a wide variety of applications such as power input filters, ground-fault interrupters, common-mode filters and in pulse and broadband transformers.

Contextual Info: Commercial Chip - C0G 16Vdc to 10kVdc A range of commercial MLC chip capacitors in Ultra stable EIA Class I C0G, or NP0, dielectric. C0G chips are used in precision circuitry requiring Class I stability and exhibit linear temperature coefficient, low loss and stable electrical properties with time,

MIL-C-47113

Abstract: t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P
Contextual Info: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal

Contextual Info: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal

deltabond

Abstract: Wakefield 120-320 152-1B thermal conductivity 175-6-220-P
Contextual Info: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of

Contextual Info: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of

Wakefield 120-320

Contextual Info: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of

HIOKI 3119

Abstract: CSL-Z7302 EIA-383 JESD625-a ESD test plan JESD625 so20w CZE1000R jedec JESD625-a K6911
Contextual Info: Application Report SZZA027A - April 2002 Electrostatic Discharge ESD Protective Semiconductor Packing Materials and Configurations Cles Troxtell and James Huckabee Standard Linear & Logic ABSTRACT The Texas Instruments Standard Linear & Logic (SLL) Business Group uses an

fujitsu polymer

Abstract: gibbs phase rule applications 928523 compaq portable II benzene octane
Contextual Info: MOPA C 2000 Next generation quantum mechanics package • Macromolecules: very fast, patented, linear-scaling MOZYME optimizes proteins, DNA… · Materials: d-orbitals, crystals, geometry in electric fields, NLO, 2D/3D periodic boundaries… · Polymers: band structures, phonon spectra, Young’s modulus, tensile strength…

MIL-S-23586D

Abstract: polysulphides high volume potting and encapsulation tv flyback potting silicone
Contextual Info: Issued March 1997 232-4112 Data Pack K Data Sheet Silicone rubber compound A range of silicone materials designed for use in electronic applications. Silicone dielectric gel RS stock no. 494-950 Applications The adhesive quality of silicone dielectric gel together

Contextual Info: Microwave Absorbing Materials SOLUTIONS www.lairdtech.com Innovative Technology for a Connected World ABOUT LAIRD TECHNOLOGIES Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.

x band radar transmitters

Abstract: 6007 Graphite film material rfss INSERTS FOR COMPOSITE OR HONEYCOMB RFML 5301
Contextual Info: We practice environmental protection. MICROWAVE ABSORBING MATERIALS CAPABILITIES Microwave absorbers are increasingly being used to enhance shielding performance at higher frequencies. R&F Products, a division of Laird Technologies , offers a wide product range for the EMC design engineer.