DELTABOND Search Results

Contextual Info: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal

l 7251

Abstract: deltabond 152
Contextual Info: VED oc ZU 2003 DOCUMENT CONTRO' REVISIONS DESCRIPTION LETTER NO NOTES: 1. CAPACITANCE: 7 3 .8 - 9 0 .2 nF. 2 . DISSIPATION FACTOR: .0 0 5 MAX O 2 5 ’ C, 1 kHZ. DIELECITRIC WITHSTANDING VOLTAGE: 3. 7 .0 kV RATED 10.5 kV BU R N -IN FOR 2 HRS @ 100* C 14.0 kV PROOF FOR 5 SECONDS

657-10ABP

Abstract: 667-10ABPP TO220 HEATSINK 637-15ABPE 651b deltabond 152 XX1371 XX1703 657-25ABPNE 657-15ABPE
Contextual Info: 797-2012.qxp:QuarkCatalogTempNew 9/5/12 7:08 AM Page 797 7 Extrusions, Heat Sinks and Accessories XX1024 XX1371 ᭤ Aluminum Mfr.’s Type Extrusion Type Dimensions WxH×T Inches Nat. Conv. Qsa (°C/W) (1.312) (312) (1.335) (.090) (.190) (.375) (1.000)

Wakefield 120-320

Contextual Info: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of

deltabond 152

Abstract: deltabond
Contextual Info: REUc, vED M Ar 3 1995 DOnJMc NOTES: 1. DISSIPATION FACTOR: .0 0 5 MAX @ 25* C, 1 kHZ. 2 . CAPACITANCE: 45 n F - 5 5 nF. 3. DIELECTRIC WITHSTANDING VOLTAGE: 1.5 kV RATED, 2 .2 5 kV PROCESS FOR 2 HOURS @ 100* C AND 3 kV PROOF FOR 5 SECS. 4. GRIT BLAST FINISH, NO TAPE OVERWRAP.

deltabond

Abstract: Wakefield 120-320 152-1B thermal conductivity 175-6-220-P
Contextual Info: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of

T405R

Abstract: Chomerics* T405 BERGQUIST softface T410R intel 82495 Bergquist BP-108 intel 80486sx Intel 82495 Cache Controller 651b thermal printer 2 inch
Contextual Info: Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide

Wakefield Thermal Solutions TYPE 120

Abstract: Thermagon deltabond 152 ABLESTIK 84-1LMIT deltabond intel 8052 84-1LMIT EL75XX EL7556C EL7560C
Contextual Info: Application Note EL75XX Thermal Design Considerations Thermal Design Considerations EL75XX by Vijay Soman 1 0 Introduction The typical power applications requirement for microprocessors is either a VRM Voltage Regulator Module or a direct mother board solution

Contextual Info: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of

MIL-C-47113

Abstract: t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P
Contextual Info: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal

T405R

Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
Contextual Info: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink

Wakefield Thermal Solutions TYPE 120

Abstract: ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 TO38 Laser TO-44 204sb
Contextual Info: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION

ebonol

Abstract: Wakefield Thermal Solutions Wakefield Thermal Solutions TYPE 120 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 207AB TO38 Laser
Contextual Info: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION

FR10300N0200J

Abstract: UT-085 BLF645 2861002402 deltabond 152 UT-085C-15 transistor C103 c103 TRANSISTOR AN10953 C5750X7S2A106M
Contextual Info: AN10953 BLF645 10 MHz to 600 MHz 120 W amplifier Rev. 1 — 3 March 2011 Application note Document information Info Content Keywords BLF645, broadband Abstract The BLF645 is a 100 W, 32 V LDMOS RF power push-pull transistor for broadcast transmitter and industrial applications from HF to 1.4 GHz. This

deltabond 152

Abstract: ABLESTIK 84-1LMIT deltabond Wakefield Thermal Solutions TYPE 120 84-1LMIT heatsink catalogue intel 8052 laptop mother board Pentium "Voltage Regulator Module" POWERSOP2
Contextual Info: Thermal Design Considerations—EL75XX Application Note March 20, 1998 AN1096 Author: Vijay Soman Typical Applications Power Requirement Elantec's EL7560/EL7561/EL7556 series of voltage regulators are highly integrated, simple to use and the most effective switching mode designs to power microprocessors